Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
- Pickering Interfaces Inc.
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LXI Low Thermal EMF Matrix 1-pole 56x33
60-510-001
The 60-510 is a high density 1-pole matrix module controlled via LXI. It has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix. Typical applications include signal routing in ATE, selecting thermocouple inputs, switching amplifier gain circuits and high accuracy DC micro-volt measurements. Ruthenium reed switches are used because of their good low level switching capability. They also have a very long life with excellent contact resistance stability, minimal wetting current and low thermal offset.
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Vacuum Chuck Temperature Controlled Test Stations
These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Probe Station
ETCP1000
Installation of “Hot and cool chuck” - Sellectable chuck size : 4inch, 6inch. - Temperature variation : -193°C ~ 300°C (80K ~ 573K) - Additional requirements : Vacuum chamber, LN2 tank(Bombei), microscope, CCD camera, manipulators. - EPS500 is standard model in ETCP1000 probe station.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Semi-Automatic Probe Station
P300A
The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Chamber/Pyroelectric Task
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization respo...show more -
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Hot Chucks
Materials Development Corporation
Probe stations to suit all measurement requirementswhether production, engineering or research. See individual data sheets for more details.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Thermal cameras
SKF Condition Monitoring Center
Using an SKF Thermal Camera is a proactive way to help you detect problems before they occur, increasing uptime and improving safety. They allow you to be able to visualise potential problems, invisible to the naked eye, by presenting a picture of the heat distribution of an asset. The thermal image, presented on a large LCD screen, shows you where the temperature is either too hot or too cold allowing you to pinpoint potential problems fast.
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Thermal Enclosures
LDP
Bemco LDP Thermal Enclosures are always custom. They are environmental enclosures constructed using the techniques normally employed with Bemco's LDF Series of Wide Range Expendable Refrigerant, FL-I Series of Integral Walk-in, and FL-M Series of Modular Walk-in Chambers. The LDP enclosure illustrated at left has hinged stainless steel doors, with the protective paper still in place, and hinged sides to allow full interior access.
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±3 kV Electrostatic Chuck Supply
Model 646
Trek’s Model 646 software-driven Electrostatic Chuck Supply offers an array of features that provide significant benefits while accommodating a variety of demanding applications. Model 646 incorporates Trek technology which has demonstrated increases in efficiency and throughput equal to three times that of other supplies. Virtual elimination of sticky wafer and wafer popping issues ensures better control over particle contamination. Given the versatility and performance of the Model 646, it can be used in multiple unique tools/processes, thus eliminating the need to specify a new supply for each unique tool/process in a facility.
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Thermal Imagers
Klein Tools’ thermal imagers allow electricians, plumbers, HVAC professionals, home inspectors and other trade professionals to verify systems and troubleshoot problems needing maintenance based on hot and cold spots displayed on LCD.
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Thermal Profiling System
lt is impossible to have dependable production without quality management. The expectation is growing and customers requirements must be addressed. In most of the industries, proper monitoring of temperature with time plays an important role in the quality of products. Whether it can be painted/powder coating industries, oven manufactures, automobile industries, and many more.
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Thermal FFF
TF2000
The new award winning Postnova TF2000 Thermal FFF Series was invented to become the first professional modular Thermal FFF system available. It is completely integrated by the NovaFFF single software platform which runs the entire system from autosampler to detectors. The TF2000 Series incorporates the combined solid know-how and the proven technologies from three decades of leadership in FFF. Due to its unique design, the TF2000 Thermal FFF system offers more flexibility, higher robustness and ...show more -
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Thermal Conductivity Analyzers
Teledyne Analytical Instruments
Thermal Conductivity Analyzers by Teledyne Analytical Instruments
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Thermal Imaging Core
JOHO336CM_A00
Wuhan JOHO Technology Co., Ltd
JOHO336CM_A00 is a high sensitivity, high reliability uncooled thermal imaging core . With advanced image processing technology, it offers excellent image quality by 320x240 resolution,17m pitch sensor. Featuring of compact design and ultra low power.
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Thermal Analysis
The TORC (Thermo-optical Oscillating Refraction Characterization) technique applies decades of know-how in optical instrumentation to thermal analysis in a novel and unique way. The technique requires minimal sample preparation at maximal tolerance for sample properties. You can determine the coefficient of thermal expansion, glass and phase transitions as well as polymerization for various samples: liquids, gels, pastes, and certain solids. For example: cured and uncured resins, adhesives, glues, etc. can easily be characterized. Both thermal and time-dependent processes can be monitored with minimal effort.
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Thermal Camera for Drones
FLIR Vue Pro
Designed for professional use, FLIR Vue Pro is more than a thermal camera, it is a thermal measurement instrument and data recorder that adds tremendous value to your sUAS operations and services.
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Thermal Imaging Core
Zhejiang ULIRvisionTechnology Co., LTD
Infrared thermal imaging technology is now more and more widely used in many different areas around the world, such as the security monitoring, industrial detection, the autonomous vehicle auxiliary market, iron industry and so on. Choosing the most suitable thermal imaging core is choosing half the right Infrared thermal imager. Therefore, how to choose the highly qualified infrared thermal imaging core is very important.
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Thermal Shock Chamber
The Thermal Shock Chamber is specially designedwith independant temperature zones to facilitatethe automatic transfer of product under testthereby simulating a temperature shock to test the reliability of the product as per military and other international standards.
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Electrostatic Chuck Optimizer
Model 640
Trek’s Model 640 Electrostatic Chuck Optimizer system is a diagnostic tool which enables evaluation and optimization of waveforms/voltages for electrostatic chucks/clamps in order to minimize de-clamp time, maximize clamp force, and achieve optimum wafer processing for ESC systems. Model 640 combines two amplifiers (for two-phase voltage combinations) and a waveform generator, which can be independently programmed and configured to investigate, research, and discover the perfect power supply and waveform recipe to efficiently drive an ESC application. An electrostatic voltmeter (ESVM) is included to monitor residual voltage from the clamping/de-clamping process.
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Thermal Shock
Trialon routinely test products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Thermal Management
Our air cooling components dissipating heat to the ambient air comprise high-performance heat sinks, general purpose DC fans and AC fans for forced air ventilation, as well as filter fans with exchangeable exhaust filter inserts that ensure clean and reliable air exchange in cabinets.
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Thermal Tools
BMP Testing and Calibration Services Inc.
BMP Testing and Calibration Services, Inc. utilizes the latest thermal measurement equipment to analyze low to medium-conductivity materials, from ceramics, plastics, and polymers to coatings, composites, liquids, and building materials.
