Evolved Packet Core
LTE system core voice and data network.
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Product
Core Fusion Splicer with Dual Observation
STC-OFS701H
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Shanghai Stone Communication tech Co., Ltd
The smallest Core to core fusion splicer with dual observation Weight 1.2kg only 3.5 inch TFT color LCD monitor with X & Y view simultaneously Fiber core can be displayed clearly with large magnification Alignment mode: Core, cladding and manual alignment 9 seconds splice time and 30 seconds heat time Friendly operation interface and smart menu Operation with Max wind velocity of 15m/s Operation with max 5000m above sea level Typical 120 cycles with battery
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Product
10Gbps Ethernet Packet Generators
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Axtrinet (AXTRINET IS A TRADING NAME )
Designed to meet the needs of testing the infrastructure behind theInternet of Things, the AxtrinetTM APG Ethernet Packet Generatorsprovides compact and affordable 40Gbps and 10Gbps/1Gbps Ethernet Packet Generator/Analysers with a simple to use Graphical User Interface and an open API for third party scripting.
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, LVDS And LAN
PICO511
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The PICO511 is an extremely compact Pico-ITX motherboard featuring the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U (codename: Kaby Lake). The feature-rich 2.5-inch embedded board is building flexible I/O interfaces through board to board connectors, wide temperature range in a small-form factor motherboard to fit different needs of many demanding applications in various industries. The PICO511 is perfect for system integrators who require an extremely compact embedded motherboard with great processing power and expansion capabilities. Its compact size form factor has ensured that it can fit into a variety of space constricting environments. In addition, the Intel® Kaby Lake-based motherboard was designed to withstand extreme temperatures, ranging from -20°C to +70°C (0°F to +158°F).
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Product
K-Band Silicon SATCOM Rx Quad Core IC
AWS-0102
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The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
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Product
Compact Gaming Platform Based On 12th/13th/14th Gen Intel® Core™ Processors Supports Up To Eight Independent Displays Including 4K UHD
ADi-SA6X-AD
Gaming Platform
ADLINK‘s ADi-SA6X-AD all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 12th/13th/14th Generation Intel® Core™ processors, the ADi-SA6X-AD provides compelling graphics performance from a PCI Express 4.0x16 discrete graphics card and/or an embedded Intel® UHD Graphics 770 together with multi-display support for up to eight independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA6X-AD fully satisfies the needs of your gaming application.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, Built-in Layer 2 Managed PoE Switch For Railway PC
tBOX400-510-FL
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The tBOX400-510-FL is a two-in-one transportation-certified box PC with built-in layer 2 managed PoE switch for IP surveillance applications. The tBOX400-510-FL is certified with CE (Class A) and FCC and is in compliance with EN 50155 and EN 45545-2. This high-performance transportation box PC is powered by the 7th generation Intel® Core™ (Kaby Lake) or Intel® Celeron® 3965U processors, along with dual DDR4 SO-DIMM slots for up to 32GB of memory. The built-in 10-port managed switch is powered by Qualcomm's chip. The tBOX400-510-FL has a built-in 10-port managed switch with 8-port 10/100 Mbps PoE and 2-port Gigabit LANs, featuring VLAN, QoS and PoE scheduling for the more secure and smooth network. For reliable operation in severe environments, the rugged fanless transportation box computer is designed to withstand a wide temperature range from -40°C to +60°C and vibration of up to 3 Grms. It also supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for marine applications, and 24V to 110V DC for railway applications. With its high performance, industrial-grade design and full-strict certifications, the tBOX400-510-FL is suited for transportation-related applications such as onboard video surveillance and video management.
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Product
2-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, Front-access I/O, PCIe And PCI Slots
IPC932-230-FL
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The IPC932-230-FL is an expandable fanless barebone system with various front-facing I/O connectors. The powerful embedded system IPC932-230-FL supports LGA1150 socket for the 4th generation Intel® Core™ processors coupled with the Intel® Q87 Express chipset. Two 204-pin SO-DIMM sockets support up to 16 GB DDR3-1333/1600 system memory in maximum. To fulfill different application needs, the compact industrial PC provides two flexible PCI/PCIe expansion slots with two different combinations: one PCIe x1 and one PCIe x4 or one PCIe x4 and one PCI. Its DVI-I output on the front panel allows user to directly connect to a LCD panel and four COM ports and a DIO are provided for general industrial control. This all-in-one barebone system also has two easy-to-install 2.5 SATA HDD drive bays with RAID 0/1, and supports Intel® Active Management Technology 9.0 (AMT 9.0) to enhance overall device manageability.
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Product
PICMG 1.3 Full-size CPU Card With LGA1151 7th/6th Gen Intel® Core™ Processor, Intel® Q170/H110, SATA3, USB 3.0, Dual LAN And DVI-I
SHB140
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The SHB140 PICMG 1.3 single board computer is based on the 14nm 6th generation Intel® Core™ i7/i5/i3 processors in the LGA1151 package with Intel® Q170 Express chipset (codename: Skylake). The high performance SHB-based CPU card comes with two DDR4 2133/2400 MHz up to 32GB and six SATA-600 ports with RAID 0/1/10/5. Combined high-bandwidth PCI Express for frame grabbing and conventional PCI expansion for motion capture, the SHB140 is an optimum solution for machine vision and automation applications. This high performance PICMG 1.3 slot CPU card also features an integrated Intel® AMT 11 and TPM 1.2 for higher security and easier maintenance.
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Product
Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
Industrial Computer
The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
Intel® Core™ I3 And Core™ 3 And Atom® X7000E/x7000RE Processor
AIMB-219 B1
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Intel® Core™ i3, Core™ 3 Processor and Atom® x7000E/x7000RE ProcessorUp to 16GB DDR5 4800MT/s with one SO-DIMMTriple independent display with 1 DP, 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMMini-ITX low profile motherboard, fanless designSupports Device-On and Embedded Software APIs
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
Motherboard
Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
Computer on Module
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
Server Board
- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Product
SBC326, 3U OpenVPX 4th Generation Intel Core i7 Single Board Computer
SBC326
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The SBC326 Rugged Single Board Computer features the high performance, highly integrated 4th Generation Core i7 processor platform from Intel.
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Product
Intel® Core™ Ultra Series 2 Processors (LGA1851), Up To 24 Core. Support Q870/H810 PCH
AIMB-2710
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Intel® Core™ Ultra Series 2 Processors, Up to 24 Core. Support Q870/H810 PCHDual channel DDR5 6400MT/s, max. 96GB with two CSODIMMSuper Speed I/O: PCIe x16 Gen5 (32GT/s), USB 3.2 Gen2x1 (10Gbps), 2.5 GbERich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA and 1 USB4 Type-C12-24V DCinWindows 11 LTSC & Ubuntu 24.04 LTS; SUSI API and WISE-DeviceOn
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Product
SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)
EKF-SC9-TOCCATA
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SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.
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Product
RISC-V Processor IP Core Evaluation Kit
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The EMSA5 demo platform is an ideal tool for evaluating the RISC-V processor IP core EMSA5. It contains an Artix®-7 35T FPGA Arty evaluation board with implemented EMSA5-IP core. Thanks to the included peripherals and expansion interfaces, the kit is ideal for numerous applications. The kit is JTAG programmable and includes Quad SPI Flash, a JTAG port, 10/100 Mb/s Ethernet and a USB-UART bridge, four Pmod connectors and an Arduino Shield expansion connector.
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Product
Fanless Embedded System With LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ I7/i5/i3 Or Celeron® Processor, Intel® C246, ECC/Non-ECC And 1 PCIe X4 Expansion Slot
eBOX710-521-FL
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*Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron®processor*2 DDR4 ECC/non-ECC memory supported, up to 64GB*Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1*DVI-I, HDMI, and DisplayPort with triple-view supported*6 GbE LAN, 6 USB 3.2 and 1 PCIe x4 expansion slot*Flexible I/O window supported
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Product
Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
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A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Product
PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake)
CMx-SLx
Single Board Computer
The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.
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Product
Split Core Hall Effect DC Current Sensor
CYHCT-C2TC
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ChenYang Technologies GmbH & Co. KG
This Hall Effect current sensor is based on open loop principle and designed with a split core and a high galvanic isolation between primary conductor and secondary circuit. It can be used formeasurement of DC current etc. The output of the transducer reflects the real wave of the current carrying conductor.
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Product
12.1" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-312
Panel PC
Industrial-grade 12.1 XGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with 5-wire resistive touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Diverse system I/O and isolated digital I/O via iDoor technologySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupport TPM2.0 hardware security
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Product
X-Band Silicon Radar Quad Core IC
AWS-0101
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The AWS-0101 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and dual beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain during transmit mode, +15 dBm output power during transmit, and 3.4 dB NF during receive. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 QFN for easy installation in planar phased array antennas.
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Product
Embedded System Support Intel® 12th/ 13th/ 14th Gen. Core I9/i7/i5/i3 Platform
EPC-B2208
Embedded PC
Support Intel 12th/ 13th/ 14th Gen. Core i9/i7/i5/i3.Two DDR4 3200MHz SODIMM and up-to 64GB.Supports triple independent displays of 2x DP/HDMI/LVDS.One low-profile PCIe expansion slot.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
Industrial Computer
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
Edge AI Compact Box PC With Intel® Core™ Ultra Processor (Series 3)
UNO-258
Box PC
Intel® Core™ Ultra series 3 processors (code name: Panther Lake H) with 25W and 45W TDP supportIntegrated AI acceleration providing up to 180 TOPS total AI performance (120 GPU + 50 NPU + 10 CPU)Xe3 GPU architecture providing up to 2× the graphics performance compared to Arrow Lake-HDual-channel DDR5 SO-DIMM memory supporting up to 128GB (64GB per channel)M.2 E-Key, B-Key, M-Key (supports NVMe) expansion for storage, LTE/5G, and Wi-FiBuilt-in 1000Mbps & 2500Mbps LAN ports with TCC and TSN supportModular I/O board design offering dual LAN or isolated DIO/CANBUS/COM
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
Single Board Computer
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
High-Performance Gaming Platform Based on 8th/9th Gen Intel® Core™ Processors Supports up to Seven Independent Displays Including 4K UHD
ADi-SA2X-CF
Gaming Platform
ADLINK‘s ADi-SA2X-CF all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 7th Generation Intel® Core™ processors, the ADi-SA2X-CF provides compelling graphics performance from a PCI Express 3.0 x16 discrete graphics card and/or an embedded Intel® UHD Graphics 630 together with multi-display support for up to seven independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA2X-CF fully satisfies the needs of your gaming application.
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
