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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
SoC Test System
V93000 SoC / Smart Scale
Test System
Advantest’s V93000 Smart Scale generation incorporates innovative per-pin testing capabilities. Each pin runs it own sequencer program for maximum flexibility and performance, for example in multisite applications. Full test processor control ensures time synchronization between all card types, like digital, Power, RF, mixed signal and so on. The user benefits are reduced test time, best repeatability and simplified program creation. The system design makes it easy to extend your configuration with new modules and instrumentation, as your test needs change.
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Product
128 DIOs JTAG Boundary Scan Resources Unit
YAV9JTAG
Test Fixture
Boundary-scan is a widely practiced test methodology that is reducing costs, speeding development, and improving product quality for electronics manufacturers around the world. By relying on an industry standard, IEEE 1149.1, it is relatively quick, easy, and inexpensive to deploy a highly effective test procedure. In addition, today’s PCBs have little alternative because of limited access to board-level circuitry.
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Product
Benchtop Communication Test System
ATS3000A
Test System
The ATS3000A is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23 instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000A also includes the sophisticated IF and baseband I/Q Digital Signal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easy-touse graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets areavailable for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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Product
Sealed Beam Bulb Testing System
H710019SSL
Test Platform
EOL test for manufacturing of bulbs with LED for applications requiring to ensure watertightness: vehicles, marine, swimming pools, operating rooms, classified areas (Ex Zone), etc. The test system checks in a short time all the light and electrical characteristics of the bulb. A high precision Micro Leakage Meter also checks that there are no leaks between the environment and the inside of the bulb. The test results are recorded on the PC and can be printed on a quality control label attached to each unit.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
6TL36 Inline Handler
AM304
Test Handler
Test handler 6TL36 able to test DUTs inside Faraday ChamberDual line (bypass)
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Product
Wafer and Cells PL System
HS-PL
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Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Product
Scienlab Charging Discovery System (CDS) – High-Power Series
SL1047A
Battery Test Platform
The Scienlab Charging Discovery System – High-Power Series from Keysight enables you to test charging interfaces of electric vehicles (EVs) and EV supply equipment (EVSE) during high-power charging up to 1,500 V DC and ±600 A DC. With the CDS can perform all necessary conformance and interoperability tests according to worldwide charging standards. Our new solution, which features the separate Scienlab Cooling Unit with interchangeable liquid-cooled charging adapters, also enables a high-power upgrade of the SL1040A Scienlab Charging Discovery System - Portable Series.
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Product
Semi-Automatic Contactless Wafer Detector
NCS-200SA
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Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
IOL & Power Cycling Test Systems
Test System
Our IOL & power cycling systems increase measurement quality and throughput and reduce testing costs on an open platform. The focus is on seamless monitoring and precise determination of all parameters of each DUT. In addition, the systems are equipped for the special requirements of wide-bandgap technology.
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Product
4-Module ICT System, I307x Series 6
E9903G
In-Circuit Test System
Test efficiency, test system stability, and seamless equipment integration. Keysight’s i3070 Series 6 family provides those improvements built upon a proven technology foundation. With time-tested software, hardware, and programmability, the Series 6 are fully backward compatible with previous systems, and they make highly repeatable measurements.
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Product
Memory Test System
T5851/T5851ES
Test System
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Product
CPE Design Verification System
Jupiter 310
Test System
Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
2-Module ICT System, I317x Series 6
E9902G
In-Circuit Test System
Keysight's family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.
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Product
In-Circuit Tester
Sparrow MTS 30
In-Circuit Test System
The Sparrow MTS 30 is a 19“ test system that can be integrated into any standard rack. The In-Circuit tester can also be used as benchtop test system. With this compact and flexible tester you can perform both analog and digital In-Circuit and functional tests.
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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
Advanced SoC Test System
3680
Test System
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Product
Wafer Prober Networking System
PN-300
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The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
Mixed Signal, Multi-Functional Test Module
PXIe-ScanIO-112
Test Module
The PXIe-ScanIO-112 delivers a powerful combination of digital, analog, and AC-coupled testing in a single PXIe module. With 104 boundary-scan controllable digital I/O channels and 8 analog I/O channels ranging from –15V to +15V, engineers gain the flexibility to test a wide variety of board-level designs. The module supports IEEE-1149.6 AC-coupled interconnect testing, configurable single-ended and differential pin operation, and integrates seamlessly with the Corelis ScanExpress™ suite.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Scienlab Combined Battery Test Solution
SL1133A
test
Solution for testing battery cells with an output power up to ±3 kW and a voltage range up to 6 V.
