-
Product
Enclosed Fanless Industrial Embedded Computer with NXP® i.MX8M Application Processor
SYS-444Q
-
The SYS-444Q is a rugged enclosed fanless embedded computer system with NXP’s i.MX8M industrial application processor with quad-core Arm Cortex®-A53 for low-power processing. This rugged system has dual Ethernet, industrial I/O, expansion options, TPM 2.0 hardware security, and options for wireless connectivity. The processor supports industry-leading video processing along with an M4 microcontroller for real-time subsystems making it an ideal fit for industrial IoT applications requiring highly reliable performance in harsh conditions such as digital signage, industrial automation, energy management, building automation, and others.
-
Product
Mezzanine System
5158
-
The 5158 Electrical Conversion Module (ECM) provides eight (8) RS-232 outputs and eight (8) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
-
Product
Cobra Temperature Forcing System for ATE/SLT Test Applications
31000R
-
Cobra is the most advanced, compact,powerful temperature-forcing system on the market. Cobra is an adaptable solution to the ever-increasing thermal demands of post silicon validation and device characterization.
-
Product
VIP Cabin Management Systems
-
Where elegance meets powerful functions, add a new level of electronic sophistication to your cabin.
-
Product
Avenir VIP IFE & CMS Systems
-
The new Avenir Line is the next generation of Cabin Management and In-Flight Entertainment Systems (CMS/IFE) from Astronics. Avenir incorporates the latest technologies to deliver native 4K video distribution through the highest bandwidth Ethernet network system in the industry. It also provides a fully customizable experience, which extends to the graphical user interface.
-
Product
Mezzanine System
5093
-
ECM P/N 5093 provides 2 independent full bridge circuits. The two full bridge circuits can be used together to drive one small two phase stepper motor. Each full bridge circuit can drive one small dc motor or other bipolar load. Note all inductive loads should employ transient protection.
-
Product
Onboard Systems
-
Collect and store critical data securely to facilitate train operation monitoring, driver performance evaluation, and post-event investigation; reliable data management can yield improved operational efficiency and safety
-
Product
LabVIEW Development Systems
-
Base--The instant productivity of graphical development for DAQ and instrument controlFull--A rich set of routines for mathematics, signal processing, and signal generationProfessional--The solution for professional developers who need code deployment or validationLabVIEW suites--LabVIEW Professional plus industry-specific add-on software
-
Product
USB2.0 Module With 2 CAN Bus Nodes ARINC825 Compliant For Testing & Simulation of Avionic ARINC825/CAN Bus Systems
APU825-2
-
USB2.0 module with 2 CAN bus nodes ARINC825 compliant for testing and simulation of Avionic ARINC825/CAN bus systems.
-
Product
6U VPX Direct RF Processing System
VP460
-
The VP460 is designed to enable customers to begin development of their next generation systems using revolutionary new processor technology. It is in alignment with the SOSA™ Technical Standard to provide the interoperability required by the US Air Force, Army and Navy.
-
Product
Multi-Functional Optical Profiling system
7505-01
-
Chroma 7505-01 is the newest multi-function optical inspection system that equips with the capability of measuring 1D, 2D and 3D at the same time. Penetrating reflection measurement is used for 1D film thickness measurement to measure the non-destructive film thickness on transparent and translucent material.
-
Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
-
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
-
Product
Smart Aircraft System
-
The Astronics Smart Aircraft System makes that possible. Our patented system enables the immediate, cabin-wide gathering of thousands of data points using sensors & IoT (Internet of Things) technology. The result? You get the insightyou need—when you need it. Insight that helps you on every flight. Insight that allows you to improve your operational efficiency, your cabin safety, and your overall passenger experience.
-
Product
Computer-On-Module
Open Standard Module (OSM)
-
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
-
Product
Computer On Modules
ETX/XTX
-
ETX / XTX CPU module eqiupped with Intel Atom has great I/O capacity and meets both ISA and PCI needs, while supporting the Computer On Module concept for plug-in CPU modules. Advantech is a founding member of the ETX Industrial Group (ETX-IG).
-
Product
Single Sensor Enhanced Vision Systems
-
Rely on the industry leading Max-Viz enhanced vision systems (EVS) from Astronics to enhance your safety and situational awareness while flying.
-
Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
-
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
-
Product
Systems Integration (SIL) Lab Data Acquisition
-
Bloomy’s SIL data system allows testing and simulation of every system component on the aircraft. The functionality of these complex integrated systems are fully tested, debugged, and verified safely in the lab prior to flight testing. This reduces cost and schedule for new aircraft. Bloomy has applied its expertise to multiple SILs.
-
Product
Aircraft Data Systems
-
Aircraft data systems for commercial and military applications, including Aircraft Interface Devices (AID), avionics I/O computers, avionics test & simulation interfaces, and Embedded avionics interfaces.
-
Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
-
LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
-
Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
-
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
-
Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
-
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
-
Product
SSD Test Systems
-
Enables Rapid SSD Development and Production Ramp with Flexible Test Solution In the high-growth and highly competitive SSD market, a test system that supports multiple protocols can eliminate the need for retooling and achieve faster transitions from one product version — or one product generation — to the next. Advantest SSD Test System allows manufacturers to rapidly grow their product portfolios while remaining adaptable to the many changing needs of the evolving SSD market. This tester improves users’ engineering efficiency with powerful, easy-to-use software tools and a revolutionary multi-protocol hardware architecture, enabling accelerated SSD product development and a faster time-to-manufacturing ramp.
-
Product
Mezzanine System
5188
-
ECM P/N 5188 provides an AD8109 crosspoint switch for analog or digital signals with 250MHz of Bandwidth. For single ended applications 8 inputs can be connected up to 8 outputs in any configuration.
-
Product
SMARC Short Size Module with NXP i.MX 8M
LEC-iMX8M
-
- Quad Arm® Cortex®-A53 and Cortex-M4- Cryptographic co-processor for end-to-end IOT security- Full 4K UltraHD resolution HDMI 2.0a and dual channel LVDS- Two MIPI-CSI-2 camera inputs- 2x GbE LAN (optional TSN support), USB 3.0/2.0 and OTG- Standard or rugged support: 0°C to 60°C or -40°C to 85°C- 15 year product availability
-
Product
H(3)TRB & HTGB Test Systems
-
SET offers two H(3)TRB and HTGB product lines which differ in the number of test object channels and the range of technical possibilities. The innovative systems are scalable, modular and standardized.
-
Product
Test System Replication/Build-to-Print
-
Need to manufacture test stations? For more than 15 years we have sourced, assembled, tested and shipped fleets of robust, cost-effective solutions. We produce them at our high-volume facilities and deploy them around the world.
-
Product
Communications System Analyzer
Freedom R8200
-
The Freedom R8200 from Astronics Test Systems represents a major step in the evolution of the Land Mobile Radio Test. The Freedom R8200 is the first and only test instrument that combines comprehensive digital and analog LMR testing with the ability to measure important RF network characteristics, such as Distance to Fault (DTF), Return Loss, and Voltage Standing Wave Ratio (VSWR). The Freedom R8200 is also the only service monitor with the abilityto display advanced RF Parameters in a Smith Chart for more complicated network analysis
-
Product
Computer-On-Module
Qseven®
-
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
-
Product
SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
-
ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
