Wafer - aka Semiconductor Substrate,Solar Cell Substrate

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  • VisEdge CV300 - Wafer Edge Inspection System Representing the semiconductor industry?s first inspection solution capable of meeting the full range of wafer-edge inspection requirements in a production environment, the VisEdge CV300 system leverages KLA-Tencor?s proven Optical Surface Analyzer (OSA) technology. Many advanced IC manufacturers are facing an average of 10 to 50 percent greater yield loss at the wafer?s edge relative to their best yielding region and a comprehensive inspection strategy that includes advanced edge inspection has become critical. Built on a highly extendible platform, the tool?s combination of unique optics design and advanced defect classification capabilities allows IC manufacturers to overcome the limitations of existing edge inspection techniques and enable broader capture and better distinction of edge defectivity to increase yield.
  • Summit 11000/12000 - 200mm Wafer Probe Stations The Summit series measurement platforms, with PureLine™ and AttoGuard® technology, allow you to access the full range of your test instruments for 200mm and 150mm wafers. Whatever your application: RF/Microwave, device characterization, wafer level reliability, e-test, modeling, or yield enhancement, Summit series platforms lead the industry in on-wafer measurements.
    Cascade Microtech
  • HS-WDI - Wafer Defect observing instrument Application ■Semiconductor wafer ■Solar wafer ■Solar Cell ■Thin-film Cell
  • RT-3000/RG-80N - Resistivity Measurement for Silicon Wafers Recipe setting, measurements and data processing with easy PC operation Test patterns: user programmable (Shape: Round / Square) Tester self-test function, wide measuring range 2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type) Mapping software: Up to 1,225 points (Option)
  • Wafer Probe Integra has the engineering talent, equipment and processes in place to support all probe services, including software development, probe card design / fab, debug and production probing. We are a one stop shop for all your probe card design, fabrication, verification and production needs.
    Integra Technologies
  • FM200 - Sapphire/SIC Wafer Flatness and Surface Appearance System Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
  • nSpec - Wafer Inspection System nSPEC® can image and analyze substrate and epi wafers as well as patterned and diced wafers and even individual devices. The system has multiple magnifications to fully characterize defect frequency and type and offers complete rapid scanning and mosaicing of wafers. Users can easily define reports and statistical functions.
    Nanotronics Imaging
  • F80-a - Product-Wafer Metrology Combined With Wafer-Transfer in One Affordable Tool Available exclusively through our partner Ricmar, the F80-a integrates full F80 functionality with Ricmar's WTT 300 Wafer Transfer Tool. The result is dual-purpose functionality in a single affordable EFEM platform.
  • SAM 300 AUTO WAFER - Auto Wafer Line The SAM 300 AUTO WAFER is a product line developed for in line production control of bonded wafers. Its is compatible with clean room class 10.
    PVA TePla Analytical
  • AutoWafer Pro™ - High-Resolution Scan of 200mm and 300mm bonded wafer With extensive analysis capabilities at both the wafer and device level, there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling, AutoWafer Pro supports 100% inspection for improved yields and a faster time to market.
  • SHR-1000 - Sheet Resistance Tester for Wafers Light excitation of the n+p or p+n layer structure and pick up of the resulting surface potential by capacitive probe. The detected potential is determined by the sheet resistance of the material.
  • Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
    Tamar Technology
  • Wafer Sort TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
  • MicroSense PV-6060 - Photovoltaic Wafer Thickness, TTV, Resistivity Measurement Module The MicroSense PV-6060 is a high accuracy metrology module that offers unparalleled throughput and stability for measurement of solar wafer thickness, wafer total thickness variation (TTV) and wafer resistivity. All measurements are completely non-contact with real time analog outputs, for high throughput without wafer breakage. Designed for simple integration into automated wafer transports, the PV-6060 is intended for use by OEMs manufacturing in-line solar wafer inspection and sorting systems.
  • 281x Series - Brightfield Patterned Wafer Inspection Systems The 2810 and 2815 are the industry's first memory- and logic-specific full-spectrum DUV/UV/visible brightfield patterned wafer defect inspection tools, detecting a broad range of defect types on all processing layers at high production throughputs.
  • EB-8 - Wafer Probing Coaxial-Driven Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Choice Of Microscope (Tilt) Up/Down For E-Z Revolving Objevtives
    EverBeing Int'l
  • IS-T1 - BT Imagine New wafer Thickness System Measurement Technique Laser Triangulation 1-3 Laser Sensor Spots Laser Spot Size Optimized for Accuracy and Precision.
    BT Imaging Pty Ltd
  • GB4P Robot System - wafer handling The GB4P Robot System with integral wafer pre-aligner is the most compact robot and pre-aligner package available on the market today for wafer handling applications up to 200mm, standard payload and throughput. Identical in size to Genmark's original GB4 robot, the GB4P houses a built-in pre-aligner for wafers ranging from 2"- 8" in diameter. The adjustable feature on the pre-aligner allows for simple and fast configuration for different wafer sizes. Engineered for single or dual wafer transport, the GB4P robot is available with an extensive variety of reach and vertical stroke combinations. Genmark's GB4P Robot System is a highly accurate, repeatable, and reliable wafer handling and aligning solution for wafer sizes up to 200mm.
    Genmark Automation
  • Reflex TT - Wafer Inspection Solution The Reflex TT™ Tool is a manually loaded tool for detecting particles, scratches, area defect and micro-roughness (haze) on unpatterned wafers of various shape and diameter from 50mm up to 300mm and 450mm. It is a very flexible tool for process characterization and contamination monitoring for R&D purposes. Simple operation and user friendly software make the Reflex TT a valuable tool for a wide range of applications.
    Rudolph Technologies
  • SPR-311S - VTR- Wafer Transfer Ambient Temperature +15??+70? (Vaccum seal unit)
    +15??+35? (Atmosphere side)
    Configuration 3-axis cylindrical coordinates system
    Mass 30kg
    Operation Range X-axis: 459 mm (arm: 153 mm)
    ?-axis: 330°, Z-axis: 10 mm
    Operation Speed X-axis: 1.2 s/459 mm
    ?-axis: 1.5 s/330°
    Z-axis: 0.6 s/10 mm
    Payload 0.2kg/arm
    Repeatability ±0.2mm
    Vacuum level 1.3×10-6Pa
    Vibration Resistance 4.9m/sec2or less (0.5G or less)
    Daihen Advanced Component
  • WAFER AUTOMATED INSPECTION Automated inspection up to 400x the human eye for a clearer view. GDSI’s Automated Inspection services provide improved product quality, manufacturing productivity and time to market. Macro defects can happen during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. Our NSX-95s quickly and accurately detect yield-inhibiting defects, providing quality assurance and valuable process information.
    Grinding And Dicing
  • EagleVIEW - Automated Macro Defect Inspection Equipment for Semiconductor Wafers EagleVIEW automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. The EagleVIEW macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette.
  • Wafer Services ISE Labs, Inc. provides effective test solutions that address the full range of industry requirements for Digital and Mixed Signal devices. Test platforms encompass wafer probe and finished package testing. Our skilled staff of test engineers assist in the development of customized solutions designed to address unique test requirements.
    ISE Labs
  • EB-6 - Wafer Probing Coaxial-Driven Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Choice Of Microscope (Tilt) Up/Down For E-Z Revolving Objevtives
    EverBeing Int'l

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Wafer - thin crystalline material sliced from ingot.