Evolved Packet Core
LTE system core voice and data network.
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
785270-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Ultra Compact, Uncooled Thermal Imaging Core
Dione 1280 OEM Series
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The Dione 1280 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35 x 35 x 23.5 mm3 and weight is 27 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. The ultra-compact Dione 1280 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Fanless Embedded System With 4th Gen Intel® Core™ Processor For Railway PC
tBOX322-882-FL
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The tBOX322-882-FL fanless railway embedded PC is based on 4th generation Intel® Core™ i7 or i3 processor with wide temperature capability from -40°C to +70°C. Certified with EN50155, EN50121 and complied with the standard of railway vehicles fire protection – PrCEN TS 45545-2, the railway PC is well suited for IoT & M2M-related applications such as onboard devices controller, train management, gateway, security surveillance and rolling stock environments. To keep all cables tightly secured, the railway pc has standard M12 connectors for Ethernet ports, USB ports, power input, and audio port. What is notable is that the graphics performance is now merely up to two times higher than previous generation, with the latest quad core processor, allowing faster and better information display.
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Iron Core Current Limiting Reactors
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Current Limiting Reactor (CLR) is one of the most effective short circuit current limiting devices. It reduces stresses on busses, insulators, circuit breakers and other high voltage devices. Use of CLR is the most practical and economical approach at current limiting.
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18.5" FHD TFT LED LCD Touch Panel Computer With 13th Gen Intel® Core™ Processors And ATEX Explosion-Protected Certification
SPC-618WE
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Industrial-grade 18.5" FHD TFT LCD with 50K lifetime and LED backlightIntel® Core™ Processors (13th Gen ), i7-1365URE deca-coreBuilt in single DDR5 4800 RAM with 32GB capacityBuilt in sTLC SSD of 256GB with extreme longevity and reliabilityCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionSpecialized enhanced impact proof touchscreen with PCAP touch control and IP65-rated front panelDiverse system including Type C connector with USB 3.2, DP 1.4a, 15W power deliverySupport TPM2.0 hardware securityIEC Ex & ATEX certification for Zone 2/22 criteria and Class I Division II explosion proof certification
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Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
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The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Intel® Core™ I Automation Computer With 4 PCI(E) Expansion Slots
UNO-3285G
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Intel® 6th Gen Core™ i7-6822EQ Quad Core Processors with 8GB DDR4 Memory2 x GbE, 6 x USB 3.0, 2 x RS-232/422/485, 2 x RS-232 (pin header), 1 x DVI-I, 1 x HDMI2 x PCIe x8, 2 x PCI, 2 x mPCIe (2 x full), 1x CFast, slot, 1 x mSATA slot (optional)Dual Hot-Swappable storage with thumb screw support for RAID 0/1Supports Fieldbus Protocol by iDoor TechnologyDual power input for power redundancyFront LED indicator design for monitoring system status
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Compact High-Performance IoT Gateway With NXP I.MX8M Quad Core Cortex A53, 2 LAN, 2 COM & 1 USB
ECU-150
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NXP i.MX8M Quad Core Cortex A53 1.3G CPUDDR4 2GB RAM, 16GB eMMC for system storage2 x RS-232/485 isolated serial ports2 x 10/100/1000 Ethernet ports1 x Mini-PCIe for WIFI/Cellular/4GSupport web service for remotely on-line monitoringSupport SD card & on-line firmware updateSupport Modbus, IEC-60870-5, DNP3.0, OPC-UA, BACNet protocol （ECU-150-12A1&ECU-150-12A1U need container EdgeLink）Support Data logger on SD card
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Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, LVDS And LAN
PICO511
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The PICO511 is an extremely compact Pico-ITX motherboard featuring the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U (codename: Kaby Lake). The feature-rich 2.5-inch embedded board is building flexible I/O interfaces through board to board connectors, wide temperature range in a small-form factor motherboard to fit different needs of many demanding applications in various industries. The PICO511 is perfect for system integrators who require an extremely compact embedded motherboard with great processing power and expansion capabilities. Its compact size form factor has ensured that it can fit into a variety of space constricting environments. In addition, the Intel® Kaby Lake-based motherboard was designed to withstand extreme temperatures, ranging from -20°C to +70°C (0°F to +158°F).
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PXIe-8830MC, Intel Core i7 Processor PXI MultiComputing Processing Module
783564-33
Processing Module
The PXIe‑8830mc allows two or more intelligent systems to exchange data using PCI Express technology. Featuring an Intel quad-core processor, the NI PXIe‑8830mc can be installed in any PXI Express peripheral slot. It runs on the LabVIEW Real‑Time OS and can act as a coprocessor to offload the processing from the main embedded controller in the system.
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Performance Core i7 Mission Computing Platform
ComSys-5362
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The ComSys-5362 is a rugged COTS based mission computer. A powerful yet power stingy 15W Intel Core™ i7 CPU supports signal processing for critical applications. Highly configurable, application-specific I/O. Removable drive bay for two 2.5“ SSDs.
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Compact, industrial thermal imaging core
Dione 1024 OEM Series
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The Dione 1024 OEM Series is based on a state-of-the-art detector with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35x35x21.5 mm3 and the weight is 25 gr.All Dione 1024 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 1024 OEM series find application in safety & security, transportation and process monitoring.
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8th Gen. Intel® Core I7/i5/i3/Celeron 3.5" SBC W/ MIOe
MIO-5373
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8th Gen. Intel Core Processor with Quad/Dual Cores, TDP 15WDual Channel DDR4-2400 up to 32GB, onboard eMMC up to 64GBTriple simultaneous displays by 48-bit LVDS/eDP+HDMI+DP2 GbE, 4 USB3.1, CAN Bus, M.2 M-Key 2280 supports NVMe, DC-in 12-24VSupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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IMB-C46
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ADLINK IMB-C46 ATX Motherboard: Robust Performance for Industrial Applications The ADLINK IMB-C46 ATX motherboard offers a powerful platform for diverse industrial applications, powered by Intel's reliable 10/11th Gen Core processors. Engineered with the versatile Q470 chipset, the IMB-C46 excels in delivering enhanced performance and scalability. This motherboard supports up to 128GB of DDR4 memory, providing a balance of speed and efficiency critical for process-intensive tasks in environments like smart manufacturing and industrial automation.
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THIN 1U Embedded PC - Intel® 8th Generation Desktop Core™ I3/i5/i7
EPC-T2286
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Thin design with 44.2mm in height.Support Intel® 8th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
Computer on Module
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
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The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
Industrial Computer
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-279
Motherboard
12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR4 3200MHz, max. 64GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power InputWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
Embedded Platform
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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High Core Density 2U Network Appliance With Security And Acceleration Features Ready. Ideal For Network Security And Crypto Acceleration Workloads.
FWA-6080
Network Appliance
Single AMD EPYC™ 7003 Processors, up to 64 Cores16 x DDR4 ECC RDIMM slotsHot-swap 2.5" disk bays and system fan, redundant PSU, 2 x HH/HL Gen4 PCIe x16 slotIntegrated security features with secure boot, memory encryption, and virtualizationIPMI v2.0 compliant, with web interface8 x Advantech network module expansions w/ PCIe Gen4 bandwidth
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
Embedded Platform
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784965-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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LV Iron Core Motor Starting Reactors
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Motor starting reactors are used to reduce voltage during starting of large 3 phase motors while limiting inrush currents.
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PPC-412
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12.1" XGA TFT LCD with resistive touchscreenIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system design1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3 x Independent displays1 x M.2 bay (2242) for storage only and support SATA RAID 0/1No RED CertificationSupports VESA 75 mounting interface
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Product
Modular TPC - Computing Box Module With Intel® Core™ Processors (10th Gen)
TPC-B610
Panel PC
High Performance Computing Box powered by Intel® 10th Gen. Core™ i CPU Socket (LGA1200) with fanless design6 x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR4) support up to 64GB in totalComprehensive I/Os, including 6 x USB, 2 x COM, 2 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x mPCIe, 2 x M.2 (NVMe, SATA, 5G)Supports Storage via 2 x 2.5" HDD/SSD (RAID 0/1), 2 x M.2 (2242/2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
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12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-208
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12th/13th/14th Gen Intel® Core™ Desktop Processors, max. 24Core, support H610E chipsetUp to 64GB DDR4 3200MT/s with two SO-DIMMPCIe x16 Gen4Triple independent displays with 2 DP, 1 HDMI, 1 LVDSRich expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen1x1 & 6 USB2.0, 2 SATA III and 6 COMWISE-DeviceOn and Embedded Software APIs
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Mini-ITX SBC With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® H81, HDMI/VGA/LVDS, Dual LANs And USB 3.0
MANO881
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The MANO881 Mini-ITX motherboard with Intel® H81 Express chipset supports the 4th generation Intel® Core™ and Celeron® (Haswell) processors. This feature-rich Industrial SBC has two sockets for DDR3 system memory of up to 16 GB. The high-performance mini-ITX motherboard MANO881 supports one PCIe x16 slot and integrated with Intel® HD 5000 graphics supports powerful graphic processing and dual-display capability through HDMI, VGA and LVDS interfaces. The outstanding embedded board also includes rich I/O expansions which can help system integrators to develop solutions quickly at a more competitive price. The MANO881 is excellent for in-vehicle PCs, medical imaging and gaming devices, in-flight entertainment systems, industrial automation systems, and other portable devices.
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Ultra-compact thermal imaging core
Dione 1024 CAM Series
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The Dione 1024 CAM series is based upon the Dione 1024 OEM thermal imaging core with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz.Dione 1024 CAM is a LWIR uncooled thermal imaging SWaP module with housing supporting M34/M45 lens (optional).Dione 1024 CAM series benefit from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and the availability of multiple lenses (optional) provides a high level of tunability for optimal integration into many systems.The compact Dione 1024 CAM series find applications in safety and security, transportation and industrial process monitoring.
