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Product
COM-HPC Server Type Modules
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The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
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ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
2.5” Pico-ITX (MI/O-Ultra) Single Board Computers
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Advantech's 2.5" Pico-ITX (MI/O-Ultra) single board computer (SBC) measure 100 x 72 mm and feature REAR I/O, fanless operation, small form factor(SFF), compact and ultra slim design, extended temperature range, and low power consumption.
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Product
Computer-On-Module
ETX®
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ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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Product
Intel® Atom™ SoC E3825/ J1900 Pico-ITX SBC, DDR3L, 24-Bit LVDS, VGA Or HDMI, 1 GbE, Half-Size Mini PCIe, 4 USB, 2 COM, SMBus, MSATA & MIOe
MIO-2263
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Embedded Intel® Atom™ SoC E3825 & Celeron J1900 up to Quad-Core processor design, DDR3L 1333MHz support up to 8GBIntel Gen 7 DirectX®11.1 support, dual independent display by 24-bit LVDS + VGA or 24-bit LVDS + HDMIFlexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhowRich I/O interface with 2 COM, 1 SATA, USB3.0, PCIe Mini Card and mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
High Speed Data Acquisition Module
ADQ214
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The ADQ 214 data acquisition card features dual channels, 14-bit resolution, 400 MSPS capture rate with 1.4 GHz analog input bandwidth, and a memory buff er of 64 MSample per channel. The combination of high speed, high resolution and wide bandwidth makes it ideal for broadband applications such as IF sampling of RF signals and high-speed data recording. PXI Express, USB interfaces.
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Product
Computer On Modules
COM Express Basic
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COM Express Basic is the latest COM 125mm x 95mm form-factor, including Intel core i, Intel 6th Generation and Intel Atom processor. Because of wide range of processors, Intel core i, Intel 6th Generation and Intel Atom processors, COM Express can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI, and IDE for legacy applications.
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Product
3.5" Single Board Computer
RSB-4810
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Advantech’s RSB-4810 is an Arm-based 3.5" single board computer (SBC) powered by Rockchip RK3568 SOC. It leverages 4 x Arm Cortex-A55 cores, a 1.0 TOPs NPU, and a Mali-G52 graphics engine. RSB-4810 provides USB 3.0, PCIE 3.0, SATA 3.0, 2 x Gigabit Ethernet ports, a single channel LVDS (shared with MIPI-DSI), 6 x UART, and 2 x CAN for embedded applications. RSB-4810 also features Mini-PCIe, M.2 E-Key, and SIM card slot for Wi-Fi 6, BT, 5G/LTE, and AI acceleration modules. These features make Advantech’s RSB-4810 an ideal solution for entry level edge AI computing in AIoT applications.
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Product
COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Alder Lake-P
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The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
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ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3100 with Intel MXM GPU
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- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
Data Acquisition 32 ch. Module
CPCI-AD16/16-6U
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The CPCI-AD320 module provides a 6U high performance data acquisition subsystem. There are 32 thirty-two 100/200 KSPS ADC’s for maximum performance. Or an opt low cost 16 channel version. The Local DSP can be usedto simply move data samples to the CPCI bus or can provide processing functions such as limit checking, FFT’s, digital filtering, etc. Software can be downloaded to the DSP via the CPCI interface.
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Product
PXI Data Acquisition
DAQ
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Installation and configuration is fast and easy with standard connectors, soft front panels and Keysight connection expert. In addition, software drivers support the most common programming environments such as Visual Studio®, C, C++, Visual Basic, MATLAB® and LabVIEW™.
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Product
64-CH 16-Bit 250kS/s Multi-Function DAQ Card
cPCI-9116
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- PICMG 2.0 Rev 2.1- 16-bit A/D and sampling rate up to 250kS/s- 64-CH single-ended or 32-CH differential input- On-board 1k-sample A/D FIFO
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Product
8AI Modbus RS-485 Remote I/O
ND-6117
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The NuDAM modules provide direct communications with a wide variety of sensors; perform signal conditioning, scaling, linearization and conversion; can acquire measurements of temperature, pressure, flow, voltage, current; and handle multiple digital signal types broadly used in IoT and other industrial applications, such as facility monitoring, environment monitoring, and industrial process control. The new ND-6117, ND-6124, ND-6150, and ND-6160 modules feature Modbus/RTU as the best remote data transmission protocol, which provides customers a comprehensive product offering.
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Product
Modular and Scalable Multifunction Switch/Measure Units
EX1200 Series
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The EX1200 product family is a modular and scalable series of multifunction switch/measure units that can be configured to address a variety of applications in the mechanical data acquisition and electronic test environments.
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Product
COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
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The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Product
3.5" Single Board Computer
RSB-4760
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RSB-4760 is a RISC 3.5" single board computer (SBC) powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GNSS. RSB-4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Debian BSPs, this SBC enables customers to easily develop unique application on specific OS.
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Product
6x 3U OpenVPX MOSA Mission Computer
SIU36-MCVARM-01
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SIU36-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Product
COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
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Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
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ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Product
OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
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The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
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Product
16-Ch, 24-Bit Thermocouple Input IDAQ Module
iDAQ-868
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Hot-swappable in iDAQ system16-channel thermocouple sampling24-bit resolution50/60Hz rejection filter availableWide range of thermocouples supportedIsolation protection up to 600VRMS
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Product
3.5" Single Board Computer
RSB-4680
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RSB-4680 is a RISC 3.5" single board computer (SBC) powered by a high-performance Rockchip ARM Cortex-A17 RK3288 processor which supports 4K display from HDMI. It offers rich interfaces such as 6 USB2.0, 6 UART, 1 VGA, 1 LVDS, 1 GbE and 8 GPIO. RSB-4680 also features Mini-PCIe, M.2, and SIM card slots for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for Kiosk, POS, and Vending machine application.
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Product
SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
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- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
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ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
3.5" Single Board Computer
RSB-4410
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RSB-4410 is a RISC 3.5" single board computer (SBC) powered by a high-performance NXP ARM® Cortex®-A9 i.MX6 processor that supports full HD video encoding/decoding and Gigabit Ethernet networking. RSB-4410 also features mini PCIe and SIM card slots for integrating Wi-Fi and 3G modules. This system can be equipped with Linux BSP V3.0.35 or Android BSP 4.2.2, enabling customers to develop unique application software.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
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The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
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ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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Product
2-CH Counter/Frequency Input Module
ND-6080
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- Channels: 2 independent 32-bit counter- Input Frequency: 100 kHz max.- Isolation Voltage: 5000 VRMS- Input Pulse Width: > 10 µs*- Max. Count: 4294967295 (32-bit)
