Wafer - aka Semiconductor Substrate,Solar Cell Substrate
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WS51 - Double Side Wafer Prober This is a double side wafer prober, developed to be a low-cost manual version of the WS50. All checks, from mounting the wafer to driving the stages, including checks for the positioning of pins, the pressure of pins on the chip, and scrub mark, can be performed manually.
WT-2000 - Multifunction Wafer Mapping Tool The WT-2000 is a powerful tabletop measurement platform for performing many different semiconductor material characterization measurements.
IS3000 - Dark Field Wafer Defect Inspection System Dark field wafer inspection system for 45 nm generation
Effective for yield enhancement by the high sensitivity / high speed inspection capabilities. Superior cost effective inspection tool. DFC (Dark field real time classification)
Recipe set up in minutes. Precise coordinate system for SEM review.
e-Xplorer™ - surface metrology for semiconductor wafers Currently undergoing advanced R&D field testing, the e-Xplorer system is designed to help increase precision and reduce costs in manufacturing semiconductor wafers. Its outstanding nanometric sensitivity enables the system to detect even the most elusive defects in form and planeness on wafers up to six inches in diameter. An optional zoom x3 option allows you to significantly increase the system's lateral resolution without compromising precision.
300 FA - Automated 300mm Wafer Inspection System The 300FA Automated Failure Analysis system integrates more applications with ergonomic ease of operation. A small footprint, high speed, low cost per feature and serviceability contribute to its award winning CoO.
ANTARES - Automatic Detection of Cracks in Wafer and Cells Microcrack detection is an important tool for wafer, cell and module production. With the new ANTARES system, a reliable tool for automatic detection of cracks in single wafers and cells is available. A similar technology, working on stacks of wafers and cells, has been shown at the Photovoltaic Technology Show in April this year.
WaferCommander - Wafer Data Interface & Management Software Wafer Data Interface & Management Software. WaferCommander is a standalone application used to define and identify (by the assigned filename) the basic parameters of individual wafer types. WaferCommander is used to introduce wafer types into the ProbeCommander system and provides an efficient means for storing, cataloging and recalling wafer characteristics such as repeat distances.
Wafer Thickness, TTV, Bow and Warpage ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
WaferScan™ - Wafer Bow & Warp Geometry WaferScan utilizes Tamar's proprietary Optical Stylus (patent pending) technology to measure the thickness, warp, bow and other shape features of wafers, with high data density and high throughput. WaferScan allows the user to acquire thousands of data points on the surface and can measure thickness of conventional wafers as well as thin wafers and of any material.
Wafer Test We are ready to help you with your wafer test application needs. Whether your project calls for custom turn-key components or your own supplied materials, we can help. Please fill out the applications form to the right and we will contact you immediately.
BD-12 - Wafer Probing Huged-Knob Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Platen Linear Quick Up/Down Easy Load/Unload wafer Platen Linear Fine Up/Down Probe Card Tip Overdrive Adjustment Choice Of Microscope (Tilt) Up/Down For E-Z Revoliving Objectives
Surfscan SP2XP - Wafer Surface Inspection System The Surfscan SP2XPwafer surface inspection system is the unpatterned wafer inspection system best designed for all types of bare wafer substrates, including prime silicon wafers, epitaxial, SOI (silicon-on-insulator) and engineered substrates, to meet 45nm IC manufacturing requirements.
HED-W5000M - Wafer ESD Tester Real device's ESD waveform The real device's ESD waveform can be displayed. ◆On wafer, assured waveform Standard waveform for HBM/MM is assumed on wafer. ◆Realization to achieve the automatic destruction judgment of just after zap Allows to implement the destruction judgment by Vf/If measurement after pulsing ◆Easy to selection between pin and pin It is possible to make a positioning of any two pins by using manipulator.
6EC 200MM WWD - Wafer Failure Analysis Strasbaugh's 6EC CMP system is an excellent tool for WholeWaferDeconstruct™, a whole wafer sample preparation technique for frontside failure analysis. Its semi-automatic operations are programmable through a color, touch-screen GUI for repeatable and accurate process control.
02-0000-02-00 - Wafer optical and geometry inspection system The ATM optical and geometry inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in wafers for solar production application.
Model 3710-HS - Solar Wafer Inspection System Integrated with 2D Geometry, Surface, Micro Crack, Saw mark inspection system and Resistively & Thickness, Lifetime tester by customer defined, Chroma 3710HS is a fully user configuration wafer sorter system with very low breakage rate and high through put.
GB4P Robot System - wafer handling The GB4P Robot System with integral wafer pre-aligner is the most compact robot and pre-aligner package available on the market today for wafer handling applications up to 200mm, standard payload and throughput. Identical in size to Genmark's original GB4 robot, the GB4P houses a built-in pre-aligner for wafers ranging from 2"- 8" in diameter. The adjustable feature on the pre-aligner allows for simple and fast configuration for different wafer sizes. Engineered for single or dual wafer transport, the GB4P robot is available with an extensive variety of reach and vertical stroke combinations. Genmark's GB4P Robot System is a highly accurate, repeatable, and reliable wafer handling and aligning solution for wafer sizes up to 200mm.
Model 323 - Wafer Area Prober The Model 323, Wafer Area Prober System is designed to work with wafers up to 300 mm (12"). The system is available with integrated video microscope and specially designed dark box to make for easy access and small footprint.
Wafer Probe Integra has the engineering talent, equipment and processes in place to support all probe services, including software development, probe card design / fab, debug and production probing. We are a one stop shop for all your probe card design, fabrication, verification and production needs.
AutoWafer™ - Ultrasonic Wafer Scan AutoWafer is an excellent scanning tool for development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects.
EX-QS - Wafer Mapping Sensors EX-Q wafer mapping sensors represent a dramatic improvement in wafer mapping detection. Consistent apparent wafer thickness provides detection performance previously only thought possible with through beam sensors. EX-Q sensors have ample detection headroom (sensitivity) to detect the darkest and/or most extreme wafers now and in the future. EX-QS is an EX-Q repackaged in a smaller case to accomodate applications where space is limited.
N-PAF - Operation Support System for Wafer Prober N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
Wafer Grinding KYEC provides wafer grinding services for silicon wafers, including gold and solder bumped wafers. Our core strengths are on wafer grinding includes: Grinding thickness: Mass Production: 4 mils for 6" and 8? wafers, 8 mils for 12? wafers. Engineering capability: 2 mils for 6? and 8? wafers, 2 mils for 12? wafers
EG6000 - Wafer Probers Volume 300mm production demands probing that packages reliability, accuracy, automation and throughput. Electroglas' flagship prober, the EG6000, responds to this challenge by providing the world's fastest, most accurate and most reliable 300mm production probing solution.
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Wafer - thin crystalline material sliced from ingot.
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