Thin titanium dioxide/platinum films for bottom electrodes deposited on four-inch silicon wafers. The platinum films can withstand up to 750°C in oxygen for one hour with no roughening or hillock formation. Radiant will coat the electrode with 20/80 PZT or 4/20/80 PNZT if requested.
The MicroSense PV-6060 is a high accuracy metrology module that offers unparalleled throughput and stability for measurement of solar wafer thickness, wafer total thickness variation (TTV) and wafer resistivity. All measurements are completely non-contact with real time analog outputs, for high throughput without wafer breakage. Designed for simple integration into automated wafer transports, the PV-6060 is intended for use by OEMs manufacturing in-line solar wafer inspection and sorting systems...
The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
The ESI 9900 is the first production-ready, fully automated wafer dicing system that uses proprietary, laser-based technology to quickly and efficiently dice ultra-thin wafers (<50 microns). The 9900 reliably yields die that can withstand the rigors of advanced packaging requirements
The n&k OptiPrime-TF, OptiPrime-TF-M and n&k LittleFoot-TF are DUV-Vis-NIR thin film only metrology systems, based on unpolarized Reflectance (R) measurements from 190nm to 1000nm with microspot technology. These tools measure thickness and n and k spectra from 190nm – 1000nm of thin films on patterned and unpatterned wafers.
TrueScale™ probe technology for advanced wire bond logic and SoC devices delivers high-efficiency, high-parallelism, cost-effective wafer test in fab environments with production rates of millions of units. Scalable down to 40 micron pad pitch, the TrueScale PP40 wafer probe card expands parallelism of advanced tester equipment, requires no spring positioning adjustments and minimal maintenance.
The WaferCheck 150 system is a complete and easy-to-use system for Time-resolved Photoluminescence (TRPL) measurements. TRPL is a very powerful tool for the contact free characterization and investigation of semiconductor materials.
The WT-1000 is provided for fast, non-contact carrier lifetime measurement method that is capable of characterizing silicon material in each process step of solar cell manufacturing from as-cut wafer to the finished solar cell. WT-1000b is a model for block measurements
The Signatone QuadPro Process Development Resistivity System is available in both manual and automatic 8" and 12" systems. The software allows for selecting 1, 5, 9, 25 or 49 points for automated testing and mapping of the test sample. Can automatically step through 9, 25, 49, or 121 test points on wafers of size 100 mm, 125 mm, 150 mm, 200 mm, or 300mm.
AutoWafer is an excellent scanning tool for development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects.
With extensive analysis capabilities at both the wafer and device level, there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling, AutoWafer Pro supports 100% inspection for improved yields and a faster time to market.
Our 7AA-II wafer grinder has consistently performed year over year. It has one dual-grind spindle and one work chuck with a wafer capability of 50mm to 150mm. This machine offers great thickness control. A semi-automated configuration is also available
The 7AF-II is our latest release in grinding equipment. It is fully automated, with a wafer capability of 50mm to 200mm. The addition of in situ thickness control and the two work spindles and chucks removed extra steps in wafer processing.
Post-dicing inspection offers the last opportunity to capture defects from preceding processes while the dice are still packed in wafer format. Camtek's Falcon 500PD line of automatic framed wafer inspection systems delivers superb detection of surface and probe mark defects, bump size and placement deviations, as well as dicing-related defects.