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Comet 2 station Back to Back - 25 to 25 BTB Wafer System The Comet 2 station BTB system is a friendly, clean, reliable and robust Mass Wafer Transfer system, customized for your different boats and carriers. The 2 station BTB allows the transfer of 25 wafers from transport cassette to 25 position process boat with a complete rotation of the wafers.
BD-12 - Wafer Probing Huged-Knob Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Platen Linear Quick Up/Down Easy Load/Unload wafer Platen Linear Fine Up/Down Probe Card Tip Overdrive Adjustment Choice Of Microscope (Tilt) Up/Down For E-Z Revoliving Objectives
HS-PL - Wafer and Cells PL System Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
AITTFH - In-Line Pattern Wafer Defect Inspection System offers exceptional sensitivity and throughput needed by today's advanced thin film head manufacturing fabs for a broad range of patterned wafer tool monitoring applications, including deposition, CMP, critical etch, and photo modules.
BH-810CPC25WF8 - Polar Kerr Effect Measuring Equipment For Wafer Polar Kerr effect measuring equipment for Wafer. For perpendicular magnetic recording media.
4000W - Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system. This wafer handling system provides automatic loading from the cassette, bump testing (shear or pull), and then unloading of the six or eight inch wafers.
SAM 300 AUTO WAFER - Auto Wafer Line The SAM 300 AUTO WAFER is a product line developed for in line production control of bonded wafers. Its is compatible with clean room class 10.
2830 ZT - XRF Wafer Analyzer The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, PANalytical?s 2830 ZT Wafer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
Wafer Processing SEMI members help achieve the dramatic cost reductions and performance improvements in semiconductors that have profoundly shaped and improved our lives. Especially in the capital and technology-intensive wafer processing equipment and materials industry, organized and collective industry action is a vital industry requirement.
Sedona - Wafer Handling System & Cassette Indexer The Sedona wafer handling system is designed to transfer wafers from MGI magazines containing wafers in a coin stack configuration, separate one wafer at a time from the stack and place the wafers into plastic cassettes. The system can also reverse the operation and move the wafers from plastic cassettes into a coin stack.
ART Wafer Level Tester & Cycler Equipped with the same ART technology which sets the package level ART platforms apart from the competition, ELES proudly introduces its ART WLT&C product line with the purpose of reducing the customer time-to-quality. Moving ahead the process monitor to wafer level has definitive advantages but requires equipments able to stress the devices during the time consuming burn-in or bake. The ART WLT&C can interface the probing equipments available on the customer test floor.
:BD-8 - Wafer Probing Coaxial-Driven Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Platen Linear Quick Up/Down Easy Load/Unload wafer Platen Linear Fine Up/Down Probe Card Tip Overdrive Adjustment
WIS 6000 - Wafer Inspection System Macro / micro wafer inspection system for 200 and 300mm wafers. Auto conversion between 200 & 300mm wafers with recipe. FOUP, FOSB & open cassette (std 1 ports with 2nd load port as optional). Easily upgradeable to become wafer sorter station. Uses reliable robotic arm. Wafer mapping up/down loading from central wafer mapping system & editing (optional).
SPR-1502 - ATR-Wafer Transfer Ambient Temperature +15°C to +35°C
Configuration 4-axis cylindrical coordinates system
Operation Range X-axis: 360 mm (arm: 120 mm)
Z-axis: 300 mm
Operation Speed X-axis: 1.0 s/360 mm
?-axis: 1.3 s/180°
Z-axis: 1.5 s/300 mm
Position repeatability ±0.2mm
Vibration Resistance 4.9m/sec2or less (0.5G or less)
P5C - Semi-Automatic Wafer Probing Sustem The P5C is an entry-level, low volume production probe and inspection system incorporating computer controlled wafer alignment and stepping. The P5C is a member of the field proven family of Pacific Western System's substrate handling systems. The P5C's powerful interactive Real Time Wafer Mapping software significantly simplifies the test and production engineer's tasks.
BevelCam TT - Manually Loaded Edge Wafer Defect Inspection The BevelCam TT edge wafer defect inspection tool consists of a CCD camera system and a dark field/bright field LED illumination system. The BevelCam TT delivers information about scratches, particles, chip-outs, and contamination on the wafer edge, front & back bevels, and into 5 mm of the wafer front and back surfaces. The ADC software automatically classifies defects in these five regions without interruption.
FM200 - Sapphire/SIC Wafer Flatness and Surface Appearance System Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
6EC 200MM WWD - Wafer Failure Analysis Strasbaugh's 6EC CMP system is an excellent tool for WholeWaferDeconstruct™, a whole wafer sample preparation technique for frontside failure analysis. Its semi-automatic operations are programmable through a color, touch-screen GUI for repeatable and accurate process control.
4300FP - Semi-automatic Wafer Bump Testing The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
Wafer Probe Integra has the engineering talent, equipment and processes in place to support all probe services, including software development, probe card design / fab, debug and production probing. We are a one stop shop for all your probe card design, fabrication, verification and production needs.
iLS-W1 - Electrical Wafer Quality Inspector The iLS-W1 is the PV industry's first inline electrical wafer quality inspection system. The system enables wafer and cell manufacturers to determine the electrical entitlement of as cut wafers before being processed into cells. Using our second-generation PL imaging technology, the iLS-W1 is able to inspect as cut wafers at inline speeds. Automated algorithms extract electrical defects from the high resolution PL images and report defect metrics.
SussCal® Professional - RF & Microwave Wafer-Level Calibration Software SussCal® Professional is the most advanced, easy-to-use wafer-level calibration software available. It was designed by leading RF and microwave engineers to optimize your wafer-level measurements from DC to 110 GHz and beyond. The LRM+™ calibration method, the most advanced calibration method for one and two-port setups, and the RRMT+™ calibration method for multiport setups are only available in SussCal Professional.
WAOI Master 3000 - Wafer Probe Mark Inspection System This system is optical inspection system which inspects the pad marking and ink marking of Wafer surface automatically. This inspection system is composed of the wafer cassette part, wafer loading/unloading part, high magnification vision align part, inspection control part and inspection vision part.
ET 1000 & 2000 - Wafer Transfer System For high-reliability wafer transfer with a minimum of human interaction, MGI's ET (Easy Transfer) 1000 and 2000 mass wafer transfer systems combine solid state technology, robotic control interfaces and precision stepper motor positioning to move wafers from carrier to carrier.
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