Thin titanium dioxide/platinum films for bottom electrodes deposited on four-inch silicon wafers. The platinum films can withstand up to 750°C in oxygen for one hour with no roughening or hillock formation. Radiant will coat the electrode with 20/80 PZT or 4/20/80 PNZT if requested.
The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
TEL's wafer probe solutions are designed to improve test flow cost-of-ownership through innovations that address the key elements of the test process: capital investment, tooling, labor, overhead and reliability.
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
The WDF 12DP is a prober/handler capable of transporting and testing standard 300-mm wafers and dicing frames without need of a changeover kit. To support multiple tests after dicing, it has a special positioning function that differs from former types, as well as image-processing functions such as wafer level packaging.
N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
This system is optical inspection system which inspects the pad marking and ink marking of Wafer surface automatically. This inspection system is composed of the wafer cassette part, wafer loading/unloading part, high magnification vision align part, inspection control part and inspection vision part.
TrueScale™ probe technology for advanced wire bond logic and SoC devices delivers high-efficiency, high-parallelism, cost-effective wafer test in fab environments with production rates of millions of units. Scalable down to 40 micron pad pitch, the TrueScale PP40 wafer probe card expands parallelism of advanced tester equipment, requires no spring positioning adjustments and minimal maintenance.
SemiProbe's family of IRIS Wafer Inspection System (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die. With the intuitive PILOT control software, the user has the ability to create single and double sided wafer maps, bin and save the results, as well as ink. Built using the patented PS4L adaptive archit...
An integral part of SemiProbe’s patented adaptive architecture, PILOT control software consists of a number of DLL-based functional modules linked through the SemiServer for communicating to and from the PS4L and other test equipment. Standard control modules include the Navigator and Position Matrix, with a host of more sophisticated capabilities for applications like automated wafer mapping and pattern recognition.
Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.The non-contact measuring method achieves the stable alignment.Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.The modular concept to make the optimum process line possible.Low damage grinding method is available,Mirror Finish.Machine specification ready for 2" to 6"mm wafer or for 4" ...
Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.The non-contact measuring method achieves the stable alignment.Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.The modular concept to make the optimum process line possible.Low damage grinding method is available.Machine specification ready for 300mm and 200mm wafer.Visual system (opti...
This is a double side wafer prober, developed to be a low-cost manual version of the WS50. All checks, from mounting the wafer to driving the stages, including checks for the positioning of pins, the pressure of pins on the chip, and scrub mark, can be performed manually.
Since the WS50 provides ideal test methods for testing high-voltage devices, it is capable of high-accuracy testing and high reliability using a newly-developed contact method for both sides probing wafers.
LS6800 are capable of detecting smaller than 40 nm defects on unpatterned wafers with high sensitivity and throughput. Those tools support yield enhancement through high precision discrimination and detection of COP defects, particles, CMP scratches and particles.