Thin titanium dioxide/platinum films for bottom electrodes deposited on four-inch silicon wafers. The platinum films can withstand up to 750°C in oxygen for one hour with no roughening or hillock formation. Radiant will coat the electrode with 20/80 PZT or 4/20/80 PNZT if requested.
The McBain WL150 and WL200 Series Wafer Handler is a safe, semi-automatic wafer loader designed to use with virtually all major microscopes, optics and inspection devices. It is a portable, economically priced tool which serves as a direct replacement for the Irvine Optical Ultrastation systems. The WL Wafer Handler, available in two configurations to handle 3" to 6" wafers or 4" to 8" wafer sizes, is designed for easy operation, seamless integration, and consistent, reliable handling for labs a...
The MicroINSPECT 300 FA is a multipurpose semiconductor wafer defect review and failure analysis inspection tool that recognizes wafers up to 300 mm. Open FOUP, FOSB, crystal Pak and 300mm cassettes with one tool! MicroINSPECT 300 FA is also a complete wafer sorter.
Semi-auto 4-point probe system for solar cell, thin film on substrate samples multi-points measurement Even pitch and random pitch for Max.1,000 points 2-D/3-D square mapping software for even pitch 2-D pseude square mapping software (option)
High speed and high sensitivity EB wafer inspection system for 45 nm and beyond. New electron optics and advanced image processing system have realized high speed and high sensitivity inspection as well as excellent measurement repeatability with enhanced VC (Voltage Contrast). Real-time Automatic Defect Classification function is also available.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection.
For high reliability wafer transfer with a minimum of human interaction, MGI's EET 1000 and 2000 mass wafer transfer system combines solid state technology, robotic control interfaces and precision stepper motor positioning to move wafers from carrier to carrier.
Employing proprietary optical scanning technology, the CP7300 provides fast, noncontact, automated 3D surface height, roughness, and local area planarity and uniformity measurements on wafers for rapid, quantitative characterization of photo-lithographic, etch, and polishing process effects.
The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
Our cabled interface brings all of the ATE resources to the probe card through a variety of cable assembly types. An important benefit of a cabled interface is that it creates a universal connector set which you can easily adapt to different test systems and configurations.
SemiProbe's family of IRIS Wafer Inspection System (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die. With the intuitive PILOT control software, the user has the ability to create single and double sided wafer maps, bin and save the results, as well as ink. Built using the patented PS4L adaptive archit...
LS6800 are capable of detecting smaller than 40 nm defects on unpatterned wafers with high sensitivity and throughput. Those tools support yield enhancement through high precision discrimination and detection of COP defects, particles, CMP scratches and particles.
Integrated with 2D Geometry, Surface, Micro Crack, Saw mark inspection system and Resistively & Thickness, Lifetime tester by customer defined, Chroma 3710HS is a fully user configuration wafer sorter system with very low breakage rate and high through put. Chroma 3710HS solar wafer inspection system is ideal for PV incoming process. Plus wafer can be sorted by user defined algorithm fully automatically into coin stack or cassette. The unique auto coin stack/cassette exchange feature eliminates ...
The Prior Scientific motorized Shuttle Stage is designed to be used with the Nikon and Olympus wafer loader systems for 3, 4, 6, and 8 inch wafers. The system greatly reduces operator fatigue while increasing inspection accuracy and repeatability.
For chipmakers that want to maximize their investment in 200mm test equipment, accurate and reliable high-volume probing is more important than ever. The 4090µ+ is designed to meet these demands while reducing test costs through increased throughput, simplified operation and state-of-the-art automation.
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
Available exclusively through our partner Ricmar, the F80-a integrates full F80 functionality with Ricmar's WTT 300 Wafer Transfer Tool. The result is dual-purpose functionality in a single affordable EFEM platform.