Wafer - aka Semiconductor Substrate,Solar Cell Substrate

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  • AutoWafer Pro™ - High-Resolution Scan of 200mm and 300mm bonded wafer With extensive analysis capabilities at both the wafer and device level, there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling, AutoWafer Pro supports 100% inspection for improved yields and a faster time to market.
    Sonix
  • Wafer Thickness, TTV, Bow and Warpage ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
    Alto Inspection
  • Phoenix V10 - Wafer Transfer System A palm-sized PLC with a built-in Operator Panel. The panel offers a graphic display screen and keypad. The Graphic HMI display screen can show images, text, and graphs according to real-time parameters. It can also display graphs based on historical values, to reflect trends of recorded data.
    MGI Automation
  • EB-6 - Wafer Probing Coaxial-Driven Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Choice Of Microscope (Tilt) Up/Down For E-Z Revolving Objevtives
    EverBeing Int'l
  • CLM-3D™ - Wafer DualBeam System The CLM-3D 300 mm DualBeam (FIB/ SEM) is a full wafer autoloading system for automated, digital 3D analysis of semiconductor devices in a clean room environment.
    FEI Company
  • 6EG 300MM WWD - CMP for 200mm and 300mm Whole Wafer Failure Analysis Strasbaugh's 6EC CMP system is an excellent tool for WholeWaferDeconstruct™, a whole wafer sample preparation technique for frontside failure analysis and yield enhancement. Its semi-automatic operations are programmable through a color, touch-screen GUI for repeatable and accurate process control.
    Strasbaugh
  • Testing Silicon Wafers The base plate of the cell is a silicon disc. The importance of this component coupled with constant material reduction necessitates strength tests, for which the established 4-point flexure test is used with a special SI wafer holding-device. However, high localized pressures are generated during this test. By contrast the 4-point flexure test with linear anvil enables virtually constant pressure-distribution and is frequently used to eliminate differences in quality between suppliers.
    Zwick Roell Group
  • Inprocess Wafer Inspection Monolithic Replicated Mirrors, Assemblies, Sub-assemblies
    OPCO Laboratory
  • IL-800 - Inline Wafer Testing Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
    Sinton Instruments
  • 4090µ+ - Wafer Probers For chipmakers that want to maximize their investment in 200mm test equipment, accurate and reliable high-volume probing is more important than ever. The 4090µ+ is designed to meet these demands while reducing test costs through increased throughput, simplified operation and state-of-the-art automation.
    EG Systems
  • ET 1000 & 2000 - Wafer Transfer System For high-reliability wafer transfer with a minimum of human interaction, MGI's ET (Easy Transfer) 1000 and 2000 mass wafer transfer systems combine solid state technology, robotic control interfaces and precision stepper motor positioning to move wafers from carrier to carrier.
    MGI Automation
  • W-GM-5200 - Wafer Edge Grinding Machine Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. The modular concept to make the optimum process line possible. Low damage grinding method is available. Machine specification ready for 300mm and 200mm wafer. Visual system (optional) for measuring the chamfer width of periphery and notch.
    Tokyo Seimitsu
  • RW-200/300 - Sliced Wafer Carbon Demounting and Cleaning Machine Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
    Tokyo Seimitsu
  • 400SW - Wafer/Chip/Package Semi-automated ESD Tester Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection.
    Tokyo Electronics
  • Fox 1 - Full Wafer Contact Test System Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
    Aehr Test Systems
  • FC contact system (wafer level) Minimum 0.12mm pitch
    Unitechno
  • WAFER AUTOMATED INSPECTION Automated inspection up to 400x the human eye for a clearer view. GDSI’s Automated Inspection services provide improved product quality, manufacturing productivity and time to market. Macro defects can happen during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. Our NSX-95s quickly and accurately detect yield-inhibiting defects, providing quality assurance and valuable process information.
    Grinding And Dicing
  • WT-2000 - Multifunction Wafer Mapping Tool The WT-2000 is a powerful tabletop measurement platform for performing many different semiconductor material characterization measurements.
    Semilab
  • RT-110 - Wafer Resistivity Tester The RT-110 is a non-contact bulk resistivity measurement tool for rapid classification of silicon wafers, ingots and feedstock material. It operates via eddy current technology.
    Semilab
  • Rapitran II 25 - Wafer System The Rapitran II series of transfer systems can be modified in many different ways for customized application, and can be fully integrated for complete automation through the RS-232 serial port.  
    Faith Enterprises
  • WIS - Wafer Inspection System Our Wafer Inspection System – WIS - carries out a fully automated inspection of mono- and polycrystalline silicon wafers. The modular design of the system means that individual configuration with the latest inspection technologies as well as smooth integration into your product lines is possible.
    Jonas & Redmann
  • 2830 ZT - XRF Wafer Analyzer The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, PANalytical?s 2830 ZT Wafer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
    PANalytical B.V.
  • WaferPro Express - On-Wafer Measurement Program Software WaferPro Express software performs automated wafer-level measurements of semiconductor devices such as transistors and circuit components. It provides turnkey drivers and test routines for a variety of instruments and wafer probers. Its new user interface makes it easy to setup and run complex wafer-level test plans, while powerful customization capabilities are enabled by the new Python programming environment.
    Keysight Technologies
  • HS-WDI - Wafer Defect observing instrument Application ■Semiconductor wafer ■Solar wafer ■Solar Cell ■Thin-film Cell
    HenergySolar

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Wafer - thin crystalline material sliced from ingot.