SEMI members help achieve the dramatic cost reductions and performance improvements in semiconductors that have profoundly shaped and improved our lives. Especially in the capital and technology-intensive wafer processing equipment and materials industry, organized and collective industry action is a vital industry requirement.
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
Available exclusively through our partner Ricmar, the F80-a integrates full F80 functionality with Ricmar's WTT 300 Wafer Transfer Tool. The result is dual-purpose functionality in a single affordable EFEM platform.
Our cabled interface brings all of the ATE resources to the probe card through a variety of cable assembly types. An important benefit of a cabled interface is that it creates a universal connector set which you can easily adapt to different test systems and configurations.
Temptronic ThermoChucks are conductive heating and cooling systems for wafer testing at temperature. Its primarily use is for wafer testing in Probe Stations, as well as Laser Trim and Wafer Burn-in. A few specialized applications include Low leakage probing (fA level), and High voltage probing (up to 10kV). -65C to +300°C 150mm, 200mm & 300mm
This is a double side wafer prober, developed to be a low-cost manual version of the WS50. All checks, from mounting the wafer to driving the stages, including checks for the positioning of pins, the pressure of pins on the chip, and scrub mark, can be performed manually.
The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
SemiProbe's family of IRIS Wafer Inspection System (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die. With the intuitive PILOT control software, the user has the ability to create single and double sided wafer maps, bin and save the results, as well as ink. Built using the patented PS4L adaptive archit...
* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
A palm-sized PLC with a built-in Operator Panel. The panel offers a graphic display screen and keypad. The Graphic HMI display screen can show images, text, and graphs according to real-time parameters. It can also display graphs based on historical values, to reflect trends of recorded data.