Wafer - aka Semiconductor Substrate,Solar Cell Substrate

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  • 4300FP - Semi-automatic Wafer Bump Testing The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
    Nordson Dage
  • 02-0000-08-00 - wafer resistivity measurement system Industrial PC, complete software, cable, communication tools soft- and hardware for Ethernet, measurement software with statistic, zooming, reporting, electric and electronic, cover and all the mechanical tools, assembled and tested.
    ATMvision AG
  • W-GM-4200 - Wafer Edge Grinding Machine Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. The modular concept to make the optimum process line possible. Low damage grinding method is available,Mirror Finish. Machine specification ready for 2" to 6"mm wafer or for 4" to 8"mm wafer. Capable of various material processes, such as chemical compound semiconductor.
    Tokyo Seimitsu
  • Phoenix V10 - Wafer Transfer System A palm-sized PLC with a built-in Operator Panel. The panel offers a graphic display screen and keypad. The Graphic HMI display screen can show images, text, and graphs according to real-time parameters. It can also display graphs based on historical values, to reflect trends of recorded data.
    MGI Automation
  • SPR-1502 - ATR-Wafer Transfer Ambient Temperature +15°C to +35°C
    Configuration 4-axis cylindrical coordinates system
    Mass 36kg
    Operation Range X-axis: 360 mm (arm: 120 mm)
    ?-axis: 330°
    Z-axis: 300 mm
    Operation Speed X-axis: 1.0 s/360 mm
    ?-axis: 1.3 s/180°
    Z-axis: 1.5 s/300 mm
    Payload 3kg/arm
    Position repeatability ±0.2mm
    Vibration Resistance 4.9m/sec2or less (0.5G or less)
    Daihen Advanced Component
  • WS51 - Double Side Wafer Prober This is a double side wafer prober, developed to be a low-cost manual version of the WS50. All checks, from mounting the wafer to driving the stages, including checks for the positioning of pins, the pressure of pins on the chip, and scrub mark, can be performed manually.
    ShibaSoku Co. Ltd
  • MultiSite Test sockets and Wafer Level multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
    UWE Electronics
  • Semiconductor Wafer Shuttle Stage The Prior Scientific motorized Shuttle Stage is designed to be used with the Nikon and Olympus wafer loader systems for 3, 4, 6, and 8 inch wafers. The system greatly reduces operator fatigue while increasing inspection accuracy and repeatability. 
    Prior Scientific
  • WAOI Master 4000 - CMOS Wafer Inspection System This system is an optical inspection system which inspects the particles on the surface of CMOS Wafer, surface scratch defect, pad marking, ink marking or dead pixel automatically.
    Synapse Imaging Co
  • AW200™ - Series C-SAM® Automated Wafer Bond Inspection The AW200™ Series is a high-capacity, high-throughput automated C-SAM® system designed to deliver maximum sensitivity for the evaluation of bonded wafers in applications such as SOI, MEMS and others.
    Sonoscan
  • BD-6 - Wafer Probing Coaxial-Driven Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Platen Linear Quick Up/Down Easy Load/Unload wafer Platen Linear Fine Up/Down Probe Card Tip Overdrive Adjustment
    EverBeing Int'l
  • GATS-3200 - Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test * Test individual packages or
    * Test Multi-image panels with Step&Repeat Function
    * single flying probe top using very high speed voice coil motor (VCM) technology
    * 50 - 100 tests per second ... high throughput
    * Dual Flying Probe Top for testing bump-to-bump nets
    * flying probe head allows testing of all nets including each power and ground point
    * 4-wire test capability
    W.M. Hague Company
  • WAFER AUTOMATED INSPECTION Automated inspection up to 400x the human eye for a clearer view. GDSI’s Automated Inspection services provide improved product quality, manufacturing productivity and time to market. Macro defects can happen during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. Our NSX-95s quickly and accurately detect yield-inhibiting defects, providing quality assurance and valuable process information.
    Grinding And Dicing
  • GATS-2100 - High Volume Semiconductor Substrate Interconnect Tester Pre-align *load *CCD camera alignment *electrical test * unload * sort of pass, opens, shorts, and alignment errors. The GATS-2100 concurrent approach provides unmatched volume capability... 2.5 seconds per device. As with all Nidec-Read Test systems, the GATS-2100 offers you the most test technologies for your requirements
    W.M. Hague Company
  • Comet 2 station - 25 to 25 Wafer Transfer The Comet 2 station is the easy way to transfer 25 wafers from cassette to cassette or cassette to boat. This Comet is fast, clean, reliable and accurate. Customized for your different boats and carriers. Compatible with your communication requirements and other manufacturer's processing equipment. Integrated Infrared Heat Sensor.
    R2D Ingenierie
  • N-PAF - Operation Support System for Wafer Prober N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
    Tokyo Electron Ltd
  • HED-W5100D - Wafer ESD Tester Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap. ◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily. ◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests. ◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
    Hanwa Electronic
  • HED-W5000M-SP0 - Wafer ESD Tester Low Cost & High Performance The development cost can be reduced. ◆Software was opened Software was opened. Therefore, the application can be widely constructed
    Hanwa Electronic
  • GB4P Robot System - wafer handling The GB4P Robot System with integral wafer pre-aligner is the most compact robot and pre-aligner package available on the market today for wafer handling applications up to 200mm, standard payload and throughput. Identical in size to Genmark's original GB4 robot, the GB4P houses a built-in pre-aligner for wafers ranging from 2"- 8" in diameter. The adjustable feature on the pre-aligner allows for simple and fast configuration for different wafer sizes. Engineered for single or dual wafer transport, the GB4P robot is available with an extensive variety of reach and vertical stroke combinations. Genmark's GB4P Robot System is a highly accurate, repeatable, and reliable wafer handling and aligning solution for wafer sizes up to 200mm.
    Genmark Automation
  • Electrostatic, Magnetic, Vacuum and Thermal Wafer Chucks Please send your design to ARC, or send your used chuck and we will manufacture it for you. End User and OEM inquiries are welcome. Grinding and lapping to precision flatness specifications is an everyday job at Arc and with a Tropel Flatmaster as the gold standard of flatness measurement, Arc can certify each chuck as being well within your flatness specification.
    ARC Technologies
  • Reflex TT - Wafer Inspection Solution The Reflex TT™ Tool is a manually loaded tool for detecting particles, scratches, area defect and micro-roughness (haze) on unpatterned wafers of various shape and diameter from 50mm up to 300mm and 450mm. It is a very flexible tool for process characterization and contamination monitoring for R&D purposes. Simple operation and user friendly software make the Reflex TT a valuable tool for a wide range of applications.
    Rudolph Technologies
  • 4000W - Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system. This wafer handling system provides automatic loading from the cassette, bump testing (shear or pull), and then unloading of the six or eight inch wafers.
    Nordson Dage
  • Wafer Sort TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
    TestEdge
  • AITTFH - In-Line Pattern Wafer Defect Inspection System offers exceptional sensitivity and throughput needed by today's advanced thin film head manufacturing fabs for a broad range of patterned wafer tool monitoring applications, including deposition, CMP, critical etch, and photo modules.
    KLA-Tencor

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Wafer - thin crystalline material sliced from ingot.