Wafer - aka Semiconductor Substrate,Solar Cell Substrate
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IS-T1 - BT Imagine New wafer Thickness System Measurement Technique Laser Triangulation 1-3 Laser Sensor Spots Laser Spot Size Optimized for Accuracy and Precision.
ALTO-SD-150/200 - In-Line Wafer Surface Defect Inspection ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
CLM-3D™ - Wafer DualBeam System The CLM-3D 300 mm DualBeam (FIB/ SEM) is a full wafer autoloading system for automated, digital 3D analysis of semiconductor devices in a clean room environment.
WT-1000 - Lifetime Tester for Wafers The WT-1000 is provided for fast, non-contact carrier lifetime measurement method that is capable of characterizing silicon material in each process step of solar cell manufacturing from as-cut wafer to the finished solar cell. WT-1000b is a model for block measurements
WI-22xx Series - Wafer Inspector The ICOS® WI-22xx Wafer Inspector performs automated optical inspection and metrology of microelectronic devices on a variety of wafer substrates, surface inspection, and 2D bump inspection. The WI-22xx Wafer Inspector offers a dramatic improvement in wafer inspection speed, allowing manufacturers to transition to larger LED and MEMS wafer sizes.
IS3000 - Dark Field Wafer Defect Inspection System Dark field wafer inspection system for 45 nm generation
Effective for yield enhancement by the high sensitivity / high speed inspection capabilities. Superior cost effective inspection tool. DFC (Dark field real time classification)
Recipe set up in minutes. Precise coordinate system for SEM review.
BD-12 - Wafer Probing Huged-Knob Chuck Stage RF Probing Field Upgradable 20X~4000X Magnification Backlash-Free Movement Platen Linear Quick Up/Down Easy Load/Unload wafer Platen Linear Fine Up/Down Probe Card Tip Overdrive Adjustment Choice Of Microscope (Tilt) Up/Down For E-Z Revoliving Objectives
SPR-3002 - VTR- Wafer Transfer Ambient Temperature 15 to 80°C (Vaccum seal unit)
15 to 35°C (Atmosphere side)
Configuration 2-axis cylindrical coordinates system
Operation Range X-axis: 600 mm (arm: 200mm)
Operation Speed X-axis: 1.3 s/600 mm
?-axis: 1.6 s/180°
Vacuum level 1.3×10-6Pa
Vibration Resistance 4.9m/sec2or less (0.5 G or less)
NC-6800Ｍ - Non-contact wafer sorting system of stacked wafer in loader Auto wafer pick out from stacked port of loader side Wafer pick out method is vacuum contact or electrostatic absorption Non-contact measurement of resistivity, thickness and conductivity (P/N) 300 pcs of wafers stackable on Loader and 6 cassettes on Un-loader (Receiver) Each cassette station number can be changed by customer's request
MX 10x series - High Resolution Wafer Thickness & Thickness Variation Gauge The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
SHR-1000 - Sheet Resistance Tester for Wafers Light excitation of the n+p or p+n layer structure and pick up of the resulting surface potential by capacitive probe. The detected potential is determined by the sheet resistance of the material.
MultiSite Test sockets and Wafer Level multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
ET 1000 & 2000 - Wafer Transfer System For high-reliability wafer transfer with a minimum of human interaction, MGI's ET (Easy Transfer) 1000 and 2000 mass wafer transfer systems combine solid state technology, robotic control interfaces and precision stepper motor positioning to move wafers from carrier to carrier.
SussCal® Professional - RF & Microwave Wafer-Level Calibration Software SussCal® Professional is the most advanced, easy-to-use wafer-level calibration software available. It was designed by leading RF and microwave engineers to optimize your wafer-level measurements from DC to 110 GHz and beyond. The LRM+™ calibration method, the most advanced calibration method for one and two-port setups, and the RRMT+™ calibration method for multiport setups are only available in SussCal Professional.
Fox 1 - Full Wafer Contact Test System Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
Wafer Processing SEMI members help achieve the dramatic cost reductions and performance improvements in semiconductors that have profoundly shaped and improved our lives. Especially in the capital and technology-intensive wafer processing equipment and materials industry, organized and collective industry action is a vital industry requirement.
LRS-2400 - Laser Repair for 6-, 8- and 12-inch Wafer Inspection Systems generate defect data files and from these data files, engineers have to locate the physical defect for further study.Ê The task becomes impossible or unbearable when dealing with large wafers or large dies that have sub-micron features. LRS-2400 reads the defect data and navigates to the exact location of the defect.
Aspect L1 - Manual Prober for 8 inch/200mm Wafers Aspect L1 manual prober for 8 inch/200mm wafers is a versatile and economical solution for general diagnostic probing, engineering test and failure analysis. It is designed for use with both 4.5 inch/ 114mm and 6 inch/150mm wide probe cards.
EX-Q - Wafer Mapping Sensors EX-Q wafer mapping sensors represent a dramatic improvement in wafer mapping detection. Consistent apparent wafer thickness provides detection performance previously only thought possible with through beam sensors. EX-Q sensors have ample detection headroom (sensitivity) to detect the darkest and/or most extreme wafers now and in the future. EX-QS is an EX-Q repackaged in a smaller case to accomodate applications where space is limited.
EG6000 - Wafer Probers Volume 300mm production demands probing that packages reliability, accuracy, automation and throughput. Electroglas' flagship prober, the EG6000, responds to this challenge by providing the world's fastest, most accurate and most reliable 300mm production probing solution.
SortMax200™ - Wafer Sorter Achieve exceptional performance with Genmark's SortMax200™ wafer sorter, designed for handling wafers up to 200mm. The SortMax200™ can be configured to accommodate a maximum number of eight open cassette stations.With years of experience building bridge tools integrating different processes such as wafer thickness measurement, UV cleaning/erasing and ID application to name a few, Genmark delivers the most reliable and serviceable 200mm small footprint sorter on the market today. A wide variety of wafer mappers, pre-aligners, and end-effectors are some of its many options.
Fully compliant with SEMI standards and fab requirements, Genmark's 200mm wafer sorter SortMax200™ is easily configurable to customer's changing requirements.
Combined with Genmark's powerful and customizable ECS300 Equipment Control Software featuring standard operational functions such as Sort, ID, Transfer, Compress, Align and Merge/Split.
Tesla - On-Wafer Power Device Characterization System Tesla solves the challenge of thin wafers, power dissipation and current/voltage requirements
LotCommander - Wafer Lot Process Software LotCommander Provides Wafer Lot Process Management For Pacific Western System Wafer Probe Systems. # Load Options ? specifies how wafers are loaded, and what to do if load failure occurs # Alignment Options ? specifies auto-align or manual-align details # OCR Options ? specifies OCR configuration # Pause Options ? allows the operator to verify probe to pad alignment before processing the entire wafer lot
ESI 9900 - ultra-thin wafer dicing The ESI 9900 is the first production-ready, fully automated wafer dicing system that uses proprietary, laser-based technology to quickly and efficiently dice ultra-thin wafers (<50 microns). The 9900 reliably yields die that can withstand the rigors of advanced packaging requirements
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Wafer - thin crystalline material sliced from ingot.
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