Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
- Pickering Interfaces Inc.
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LXI Low Thermal EMF Matrix 1-pole 56x33
60-510-001
The 60-510 is a high density 1-pole matrix module controlled via LXI. It has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix. Typical applications include signal routing in ATE, selecting thermocouple inputs, switching amplifier gain circuits and high accuracy DC micro-volt measurements. Ruthenium reed switches are used because of their good low level switching capability. They also have a very long life with excellent contact resistance stability, minimal wetting current and low thermal offset.
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Chamber/Pyroelectric Task
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization respo...show more -
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Probe Station
ETCP1000
Installation of “Hot and cool chuck” - Sellectable chuck size : 4inch, 6inch. - Temperature variation : -193°C ~ 300°C (80K ~ 573K) - Additional requirements : Vacuum chamber, LN2 tank(Bombei), microscope, CCD camera, manipulators. - EPS500 is standard model in ETCP1000 probe station.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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High Temperature Chucks
High temperature electrostatic chucks are available for the ranges -60 to +400 deg. C, and for 350 to 600 deg. C. Different materials and constructions are used in these two ranges.
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Vacuum Chuck Temperature Controlled Test Stations
These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Semi-Automatic Probe Station
P300A
The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Electrostatic Chucks
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Thermal Imaging
JOHO272
Wuhan JOHO Technology Co., Ltd
With innovative design and superior functions, this thermal weapon sight sets a new standard to build in an eye-safe laser ranger finder which you can get target distance very easily. The thermal aiming and laser ranging scale line would be changing smaller as distance further so that the shooter would easily and quickly lock target even in a further distance. To improve shooting percentage, as many as ammunition drop chart can be input to the sight program. Should any drop chart be selected, th...show more -
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Standard Probe Station Chucks & Accessories
In this test solutions section of our website we describe the expanding line of Abet PV IV probe stations for the growing variety of solar cell types and sizes being developed around the world. This page describes a line of vacuum chucks and accessories for top/bottom, top/top, and bottom/bottom solar cells from 3 x 3 mm to 300 x 300 mm. Probe stations for multiple device on a single substrate and multifunction probe stations are described further in the sections highlighted to the left of this page.
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Glass-Gripping Chucks
Electrogrip is able to grip through one substrate to grip a second masking substrate.
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Thermal Software
ThetaCalc
Thermal Engineering Associates, Inc.
A tool designed to provide a quick estimate of the temperature and thermal resistance from a heat source to a reference heat sink. It also shows the temperature and thermal resistance value of each layer in the heat flow path. The program can accomodate up to ten layers of different materials of varying dimensions between the heat source and sink. The heat spreading angle can be set independently for each layer to a value between 0 and 45 degrees; the tool will automatically determine if heat flow reaches the layer edge and then convert to columnar flow.
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Thermal needle system thermal resistivity / conductivity measurement
MTN01
Hukseflux Thermal Sensors B.V.
The MTN01 Multi-purpose Thermal Needle System allows performing fast measurements of the thermal resistivity or conductivity of soils. It is specifically designed to be reasonably robust, as well as accurate. It is therefore suitable for laboratory as well as field- measurements of soil thermal properties. The sensor is a Non-Steady-State Probe (NSSP), TP07, which is mounted on the Insertion Tool, IT02. The system is operated using a hand-held Control and Readout Unit CRU01.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Thermal Data Logger
51101 Series
It is a general requirement to record temperatures, voltages, currents, and many physics quantities during research, product development, productions, and quality assurance processes. The number of record channels can be a simple one to several complicated set of hundreds. Thermal/multi-function data loggers are prefect solutions to serve for these measurement and tracking needs.
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Thermal Platforms
Thermal Platforms are perfect for using conductive transfer to test components hot and cold, they work best for parts with a low or flat physical profile. They transfer heat outstandingly for programmed or very rapid heating and cooling transition times (that’s why they’re called hot plates or cold plates as well), and have a precise temperature control every time from cryogenic temperatures to extremely hot
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Thermal Testing
At E-Labs, Inc., we support thermal cycling and thermal bakeout vacuum testing requirements. During thermal cycling, the unit experiences repeated heating and cooling as it would when exposed to the harsh environment of space. During thermal bakeout, flight equipment is subjected to an outgassing reduction process so as to decrease the chance of molecular contamination of the spacecraft instrumentation.
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Thermal Enclosures
LDP
Bemco LDP Thermal Enclosures are always custom. They are environmental enclosures constructed using the techniques normally employed with Bemco's LDF Series of Wide Range Expendable Refrigerant, FL-I Series of Integral Walk-in, and FL-M Series of Modular Walk-in Chambers. The LDP enclosure illustrated at left has hinged stainless steel doors, with the protective paper still in place, and hinged sides to allow full interior access.
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Metal Foil Chucks
Electrostatic chucks are the most reliable solution for gripping delicate, microfabricated metal foils - even in air. These chucks induce no distortion, are easily cleaned, are amazingly robust, economically priced, and exhibit uniform grip forces over their entire area.
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Thermal Camera for Drones
FLIR Vue Pro
Designed for professional use, FLIR Vue Pro is more than a thermal camera, it is a thermal measurement instrument and data recorder that adds tremendous value to your sUAS operations and services.
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Thermal Imager with App
testo 872
The testo 872 thermal imager is ideally suited for professional industrial and building thermography - at the same time it ensures your work is both quick and easy. It is versatile to use, for example in industrial and mechanical maintenance or for detecting structural defects. You can generate error-free and objectively comparable infrared images using its handy functions. The IFOV warner, testo -Assist and testo ScaleAssist mean you can avoid measurement errors and not only effortlessly achieve optimum setting of emissivity () and reflected temperature (RTC) for building thermography, but also of thermal image scale.
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Thermal Analysis
The TORC (Thermo-optical Oscillating Refraction Characterization) technique applies decades of know-how in optical instrumentation to thermal analysis in a novel and unique way. The technique requires minimal sample preparation at maximal tolerance for sample properties. You can determine the coefficient of thermal expansion, glass and phase transitions as well as polymerization for various samples: liquids, gels, pastes, and certain solids. For example: cured and uncured resins, adhesives, glues, etc. can easily be characterized. Both thermal and time-dependent processes can be monitored with minimal effort.
