Showing results: 736 - 748 of 748 items found.
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Macom Technology Solutions Holdings Inc.
MACOM offers high-performance linear equalizers for use in high speed copper connections for Ethernet, InfiniBand and Fibre Channel. The product line supports NRZ and PAM-4 multi-level signal connectivity and builds upon MACOM’s long-standing expertise in equalizers for broadcast video applications. The equalizers can support up to 112Gbps per lane data rates for 50 Gbps to 800 Gbps copper cable assemblies. In addition to copper cables, the linear equalizer can be used for wired backplane and on-board applications. Adding linear equalization to a passive copper cable can enable the same copper cable to carry higher data rates for longer distances. MACOM’s new linear equalizer product line can extend a typical copper cable’s performance to 7.5 meters at 56 Gbps and 5 meters at 112 Gbps data rates. Customers can consider active copper cables as an alternative to passive copper cables or active optical cables. Key benefits include low power consumption from a single 3.3V supply, low latency, hardware and microcontroller management modes. The products are suitable for SFP, QSFP, QSFP-DD and OSFP connector form factors.
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Model 5553 -
Pentek, Inc.
- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6003 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Model 5953 -
Pentek, Inc.
- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6003 QuartzXM- Model 6003 unique QuartzXM eXpress module enables migration to other form factorsPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products VideoLive Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boardsPipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoCSynchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPXPlease refer to the product datasheet for Installed FPGA IP Module details
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PX32101 -
LinkedHope Intelligent Technologies Co.,Ltd.
PX32101 is a 3U PXI-E system controller based on the newest Intel® Haswell platform. It is designed to provide comprehensive and reliable system controller to support hybrid PXIe-based systems for multiple environments test and measurement applications.Hybrid PXIe-based systems are often required to complete independent diversified complex testing tasks on the PXI test platform. PX32101 provides rich interfaces: 4 USB2.0 / 3.0 for peripheral connectivities; UART for communication or control equipment; dual 1000Base-T Ethernet, one port for LAN connection and the other one for the control of the next generation of LXI instruments. PX32101 can support 4 x4 or two PCIe x8-link, and up to 16GB / s system bandwidth. The ExpressCard 34 expansion slots on the front panel allow users to expand the system modules flexibly. If you install a hybrid multi-slot backplane in the system, then various standard PXI-E and PXI / CPCI peripheral cards could be fitted. In a multitasking environment, PX32101 processor is able to complete multiple tasks independently. The CPU and memory chips soldered with PCB increase reliability performance in shock and vibration environments. Combined with a variety of instrument control interfaces and reliable mechanical & electronic design, PX32101 can meet your hybrid PXIe-based testing for system application requirements perfectly.
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Model 5550 -
Pentek, Inc.
- Now available in RFSoC Gen 3 with the Model 5553- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development ChassisPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Model 5950 -
Pentek, Inc.
- Now available in RFSoC Gen 3 with the Model 5953- Multi-board synchronization with Quartz RFSoC video- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6001 QuartzXM- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX
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MIC-6311 -
Advantech Co. Ltd.
Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
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MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
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MIC-3396MIL -
Advantech Co. Ltd.
The MIC-3396MIL is specially design for ruggedized applications, and offers three different configurations that meet a wide range of environment requirements. Using 4th and 5th generation Intel® Core™ i5/i7 and Intel® Xeon® processors, it supports up to four cores / eight threads at 2.7GHz and 6MB last level cache. Ruggedized requirements are addressed by a conduction cooled design an extended operation temperature range (-40 ~ 85° C measured at wedge lock). Shock and vibration resistances of the board are increased by using wedge locks and a single-piece CNC-milled aluminum alloy plate that conforms to the major IC packages. With highly integrated functional capabilities, the MIC-3396MIL fully utilizes the I/O features of the Intel® chipsets. It supports maximum 16GB of 1600 MHz DDR3L RAM, an onboard 2.5" Serial ATA HDD or SSD, a CFast slot, for an onboard NAND flash (as optional), one PCIex16 and a set of I/O functions brought through the backplane to a unique rear transition module, which contains eight GPIOs, two USB 2.0 and four RS-232/422/485 console ports as pin headers, two SATA Gen III and two SATA Gen II as connectors, two/four LAN ports (two LAN ports are switchable form front panel to RTM), two DVI ports, two USB 3.0, one PCIex16, one P/S2 port and one RS-232/422/485 port on the front panel.
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MIC-6313 -
Advantech Co. Ltd.
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
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MIC-3398 -
Advantech Co. Ltd.
The MIC-3398 is a Low-Power 6U CompactPCI® CPU blade with best in class price/performance ratio tailored for applications that require a state of the art processor platform based on Intel® Architecture with full IO capability at an attractive cost point. The MIC-3398 supports Intel® Atom™ E3845 and Celeron N2930, J1900 SoC (system on a chip) family previously codenamed Bay trail with a maximum of quad-core 2.00 GHz processing performance. Intel® Atom™ technology provides significant increases in performance and energy efficiency by using the 22nm Intel® manufacturing process making it an ideal choice for control and workstation applications that require passive cooling with a power dissipation as low as 10W. Up to 8GB, dual channel 1333 MHz DDR3L memory with ECC support provide a high performance and robust memory interface for demanding applications. With built-in graphics based on Intel® HD Graphics Technology this blade offers a significant improvement in graphics performance compared to previous generation platforms. Support for an onboard 2.5” SATA-II drive as well as CFast SSDs adds comprehensive mass storage support. On the system side, the MIC-3398 supports 32-bit, 33MHz and 64-bit, 66MHz PCI bus interfaces to a CompactPCI backplane. A rich set of I/O interfaces such as DVI-D, USB3.0/2.0, Gigabit Ethernet and RS-232/422/485 ports round off the feature set. In addition to the single slot wide (4HP) board offering, a dual slot wide (8HP) version of the blade offers additional network connectivity by increasing Gigabit Ethernet port count from two to four.
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MIC-6030 -
Advantech Co. Ltd.
The MIC-6030 is a ruggedized single-slot 3U OpenVPX switch providing high-speed, low-latency interconnects between VPX blades connected to PCI Express and Ethernet backplane fabrics. An ExpressLane™ PEX8733 PCIe Gen3 switch connects to six PCIe Gen3 x4 ports enabling non-transparent and transparent bridging of processor blades for highly flexible multi-host and legacy configurations. A Marvell® Link Street® 88E6390X Ethernet layer 2 switch with VLAN support switches gigabit Ethernet traffic between VPX blades connected to the Ethernet fabric enabling a linerate control plane. When configured with optional Mellanox ConnectX®-4 Multi-Host™ Technology and drivers, the MIC-6030 enables high speed communication of up to 10Gbps bandwidth between up to 4 processor VPX blades VPX by transforming the PCIe bus into a programmable network interface, facilitating the development of data communication between boards and eliminating the need to program a more complex DMA interface. The onboard BMC firmware based on Advantech’s IPMI core technology brings an advanced set of system management features and can be customized when unique features are required. Lightweight switch management is available via the BMC, supporting tagged and untagged VLANs, port-based VLAN, and port status reporting. Advantech offers standard designs with either convection or conduction-cooling. A conduction-cooled heatsink ensures operation in harsher environments, providing a reliable solution for operation in extended temperatures, and where extreme shock and vibration requirements must be met. The MIC-6030 is compact, light and robust, meeting stringent size, weight, and power (SWAP) demands.
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CableEye HVX, HVX-21 -
CAMI Research Inc. (CableEye®)
Fast ● Simple ● Precise Advanced wiring analyzer scans for continuity (opens, shorts), miswires, resistance, capacitance, components (resistors, diodes, LEDs, capacitors) dielectric breakdown, insulation resistance, intermittent connections HVX (Item 829) 1500 Vdc, 1000 Vac HVX-21 (Item 829A) 2100 Vdc, 1200 Vac For diagnostic and Pass/Fail Testing — Permits expanded testing (compared to models in our low voltage product line) for insulation resistance (IRI) and dielectric breakdown (DWV). All CableEye testers are suitable for production, fault diagnosis, QC (Quality Control), assembly, and prototyping of standard or custom cables. Each combines test, fault location, design, documentation, labeling, and database storage in one instrument. Tests can be performed on long cables (with or without connectors) or no cables (e.g. connectors, backplanes, PCBs, components). Standard Features & Benefits:
- USB certified, PC-based tester for a versatile, fast, robust system with long life-cycle.
- Multilingual, dynamic, graphic-rich display (netlist & wiring schematic) provides clarity and speeds diagnostics.
- 128 Test Points, expandable to 1024 providing flexibility as your product line changes.
- User-selectable voltage to each connection group in the cable simplifies an otherwise complex process, accelerating testing.
- Programmable Ramp Up, Ramp Down, Dwell Time (same as Test Time), Trip Current, and Trip Delay (same as Soak Time) adds versatility.
- Current leakage detected during HV test phase provides a measure of insulation resistance up to 1 GΩ (HVX) and 5 GΩ (HVX-21) - any leakage current exceeding a preset limit reveals the presence of moisture, flux, or other contamination on exposed contacts.
- Real-time screening for intermittent connections for pinpointing elusive faults and improving quality.
- Automation scripting in a simple, intuitive language allowing non-programmers to reduce operator error by automating repetitive steps.
- Pop-Up Work Instructions. choose the exact amount of detail, imagery, language and automation you need to ensure your work instructions and tests are carried out flawlessly.
- Flexible tolerancing: optionally define as percentages or absolute terms, as well as asymmetrically (e.g. +0%/-10%) for improved yields.
- Barcode-tracking & archival data-logging to achieve error-proof test process and improved traceability & productivity.
- Print PASS/FAIL labels, test reports (with or without color wiring schematics/netlists) and log reports to satisfy ISO9000 reporting requirements.
- Compatible with laptop and touchscreen PCs for fieldwork and rack/off-bench mounting.
Includes: CB29 board set (Item 759) for bare wire connections; comprehensive PC software with Database of >200 standard cables; 2 yr Product Support Subscription comprising Warranty, free tech support, and free software upgrades.
Select Add-On Options: Hardware: 128-point Expansion Modules (attach to base); 4-Wire Kelvin Resistance Measurement, 1 mΩ at 1 A; Advanced Measurements; External Measurement Instrument Port (e.g. 10 GΩ Isolation at 100 V); Remote Control Connector for Deadman Switch; Environmental Sensor
Software: PinMap™ fixture editor,
Connector Designer™ connector editor, or
Autobuild™ guided assembly modules camiresearch.com |@CAMI_CableEye |+1.978.266.2655
