Wafer - aka Semiconductor Substrate,Solar Cell Substrate

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  • PM300WLR - High-Throughput Wafer-Level Reliability Testing The PM300WLR is the world's only dedicated probe system for wafer-level reliability (WLR) test of substrates up to 300 mm. The PM300WLR provides quick, accurate results before the device is packaged. This means critical reliability information for design and process improvement is delivered faster and at significantly lower cost than with traditional testing of packaged devices.
    Cascade Microtech
  • Comet 2 station Back to Back - 25 to 25 BTB Wafer System The Comet 2 station BTB system is a friendly, clean, reliable and robust Mass Wafer Transfer system, customized for your different boats and carriers. The 2 station BTB allows the transfer of 25 wafers from transport cassette to 25 position process boat with a complete rotation of the wafers.
    R2D Ingenierie
  • WAFER FABRICATION PALLETS Precision Machined Super High Temperature Ceramic Pallets for Wafer Fabrication. Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive composite boards designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. 
    Test Electronics
  • AC3 - Modular air-only Thermal Wafer Chuck System Fully integrated hot/cold solutions for all major production and laboratory wafer probers. No liquids or Peltier elements. MTBF > 50,000 hours. Temperature ranges from -65 to +400 °C. Modular system, adaptable to individual testing requirements.
    ERS Elektronik GmbH
  • WT-1000 - Lifetime Tester for Wafers The WT-1000 is provided for fast, non-contact carrier lifetime measurement method that is capable of characterizing silicon material in each process step of solar cell manufacturing from as-cut wafer to the finished solar cell. WT-1000b is a model for block measurements
    NI King Technology
  • EX-Q - Wafer Mapping Sensors EX-Q wafer mapping sensors represent a dramatic improvement in wafer mapping detection. Consistent apparent wafer thickness provides detection performance previously only thought possible with through beam sensors. EX-Q sensors have ample detection headroom (sensitivity) to detect the darkest and/or most extreme wafers now and in the future. EX-QS is an EX-Q repackaged in a smaller case to accomodate applications where space is limited.
    Cyberoptics Semiconductor
  • NC-6800M - Non-contact wafer sorting system of stacked wafer in loader Auto wafer pick out from stacked port of loader side Wafer pick out method is vacuum contact or electrostatic absorption Non-contact measurement of resistivity, thickness and conductivity (P/N) 300 pcs of wafers stackable on Loader and 6 cassettes on Un-loader (Receiver) Each cassette station number can be changed by customer's request
    NAPSON
  • :BD-8 - Wafer Probing Coaxial-Driven Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Platen Linear Quick Up/Down Easy Load/Unload wafer Platen Linear Fine Up/Down Probe Card Tip Overdrive Adjustment
    EverBeing Int'l
  • SussCal® Professional - RF & Microwave Wafer-Level Calibration Software SussCal® Professional is the most advanced, easy-to-use wafer-level calibration software available. It was designed by leading RF and microwave engineers to optimize your wafer-level measurements from DC to 110 GHz and beyond. The LRM+™ calibration method, the most advanced calibration method for one and two-port setups, and the RRMT+™ calibration method for multiport setups are only available in SussCal Professional.
    Cascade Microtech
  • SPR-3003 - VTR- Wafer Transfer Configuration 3 axis cylindrical coordinate system
    Mass 60kg
    Operation Range X-axis: 730mm(Arm length 245mm)
    ?-axis: 330°
    Z-axis: 50mm
    Operation Speed X-axis: 180°/sec
    ?-axis: 240°/sec
    Z-axis: 100mm /sec
    Payload 2kg/arm (include end effector)
    Repeatability Within ±0.1mm
    Vacuum level 1.3x10-6Pa
    Daihen Advanced Component
  • L300N/L300ND - FPD / Wafer Inspection Nikon Eclipse L300N/L300ND FPD / Wafer Inspection microscopes incorporate Nikon's renowned CFI60 infinity optics, offering the world's highest level of optical performance. The enhanced epi-fluorescence function, which enables 365nm UV excitation, is optimal for the inspection of semiconductor resist residues on 300mm wafers and organic electroluminescence displays.
    Nikon Instruments
  • 02-0000-02-00 - Wafer optical and geometry inspection system The ATM optical and geometry inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in wafers for solar production application.
    ATMvision AG
  • EET 1000 & EET 2000 - Ergonomic Wafer Transfer System For high reliability wafer transfer with a minimum of human interaction, MGI's EET 1000 and 2000 mass wafer transfer system combines solid state technology, robotic control interfaces and precision stepper motor positioning to move wafers from carrier to carrier.
    MGI Automation
  • FM200 - Sapphire/SIC Wafer Flatness and Surface Appearance System Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
    HenergySolar
  • MX 10x series - High Resolution Wafer Thickness & Thickness Variation Gauge The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
    E+H Metrology GmbH
  • TC series - TEMPERATURE CONTROLLED WAFER CHUCKS The Artic TC series of temperature controlled wafer chucks are used for test and characterization of semiconductor wafers and other components at hot and cold temperatures. Several models are available with temperature ranges from -65 degrees C to + 400 degrees C. Chucks are available in 4,6,8 and 12 inch diameters. These systems offer several design features which provide excellent performance to meet the most demanding customer applications.
    Trio-tech International
  • HED-W5000M-SP0 - Wafer ESD Tester Low Cost & High Performance The development cost can be reduced. ◆Software was opened Software was opened. Therefore, the application can be widely constructed
    Hanwa Electronic
  • 04-9900-00-00 BL - Wafer Inspection System (WIS) Wafer Inspection System (WIS) with new Black Label Technology Inline Wafer Inspection System with Loader and Sorter This Wafer Inspection System (WIS) has been technically relaunched and is based on the latest Black Label Technology made by ATMvision AG.
    ATMvision AG
  • HED-W5100D - Wafer ESD Tester Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap. ◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily. ◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests. ◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
    Hanwa Electronic
  • 2830 ZT - XRF Wafer Analyzer The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, PANalytical?s 2830 ZT Wafer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
    PANalytical B.V.
  • ESI 9900 - ultra-thin wafer dicing The ESI 9900 is the first production-ready, fully automated wafer dicing system that uses proprietary, laser-based technology to quickly and efficiently dice ultra-thin wafers (<50 microns). The 9900 reliably yields die that can withstand the rigors of advanced packaging requirements
    Electro Scientific
  • Rapitran II 50X2Tx/Rx - Wafer Transfer System The Rapitran II 50X2B Wafer Transfer System will gently transfer wafers in a proximity back to back position using most quartz boat styles. The rotary table makes this transfer cycle totally automated, reducing the transfer time to a minimum. Because of its versatility, this system can also place wafers in between solid source disks
    Faith Enterprises
  • LS-6700 - Bare Wafer Inspection System High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).
    High positioning accuracy (+/-30µm). Wafer Size 300mm / 200mm.
    Hitachi High-Technologies
  • Aspect L1 - Manual Prober for 8 inch/200mm Wafers Aspect L1 manual prober for 8 inch/200mm wafers is a versatile and economical solution for general diagnostic probing, engineering test and failure analysis. It is designed for use with both 4.5 inch/ 114mm and 6 inch/150mm wide probe cards.
    Wentworth Laboratories

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Wafer - thin crystalline material sliced from ingot.