Image Processors
algorithmically enhances image characterization.
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EMCCD Image Sensors for Space and Ground-based Astronomy
EM (Electron Multiplication) is a technology that uses on-chip gain in the charge domain to effectively eliminate read noise from an image sensor. This enables advanced ultra-low light applications that require extreme sensitivity at fast frame rates such as adaptive optics and lucky imaging™.The combination of Teledyne e2v’s back-thinning technology and anti-reflection coatings enables industry leading quantum efficiency that can be optimised for applications in the visible, UV or NIR wavelength ranges.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® Q170, 2 HDMI, DisplayPort, 4 GbE LAN, 8 USB, 2 PCI Express Mini Card Slots
eBOX670-891-FL
The eBOX670-891-FL supports the 7th/6th generation Intel® Core™ i7/i5/i3 and Celeron® processors with flexible I/O configurations. This outstanding embedded box PC is equipped with dual DDR4-2133 SO-DIMM slots with system memory up to 32 GB. The eBOX670-891-FL provides high flexibility with reserved I/O module space on the rear side. The embedded system integrator can expand the system quickly and easily by installing suitable I/O modules. The fanless embedded box computer features wireless communication capabilities with two internal PCI Express Mini Card slots and one SIM card slot. Four Gigabit Ethernet ports are for customers who need mass data transmission or LAN port teaming functions for each virtual machine. For storage needs, it is equipped with one easy-access CFast™ socket, one mSATA interface, and dual 2.5” SATA hard drive bays with RAID 0&1 support.
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3U OpenVPX™ SOSA™-Aligned Single Board Computer Intel® Xeon® W Processor (Tiger Lake)
68INT6H
The 68INT6H is a SOSA™-aligned 3U OpenVPX Intel® Xeon® W Processor (Tiger Lake) w/ 8 Cores & 24 M Smart Cache running up to 2.6 GHz Single Board Computer that can be configured with up to two smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6H delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Preventive Maintenance Thermal Imaging Cameras
TC4/TC8 Series
The TC4 and TC8 series are the new Amperis thermographic cameras, with 160x120 and 384x288 sensors respectively. New concept of camera more ergonomic and practical that gives us an image with 3 million pixels and a 3.6" touch screen. It also incorporates the option of real time data transmission, very appreciated in the field of science and industrial control.
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2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC962-512-FL
The IPC962-512-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) with the Intel® Q170 chipset. It is equipped with dual DDR4-2133 SO-DIMM slots with up to 32GB system memory. The ultra-compact industrial computer supports two swappable 2.5" HDDs; moreover, it offers flexible expansion options with one I/O module slot and two PCI/PCIe slots. It also has a wide operating temperature range of -10°C to +60°C and a 24VDC (uMin=19V / uMax=30V) power input for severe environments. According to the features above, this rugged IP40 industrial PC is a great choice for a wide variety of Industrial IoT applications including automatic optical inspection, digital signage, motion control, and factory automation.
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OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
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Vehicle Imaging CMOS
AT Series
Starting from the automotive field with innovative performance and cutting-edge imaging technology , it covers and empowers the entire intelligent transportation system.
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I/Q and Image Reject Mixers
In-phase quadrature (I/Q) mixers and image reject mixers (IRM) offer a robust frequency mixing solution for applications that require high image rejection or sideband suppression. These mixers can be used as an upconverter or downcoverter. I/Q or IRM mixers use two double-balanced mixers with a 90° hybrid. The inherent architecture of I/Q mixers eliminates the resulting product due to image frequency during downconversion and allows the selection of desired sideband during upconversion.
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Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Gaming Platform Based On AMD® Ryzen V2000 Processors, Supporting Up To Eight Independent Displays, Including 4K UHD
ADi-SA3X-RZ
ADLINK‘s ADi-SA3X-RZ all-in-one gaming platform features powerful processing and graphics performance for gaming and retail. Equipped with AMD® Ryzen V2000 processors, the ADi-SA3X-RZ provides compelling graphics performance from a PCI Express 3.0x16 discrete graphics card and/or an AMD® Radeon™ Graphics supporting up to eight independent monitors.
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Modular 6U Processor Board
VP62109
LinkedHope Intelligent Technologies Co.,Ltd.
VP62109 is a 6U VPX board based on Intel® 4th Gen i3/i5/i7 2-core or 4-core embedded CPU, with modular design. Supporting up to 4-core Intel® i7 4860EQ processor, VP62109 is able to perform vector operation and floating-point arithmetic that require high throughput. Besides, VP62109 supports Intel® Turbo Boost, with the processing speed of CPU up to3.4GHz. The high-performance CPU and the Turbo Boost technology leave no worries for extra cost and complexity of system settings.VP62109 provides 4x PCIe 3.0 x4 for VPX Data Plane communication, 4x GbE for VPX Control Plane communication. Rich data exchange interfaces on VP62109 make it easy to build box-level or system-level solutions.
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Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, LVDS And LAN
PICO313
The PICO313 features the Intel® Pentium® processor N4200 or Celeron® processor N3350, aim at the entry-level market. It runs fanless, supporting +12VDC power input, slim I/O and extended temperature range. The Pico-ITX motherboard has one 204-pin DDR3L-1867 SO-DIMM socket with up to 8 GB memory. One full-size PCI Express Mini Card slot with support of mSATA and one half-size PCI Express Mini Card slot are available on the rear side of the board. Additionally, a pair of expansion connectors provides signals for one PCIe lane, one LPC, one DDI, four USB 3.0 ports, one SMBus, and one HD audio to meet different communications needs.
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ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Telematics And Connectivity Processors
ST develops and manufactures a broad range of components for automotive telematics systems, providing the ability to connect the car to a permanent communication infrastructure via the mobile phone network. Examples of telematics applications include popular insurance boxes, aftermarket and OEM systems for emergency calls and remote assistance to drivers as well as accessories for in-vehicle Wi-Fi hotspots and mobile device connectivity for head-up displays.
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PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN
SHB130
The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.
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Thermal Imaging Cameras (TIM)
TIM thermal imaging cameras are designed for non-contact measurement of surface temperatures from -20 °C to 2450 °C. They enable efficient monitoring and control of temperature-critical processes both with low temperatures (e.g. in cooling chains) and with very high temperatures (e.g. in glass and metal processing). Their high thermal sensitivity makes these infrared cameras ideally suitable for precise and dynamic tasks. Different performance classes enable a suitable model to be selected for every application. The camera is connected via a USB interface, which also supplies the power.
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Near IR Image Plates
The IR Display Plate is a versatile instrument that presents clear, high contrast images of all near IR laser beams. These displays are made on infrared sensitive phosphors which offer a variety of unique features, variable image retention times for pulsed lasers, high resolution for CW YAG, and a good response to gallium arsenide light-emitting diodes. All near IR lasers are capable of being displayed over a wide sensitivity range.
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ISC-1782, 2 MP, 1.58 GHz Processor, Monochrome/Color Smart Camera
785149-01
The ISC‑1782 is a high-performance smart camera for machine vision and is powered by a 1.58 GHz dual-core Intel Celeron processor. The combination of the onboard processor with a CMOS image sensor provides an easily distributed all-in-one system. In addition to high-performance image acquisition and processing, you can use built-in digital I/O and industrial communication options for dynamic, real-time communication and integration with industrial automation devices including programmable logic controllers (PLCs), human machine interfaces (HMIs), robotics, sensors, and industrial machinery. You can configure NI Smart Cameras with the included Vision Builder for Automated Inspection (AI) software or program the camera with the LabVIEW Real‑Time Module and the Vision Development Module.
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Compact, industrial thermal imaging core
Dione 1024 OEM Series
The Dione 1024 OEM Series is based on a state-of-the-art detector with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35x35x21.5 mm3 and the weight is 25 gr.All Dione 1024 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 1024 OEM series find application in safety & security, transportation and process monitoring.
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Intel Xeon E3 Processor, PCIe Gen3, 3U VPX
VPX756
The VPX756 is a Processor VPX (PrVPX) in 3U form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz.
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PICMG 1.3 Half-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1, LAN And DVI-I
SHB250R
*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 SO-DIMM for up to 64GB of memory*Supports M.2 slot (C246/Q370)*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported
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COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175
CEM510
The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
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VP E2x/msd, Intel® Atom™ Processor, Single or Dual Site PMC/XMC Controller
VP E2x/msd
The low power VP E2x/msd VME board is designed for long life-cycle use. With lots of I/O interfaces, it provides processing and graphics performance for existing VME systems and runs applications within seconds with the optional Fast Boot software.
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® H110, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, HDMI And MSATA
IMB501
The IMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® & Celeron® processors with Intel® H110 chipset. The IMB501 utilizes two high bandwidth 288-pin DDR4-2400/2133/1866 with system memory up to 32GB to meet the needs for high memory capacity and high data transfer speed. The upcoming industrial-grade ATX motherboard offers long-term support and upgradeability that can ensure the best performance and lifespan for its extended industrial computer system. To allow flexible and rapid development of custom functions, the industrial-grade ATX motherboard comes with rich expansion options including one PCIe x16 slot, two PCIe x4 slots (only support x1 signal), four PCI slots, and one PCI Express Mini Card slot. The ATX mainboard is suitable for industrial automation, factory automation, advanced communication, gaming, entertainment, POS/kiosk, surveillance, medical, just to name a few.
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Advanced Imaging
From customisable, metallised detector tiles to linear arrays of detector modules, Kromek are enhancing advanced imaging technology globally with our Cadmium Zinc Telluride (CZT) based solutions in the Medical and Industry & Security sectors.
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Digital Signal Processor Card
CHAMP-AV9
Curtiss-Wright Defense Solutions
The CHAMP-AV9 combines the floating point performance of the Intel Core i7 processors, with the substantial bandwidth and system-enabling features of the 6U OpenVPX form-factor. Providing a pair of quad-core 4th generation Core-i7 (Haswell) processors, featuring the updated AVX 2.0 instruction units and redesigned on-chip graphics execution units, the CHAMP-AV9 offers a 2-4X performance per size, weight and power improvement over previous DSP modules.
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ISC-1782, 2 MP, 1.58 GHz Processor, Monochrome/Color Smart Camera
785151-01
The ISC‑1782 is a high-performance smart camera for machine vision and is powered by a 1.58 GHz dual-core Intel Celeron processor. The combination of the onboard processor with a CMOS image sensor provides an easily distributed all-in-one system. In addition to high-performance image acquisition and processing, you can use built-in digital I/O and industrial communication options for dynamic, real-time communication and integration with industrial automation devices including programmable logic controllers (PLCs), human machine interfaces (HMIs), robotics, sensors, and industrial machinery. You can configure NI Smart Cameras with the included Vision Builder for Automated Inspection (AI) software or program the camera with the LabVIEW Real‑Time Module and the Vision Development Module.
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Open Pluggable Specification (OPS) Digital Signage Player With Intel® Celeron® Processor N3350 And TPM 2.0
OPS300-310
The OPS300-310 supports the Intel® Celeron® processor N3350 with turbo boost up to 2.4 GHz. Featuring fanless design, 4K ultra HD resolution and TPM 2.0, the OPS300-310 is suitable for multi-display solutions such as interactive whiteboard in meeting room and classroom, as well as digital signage in shopping mall, retail store, hospital, bank, restaurant, etc. It comes with one PCI Express Mini Card, one M.2 E key card, and one SIM slot for maximum expandability. The OPS300-310 is capable of triple independent displays with 4K resolution through DisplayPort, HDMI 2.0, and VGA ports.
