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Mezzanine System
5089
The 5089 provides eight channels of 12 bit A/D conversion using the Analog Devices AD7328, and is suitable for medium resolution medium speed applications.
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Scienlab Battery Test System – Pack Level, 220 KW
SL1730A
Keysight’s SL1700A Scienlab Battery Test System – Pack Level Series allows to realistically emulate the environment of the future battery pack application in order to test the high-power battery pack comprehensively and improve its functions and safety. The growing demand of e-mobility increases the need of vast battery test labs for EV battery development. Keysight developed the SL1700A Series to accelerate the development and validation of batteries. It offers a voltage range of up to 1500 V and power options between 100 and 300 kW including a Performance Bundle to increase the power up to 330 kW. The new high-voltage SiC (silicon carbide) technology provides a high energy efficiency on a small footprint and helps to minimize your operating costs.
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Fully-Automated CTIA-Compliant OTA Test System
TS8991
The R&S®TS8991 OTA performance test system measures the spatial radiation and sensitivity characteristic as specified by CTIA and 3GPP.The system software provides ready-to-use test templates for OTA measurements and supports all wireless standards.The integrated report function collects all measured test data such as graphics or numeric results, test environments, EUT information and hardware setup in one document.
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Scienlab Battery Test System - Cell Level
SL1007A
The SL1007A Scienlab Battery Test System – Cell Level enables you to accurately and productively test battery cells for automotive and industrial applications. The bidirectional power supply charges and discharges your cells under test with very high efficiency.
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COTS Systems
Pre-integrated to save you time and money, pre-validated systems proved an optimum computing platform for mission applications.
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Ceramics and Glass Inspection Systems
Due to their special material properties, ceramic and glass components are the basis of many high-tech products. The same properties make the production complex and costly. Substrate defects that lead to failure of finished components should be avoided at all costs. For this reason, early automated optical inspection is essential.For the inspection of sapphire and quartz glass Intego has developed systems to detect both external and internal defects and can also provide cutting suggestions. Using index matching it is possible to test rough or uneven glass profiles.For the inspection of ceramic components Intego offers solutions specifically tailored to the respective testing task. Our modular design uses standard components that have already been developed and tested and in most cases only requires minimal adaptation.
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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GPR System for Concrete Inspection
StructureScan Mini XT
Geophysical Survey Systems, Inc.
The StructureScan Mini XT is GSSI’s newest generation of our very popular all-in-one GPR systems. The StructureScan Mini XT offers a 2.7 GHz antenna for superior target resolution and can reach depths of 20 inches (50 cm). Ideal for locating rebar, conduits, post-tension cables, voids, and real time determination of concrete slab thickness.
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In-Line X-ray Inspection System
X-eye 6200
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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3D X-ray hybrid inspection system
YSi-X
Ideal for 100% inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target. X-ray, optical, infrared, and laser height measurement as standard equipment; hybrid and high reliability with multiple inspection modes.
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Ultrasonic Inspection System
PULD 40
The PULD-40 is a versatile and highly accurate ultrasonic inspection system designed to meet the needs of our customers.
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*Micro-fluoroscopic X-ray Inspection System
Cath-X
The Cath-X is a bench top system employing Glenbrook’s micro-fluoroscopy technology providing highly detailed x-ray video of the critical components of the needle device. The transparent, safely shielded, view chamber permits the operator to locate the critical areas of the needle for inspection. The x-ray image can be further magnified using the electro-optical zoom feature of the Cath-X.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Automatic Flight Inspection Systems
AT-940
The AT-940 is a mobile and deployable flight inspection system providing high performance in the smallest possible package.
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Ray tracing and Laser Simulation / Cavity Design Software
LasEasy V1.0
LasEasy software is the professional software for simulating and designing solid-state laser cavity, optical amplifier system, and parametric OPO systems. It can also simulate the laser light propagation in both horizontal and vertical (sangital and tangitial) planes.
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X-ray Inspection System
RTX-113™
Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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Mezzanine System
5235
The 5235 ECM provides 16 bits of simple digital I/O. The digital I/O is connected directly to the digital I/O on the carrier card. Inputs are clamped to about 3V by FET buffer ICs, and are 5V tolerant.
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Optical Inspection
3D AOI
In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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Entry-level X-ray Inspection System
X-eye 5100 Series
100kV ~ 130kV Micro-focus Closed tube and high-definition Flat Panel Detector are installed and high-resolution image can be gained.Customer convenience is primarily considered in operation and maintenance of the product.Customization is available because it is specially designed to be add up any necessary functions depends on customer needs with reasonable prices.
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Chip Inspection System
GEN3000T
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Inspection Kits
Elcometer offers one of the widest ranges of inspection equipment available. Our products are used across numerous industry sectors. In all cases, there is always a need to undertake a number of specific inspections during quality control assessments - as one parameter can affect another.
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Tracing-Type Non-Contact Inspection System For LCD/STN/Touch Panel/FPC
TTS
*"Probe + Non-Contact Sensor" enables to delect SHORT after sticking LCD*No Fixture in LCD Inspection*Applicable to FPC Inspection
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Vison Inspection System
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
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Semiconductor Package Inspection System
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Automated Inspection Systems
Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Inspection and Maintenance
Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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CPE Design Verification System
Jupiter 310
Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Inspection Tools
Deca XG1040
SATA 3.0 Gbps interface supportedSATA 3.0 Gbps supported. Up to 144PB HDD is supported.Register and edit inspection details (operation modes)Operation modes can be registered and edited using script files in text format.More accurate inspections can be performed using various types of inspections.Provides high speed data transfer at 8GB/minute.(* Varies according to performance of connected HDD.)Deletion and quick diagnostics functionEquipped with overwrite deletion using specified values and DoD (Department of Defense) conforming deletion method.Quick inspections such as SMART status, random seek inspection, entire area read/write inspection can be performed.HDDs connected to each port can be executed, terminated, attached or removed individually.Multiple channels supportedUp to 16 HDDs can be operated by attaching 4 devices.





























