Image Processors
algorithmically enhances image characterization.
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Product
Intel Atom® X6000E Series, Pentium®, Celeron® N And J Series Processor
AIMB-218
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Supports Intel Pentium/Celeron processor (Elkhart Lake), N6210/N6211/J6412/J6413/J6426/x6413ETwo 260-pin SO-DIMM up to 32 GB DDR4 3200 MT/s SO-DIMMSupports, DP++ , HDMI, eDP(or LVDS)Supports 1x M.2 (B-Key) and 1x M.2 E-Key (or 1x PCIe x1 Gen3 ), 6 COM, 3 USB 3.2 Gen2x1 & 5 USB 2.0, dual LANLower total cost of ownership with DC12V support and onboard TPM2.0 (option) & Amplifier (option)Support SUSI, Ubuntu20.4, WISE-DeviceOn and Edge AI Suite
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Product
Compact Network Appliance Platform With Intel® Atom® Processor C3000 Family, Six GbE And Four SFP+ Ports
NA362 for vCPE
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*Intel® Atom® processor C3000 family (Denverton)*Four DDR4 R-DIMM up to 128GB or U-DIMM up to 64GB memory*Six 10/100/1000 Mbps Ethernet ports and four SFP+ ports*Wi-Fi/3G/LTE through PCI Express Mini Card slot*Supports Intel® QuickAssist Technology*Supports Intel® Data Plane Development Kit (Intel® DPDK)*Suitable for VPN, vRouter, firewall and other vCPE applications
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Product
Pico-ITX SBC With Intel® Pentium® N3710 & Celeron® N3060 Processor, HDMI (VGA)/LVDS, LAN And Audio
PICO300
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The PICO300, an extreme-compact fanless pico-ITX motherboard, is built with the Intel® Pentium® N3710 or Celeron® N3060 processor (codename: Braswell SoC). One SO-DIMM socket is provided to support up to 8GB of DDR3L-1600 memory. The PICO300 is supported in dual display configurations along with one 18/24-bit single/dual-channel LVDS and a choice of VGA or HDMI. Furthermore, the tiny 2.5” pico-ITX embedded board features Intel® integrated Gfx graphic engine to build excellent media and graphics performance capability. In addition, the compact size of the pico-ITX form factor also makes the PICO300 suitable for space-constrained embedded applications. It runs fanless operation, and supports -20°C to +60°C operating temperature. Combined all features as above, the PICO300 is ideal for any media editing, imaging, graphics and video intensive applications that be applied for a wide array of industrial IoT industries.
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Product
Thermal Imaging Camera
TI160 - P5
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TI 160-P5 is a special thermal imaging camera for human body temperature measurement only. Its has Accurate temperature measurement, real-time imaging, ability to quickly lock the hot-spot. It is been widely used in airports, docks,railway stations, schools, shopping malls and other public places to check human body temperature abnormalities. Palmetto design, compact and lightweight, integrated visible light function. Reliable performance and accurate temperature measurement can effectively improve the efficiency of detection.
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Product
Imaging Systems & Components
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Thorlabs offers a wide selection of laser scanning, widefield imaging, and OCT imaging systems, including multiphoton microscopes, confocal microscopes, electrophysiology rigs, swept-source OCT systems, and spectral-radar OCT systems.
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
3.5" Single Board Computer With Intel® N97 Processor
SBC35-ALN
Single Board Computer
SBC35-ALN, powered by Intel® N97 Processor, is exceptionally well-suited for a wide range of applications, specifically tailored for EV Chargers. This 3.5-inch Single Board Computer (SBC) from Intel's 13th generation excels in superior performance, power efficiency, and compatibility with cutting-edge technologies.
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Product
Updated Mini-ITX Embedded Board with 6th/7th Gen Intel Core i7/i5/i3, Pentium and Celeron Desktop Processor
AmITX-SL-G
Motherboard
The AmITX-SL-G is a Mini-ITX motherboard supporting the Desktop 6th Generation IntelR Core? i7/i5/i3 and PentiumR and CeleronR Processor with IntelR Q170/H110 Chipset. The AmITX-SL-G is specifically designed for customers who need high-level processing and graphics performance with a long product life solution.
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Product
Quad-Core Intel® Atom™ Processor 3U CompactPCI® Card
MIC-3329
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The Advantech MIC-3329 is based on Intel® Atom™ technology, previously codenamed Baytrail and is designed to provide balanced performance and power efficiency. The MIC-3329 is a 3U CompactPCI® processor blade designed for dual-core Intel® Atom E3826/E3827 and quad-core Intel® Atom E3845 processors, and up to 4GB soldered DDR3L-1066/1333 ECC memory. It is available in single and dual slot form factor, offering a range of I/O functionality by XTM (8HP) & Rear I/O extensions. Front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE ports (Switchable with RIO 4HP),1 x VGA port (Switchable with RIO 4HP), 1 x USB2.0 port and 1 x USB3.0 port. Front panel I/O on the second layer (XTM) provides 2 x COM ports (RS232/422/485), 1 x PS/2 KB/MS and 1 x Audio ports or 2 x M12 GbE ports, 1 x COM ports (RS232/422/485). The MIC-3329 provides an ideal solution for transportation, railway and factory automation applications. Its robust design from a layout and thermals perspective allows it to meet or exceed EN50155 and EN50121-4 using a very low TDP selection of 7W/8W/10W processors. Its low power consumption and industrial SoC features make the MIC-3329 a perfect fit for all fanless system applications.
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Product
15" XGA Elkhart Lake Thin-Client Terminal With Intel® Atom™/ Celeron® Processor
TPC-315 EHL
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Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight.Intel® Elkhart Lake (EHL) Atom™ 6425E 2.00 GHz quad-core / Celeron® J6412 2.00 GHz quad-core processor with 4 GB DDR4 SDRAM.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F).Front-facing LED indicators to show operating status.Built-in Advantech iDoor technology; SSD/HDD bay and VESA mount.Compact, fanless system with aluminum alloy front bezel and chassis grounding protection.Supports Advantech’s SNMP Subagent software.Supports Advantech’s WISE-PaaS/RMM remote management software.
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Product
COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
Computer on Module
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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Product
Thermal Imager with App
testo 868
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With the testo 868 thermal imager, we have developed a thermal imager which makes work quicker and easier without foregoing professional thermal imaging technology. You can generate error-free and objectively comparable infrared images using its handy functions. The IFOV warner, testo -Assist and testo ScaleAssist mean you can avoid measurement errors and not only effortlessly achieve optimum setting of emissivity () and reflected temperature (RTC) for building thermography, but also of colour scale.
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Product
Thermal Imager with App
testo 872
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The testo 872 thermal imager is ideally suited for professional industrial and building thermography - at the same time it ensures your work is both quick and easy. It is versatile to use, for example in industrial and mechanical maintenance or for detecting structural defects. You can generate error-free and objectively comparable infrared images using its handy functions. The IFOV warner, testo -Assist and testo ScaleAssist mean you can avoid measurement errors and not only effortlessly achieve optimum setting of emissivity () and reflected temperature (RTC) for building thermography, but also of thermal image scale.
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Product
Digital Image Correlation (DIC) Measurement System
EduDIC
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EduDIC is a complete Digital Image Correlation (DIC) measurement system, designed as a simple and convenient educational training tool for academic courses in experimental solid mechanics. This easy-to-use system allows academic instructors to effectively present the optical measurement technique of DIC for materials testing to the engineers and scientists of tomorrow.
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Product
Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
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The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784970-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
Optical Coherence Tomography Imaging Line Scan Cameras
OctoPlus Range
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Teledyne e2v spent 2 years developing a CMOS sensor specifically for OCT. This resulted in the launch of OctoPlus, which has a specially designed pixel architecture that improves sensitivity and reduces signal roll-off to improve image quality by several dB vs state-of-the-art CMOS cameras, especially in deep structures.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
COM Express basic Type 7 with Intel Atom processor
COMe-bDV7
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The COM Express module COMe-bDV7 based on the Intel Atom processor C3000 series extends Kontron's product family of server-grade COM platforms. The COMe-bDV7 as an entry level platform is as a complementary product to the high performance class COMe-bBD7 equipped with the Intel Xeon processor D-1500 series. The COMe-bDV7 module features scalable CPU performance with up to 16 cores.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
Motherboard
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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Product
COM Express Type 6 Compact Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM313
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The CEM313, a COM Express® Type 6 compact module, is built with the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the COM Express® type 6 module prevails in its excellent graphics performance while supporting DX12.0, OCL 2.0, OGL 4.3 with resolution up to 4K (3840 x 2160 @ 30 Hz). Furthermore, two 204-pin SO-DIMM DDR3L-1600 have been deployed in the CEM313 up to a maximum of 8 GB Overall. With the innovative design of low power consumption, wide temperature range, and seismic resistance, the CEM313 can be served as an excellent solution for graphics-intensive applications over the IIoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Long-range Surveillance Thermal Imaging Camera
IRT303
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Wuhan JOHO Technology Co., Ltd
Long-range Surveillance Thermal Imaging Camera IRT303IRT303 is extremely compact, durable uncooled day/night system, operating in 8-14 um waveband, with DDE image processing technology and high sensitivity, it is ideal for quick and accurate situational awareness in a variety of defense and security applications. It specially equipped with Dual-FOV, the wide FOV for find object in wide scope and then fast switch to narrow FOV looking at the target for details. IRT303 is the optimal device for super long observation purpose and target acquisition.ApplicationsLong distance surveillance or patrolLand border and coast surveillanceMarine navigation or rescueTechnical DataDetector Detector material Uncooled FPA Spectral range 8~14 m Pixels 320x240 Pitch 38 mx38 m NETD 50mK@25 C (f/0.7) Optics Lens 135mm/45mm FOV 5.2 3.9 /15.4 11.6 Focusing Motorized Optional lens 100mm/25mm, 120mm/40mm, 150mm/50mm, 180mm/60mm Image Presentation Video output 25Hz PAL/30Hz NTSC Electronic Zoom x2 Polarity BH/WH inverse Brightness & Contrast Auto/ Manual Gain Composition Auto/ Manual Power system Power supply 110~240VAC 9~14VDC (typical: 12VDC) Interfaces Command interface RS232 /RS485/ RS422 alternative Digital video interface(Optional ) Ethernet/LVDS/CameraLink Environmental Ambient temperature -40 C~+60 C Storage temperature -45 C~+60 C Range Performance Detection Range (2.3mx2.3m vehicle) 5500m Recognition Range (2.3mx2.3m vehiclet) 1800m Detection Range (1.8mx0.5m human) 2200m Recognition Range (1.8x0.5m human) 580m
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Product
1.3 Million Pixel CMOS Image Sensor
Sapphire 1.3M
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This 1.3 million pixel Sapphire CMOS image sensor, designed on Teledyne e2v’s proprietary Eye-On-Si CMOS imaging technology, is ideal for diverse applications where superior performance is required. The innovative pixel design offers excellent performance in low-light conditions with both electronic rolling shutter and electronic global shutter, with a high-readout speed of 60 fps in full resolution. Novel industrial machine vision application features such as multi ROI and histogram output are embedded on-chip. Very low power consumption enables this device to be used in battery powered applications.
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Product
Vehicle Imaging CMOS
AT Series
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Starting from the automotive field with innovative performance and cutting-edge imaging technology , it covers and empowers the entire intelligent transportation system.
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Product
8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - 3U VPX
Model 5950
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- Now available in RFSoC Gen 3 with the Model 5953- Multi-board synchronization with Quartz RFSoC video- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6001 QuartzXM- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX
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Product
Intel Xeon E3 Processor AMC, SRIO Gen2
AMC759
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The AMC759 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.2, AMC.3 and AMC.4 specifications.
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Product
11.6" All-In-One Panel PC With Rockchip 3399 Processor
PPC-112W
Panel PC
True flat wide display screen with Pcap multi-touchEmbedded Rockchip RK3399 processor, Dual-core Cortex-A72 up to 1.8GHz and Quad-core Cortex-A53 up to 1.4GHzOnboard 4GB LPDDR4-1333 memory, 32GB eMMC NAND FlashIP65 rated front panel protectionSupports VESA 100 and panel mounting(optional)Supports Android and Debian
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Product
Terahertz imaging cameras
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Operates at frequencies (0.05 - 0.7 THz), where most common materials are transparent. Different models are available: 256 pixels; 1024 pixels; 4096 pixels - to accomodate any budget. USB feeding and programming.
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Product
OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
Computer on Module
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
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Product
Architecture P4040/4080 Processor
VME-186
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Curtiss-Wright Defense Solutions
The VME-186 VME Single Board Computer is based on NXP's high-performance QorIQ P4080 SOC multi-core processor. With four or eight Power Architecture cores running up to 1.5 GHz, and up to 8 GB of high bandwidth DDR3 SDRAM, the VME-186 SBC provides processing and a variety I/O interfaces to satisfy the most demanding requirements of embedded computing.
