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Testing, Inspecting & Cleaning Kit
KI-TK033
850/1300 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO, SC, LC connectors
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Thick Film Inspection
785
For thicker coatings such as coal tars, extruded and tape coatings, the Model 785 has a range of infinite voltage settings from 1,000 to 15,000 volts.
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Building Inspection System with Moisture Hygrometer & MSX® IR Camera
FLIR MR277
The MR277 is the first FLIR building inspection system to combine the advantages of Infrared Guided Measurement (IGM) and our patented Multi-Spectral Dynamic Imaging (MSX) with advanced environmental sensors to help you quickly locate, clearly identify, and easily document problems. IGM technology and a laser pointer isolate the area where you can use the integrated pinless moisture sensor for non-invasive readings or external pin probe for invasive measurements. With automatically calculated environmental readings and a field-replaceable humidity/temperature sensor, the MR277 lets you finish the job and minimize downtime. Connect to external devices with METERLiNK® and use FLIR Tools® to enhance troubleshooting and reports.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Inspection Class ROV
Phantom® L Series
THE PHANTOM® L6 IS THE NEWEST IN THE NEXT GENERATION OF PROVEN, RELIABLE UNDERWATER ROBOTICS PIONEERED BY DEEP OCEAN ENGINEERING IN ITS MANUFACTURE OF REMOTELY OPERATED VEHICLES (ROV), BUILT IN THE USA FOR NEARLY FOUR DECADES.
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Pipeline Inspection
Radiodetection and Pearpoint provide a wide array of Pushrod and Crawler pipeline inspection systems.
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Industry-Standard, Automated Precision Inspection Systems
Circuit AOI 4.0
Circuit AOI 4.0 is a set of industry-standard, automated precision inspection systems that combine precision, robust construction and line-of-sight technology for assembly and production under stringent regulatory standards and is ideal for PCB / HDI line inspection.It uses innovative alignment detection logic to detect defects such as short / open circuit, protrusion / depression, scratch, pinhole, residual copper, line width / line distance violation, missing objects, unwanted objects, and so on. The system can be used with off-line set-up station and off-line re-check station to enhance the detection capacity.Circuit AOI 4.0 uses multi-angle LED light source, compared to the traditional single angle light source design, can obtain the best image contrast, widely used in different plate inspection.
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Fiber Inspection and Cleaning
Dust - just because you can't see it doesn't mean it's not there. A 1-micrometer dust particle on a single-mode core can block up to 1% of the light (a 0.05dB loss). The only way to know it's clean is to inspect it before you connect it. And if it's dirty, it needs to be cleaned with the right tools or you might just make it worse. Know it's clean with our cleaning and inspection tools.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Low to Modest Volume Clean, Inspect & Test
KI-TK071A
1310/1550 nm & 850/1300 nm source & Autotest power meter + acceptance reporting software, inspection microscope, cleaning materials. Interchangeable MPO, MPO/APC, SC, LC connectors (EAR99 Restricted)
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Substrate Inspection Apparatus
The test system of the printed circuit board (mounting board) called the flying probe tester developed ahead of the world received high evaluation at the electronics manufacturing factory around the world, securing the top share of the industry and "Takaya of the board tester" We have established a firm position that.
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Field Evaluation And Special Inspections
Nemko offers Field Evaluation and Special Inspection Services in the US and Canada as a fast and economical alternative to traditional product safety certification.
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Paint Inspection Gauge
141
The Paint Inspection Gauge is ideal for use on metallic & non-metallic substrates such as wood, glass and plastics.Large easy grip handle - makes cutting thick or hard coatings easyInternal cutter storage compartmentx50 magnification microscope
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Semiconductor & Flat Panel Display Inspection Microscopes
MX63 / MX63L
The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you need to tailor the system to your application. These ergonomic and user-friendly microscopes help increase throughput while keeping inspectors comfortable while they do their work. Combined with OLYMPUS Stream image analysis software, your entire workflow, from observation to report creation, can be simplified.
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On-site EL/PL Inspection Machine
“EPTiF”
"EPTiF (EL/PL Test in Field)" enables you to check invisible conditions of installed solar panels during daytime by EL and PL inspections, which are adopted by a number of solar panel manufacturers, without detaching solar panels. Irradiance-independent and steady results can be obtained. This is the first in the industry.
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Conformal Coating Inspection (CI AOI)
They cover the components, the area around the components and identify most coating issues including cracks, bubbles, insufficient / excess coating, loss of adhesion and other common contaminations. Full coverage inspection for conformal coating.
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Automated Inspection Systems
Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Silicon Inspection System
NIR-01
The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
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Waterproof Inspection Cameras
waterproof inspection cameras have waterproof probes, General's DCS6XX wet/dry cameras, the DCS600A, DCS605, DCS660A, DCS665 & the DCS665-ART, go one step further because their grips and monitors are also waterproof. This feature, unique in the industry, allows users to inspect toilets and water and sewer lines carrying running water without worrying about dropping and "dunking" the instrument.
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Sensor for Filament Inspection
EyeFI
EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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Inspection Tools
Deca XG1040
SATA 3.0 Gbps interface supportedSATA 3.0 Gbps supported. Up to 144PB HDD is supported.Register and edit inspection details (operation modes)Operation modes can be registered and edited using script files in text format.More accurate inspections can be performed using various types of inspections.Provides high speed data transfer at 8GB/minute.(* Varies according to performance of connected HDD.)Deletion and quick diagnostics functionEquipped with overwrite deletion using specified values and DoD (Department of Defense) conforming deletion method.Quick inspections such as SMART status, random seek inspection, entire area read/write inspection can be performed.HDDs connected to each port can be executed, terminated, attached or removed individually.Multiple channels supportedUp to 16 HDDs can be operated by attaching 4 devices.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Abrasive & Blast Inspection
Blasting parameters: A number of important parameters need to be monitored during the blasting or water jetting process, these include: air pressure (at the nozzle), nozzle diameter, blast media contamination & pH values in order to avoid recontamination of the substrate during blasting.
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Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
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Automated LED Inspection and Testing
Landrex Technologies Co., Ltd.
Automated LED Inspection and Testing
