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Product
120 GHz Frequency Extender
N5295AX03
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The N5295AX03 modules are compact lightweight modules designed to interface to the N5292A test set controller that is driven with a PNA/PNA-X B model vector network analyzer.
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
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The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
Standard 4.47 (127.00) - 12.00 (340.00) High Frequency Probe
K-50H-S
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Current Rating (Amps): 6Bandwidth @ -1dB (GHz): 4.00Return Loss @ -20dB (GHz): 2.50Nominal Impedance (Ohms): 50Test Center (mil): 600Test Center (mm): 15.24Full Travel (mil): 100Full Travel (mm): 2.54Recommended Travel (mil): 90Recommended Travel (mm): 2.29Overall Length (mil): 1,205Overall Length (mm): 30.61
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
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The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Standard 6.20 (175.20) - 8.00 (226.80) High Frequency Probe
CSP-40A-015
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Bandwidth @ -1dB (GHz): 6.00Return Loss @ -20dB (GHz): 2.30Nominal Impedance (Ohms): 50Dielectric VTE Rating (k VAC): 1Test Center (mil): 250Test Center (mm): 6.35Full Travel (mil): 200Full Travel (mm): 5.08Recommended Travel (mil): 133Recommended Travel Remark: Shield: 211 (5.36) including travel of probesOverall Length (mil): 1,231Overall Length (mm): 31.28Full Travel Remark: Shield: 275 (6.99) including travel of probes
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Product
14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
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The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
K-50 Series Probes
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The K-50 coaxial probe provides an instrumentation-quality interface for broadband R.F. measurements up to 4 GHz. With the K-50 R. F. circuit design, impedance characterization measurements can be performed using it as a Network Analyzer port-extending accessory. Accurate and repeatable small signal and R.F. power (50 Watts) measurements provide consistent and repeatable results.
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Product
3U OpenVPX Power PC SBC
68PPC2
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NAI’s 68PPC2 is a 3U OpenVPX, NXP® , QorIQ® T2080 quad-core processor, PowerPC-based, Single Board Computer (SBC) that can be configured with up to two intelligent function modules. Ideally suited for rugged defense, commercial aerospace, and industrial applications, the 68PPC2 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.
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Product
Standard 1.59 (40.40) - 7.00 (198.50) High Frequency Probe
CSP-30TS-011
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Nominal Impedance (Ohms): 50Current Capacity (Amps) @ 20° C: 1.00Bandwidth @ -1dB (GHz): 35.00Recommended Travel (mil): 67Recommended Travel (mm): 1.70Full Travel (mil): 100Full Travel (mm): 2.54Overall Length (mil): 1,003Overall Length (mm): 25.48Rec. Mounting Hole Size (mil): 213Rec. Mounting Hole Size (mm): 5.40Test Center (mil): 375Test Center (mm): 9.53
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Product
Active Differential Probe, 100 kHz to 7 GHz
U1818A
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The Keysight U1818A 100 kHz to 7 GHz active differential probe makes it easy to perform high frequency in-circuit measurements using network, spectrum and signal source analyzers. With flat frequency response, low noise floor, and direct power from instrument connection, the U1818A allows measurements to be made while taking full advantage of Keysight's RF analyzers dynamic range.
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Product
Standard 0.80 (22.00) - 4.00 (114.00) High Frequency Probe
CSP-03G-003
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Current Rating (Amps): 6Bandwidth @ -1dB (GHz): 3.70Return Loss @ -20dB (GHz): 1.80Nominal Impedance (Ohms): 50Dielectric VTE Rating (k VAC): 1Test Center (mil): 300Test Center (mm): 7.62Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Overall Length (mil): 1,090Overall Length (mm): 27.76
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Product
Computer On Modules
COM Express Compact
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Advantech COM-Express Compact includes Intel core i, Intel 5th Generation, Intel atom processor, which are all designed with low power consumption processors. They perform the same functions and same pin definitions as the COM-Express Basic module but with smaller board dimensions of 95 x 95 mm. And COM Express Compact series provide from Intel core i, Intel 5th Generation, Intel atom processors, and is the best solution for mobile applications.
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Product
Standard 0.80 (22.00) - 4.00 (114.00) High Frequency Probe
CSP-03B-006
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Current Rating (Amps): 6Bandwidth @ -1dB (GHz): 3.70Return Loss @ -20dB (GHz): 1.80Dielectric VTE Rating (k VAC): 1Nominal Impedance (Ohms): 50Test Center (mil): 300Test Center (mm): 7.62Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Overall Length (mil): 1,090Overall Length (mm): 27.76
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
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ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3102 with NVIDIA MXM GPU
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- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
20-50 GHz Doubler
1GC1-8038
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The 1GG1-8038 is a passive diode frequency doubler. It is specified to operate with a 2050 GHz output frequency. Conversion efficiency is usually around -12 dB. The device has low 1/2 and 3/2 spurious output, typically 15 dBc or better. The doubler can be biased through onchip resistors to allow operation at low input levels. Up to 22 dBm at the input can be accommodated. Onchip DC blocking capacitors are included at the input and output.
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
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The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
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Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
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- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
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ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
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- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
NI-9326, 6-Channel, 150 V, 128 kHz C Series Frequency Input Module
786999-01
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6-Channel, 150 V, 128 kHz C Series Frequency Input Module - The NI-9326 is a channel-to-channel isolated frequency input module for CompactDAQ and CompactRIO systems. This module includes six differential input channels with a 0 Vrms to 150 Vrms input range. The NI-9326 also features configurable thresholds for connection to a variety of variable reluctance sensors, single channel encoders, and hall-effect sensors. You can use the included embedded counters to perform frequency measurements or edge-counting for tracking total counts on a periodic signal. Additionally, the NI-9326 supports configurable Butterworth filters to help you perform low-noise frequency measurements.
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Product
ARM Computer
SYS-398S-1G-0
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WINSYSTEMS’ SYS-C398S low power single board computer combines high performance multimedia graphics with a rich mix of industrial I/O. The NXP® i.MX 6S processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphical applications in security, transportation, medical, and digital signage.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
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The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
120 GHz Frequency Extender
N5295AX51
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The N5295AX51 modules are compact lightweight modules designed to interface to the N5292A test set controller that is driven with a PNA/PNA-X B model vector network analyzer.
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Product
Standard 3.06 (86.70) - 4.00 (113.40) RF Probe For SMA Connectors
CSP-30ES-013
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Nominal Impedance (Ohms): 50Current Capacity (Amps) @ 20° C: 1.00Bandwidth @ -1dB (GHz): 35.00Return Loss @ -20dB (GHz): 22.00Test Center (mil): 328Test Center (mm): 8.33Recommended Travel (mil): 100Recommended Travel (mm): 2.54Full Travel (mil): 200Full Travel (mm): 5.08Overall Length (mil): 1,033Overall Length (mm): 26.24Rec. Mounting Hole Size (mil): 297Rec. Mounting Hole Size (mm): 7.54
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Product
SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
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The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
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The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
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- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
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ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
