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PN-300 - Wafer Prober Networking System The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
RT-3000/RG-80N - Resistivity Measurement for Silicon Wafers Recipe setting, measurements and data processing with easy PC operation Test patterns: user programmable (Shape: Round / Square) Tester self-test function, wide measuring range 2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type) Mapping software: Up to 1,225 points (Option)
FP200A - Wafer Probing Machine Evolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.
WAOI Master 4000 - CMOS Wafer Inspection System This system is an optical inspection system which inspects the particles on the surface of CMOS Wafer, surface scratch defect, pad marking, ink marking or dead pixel automatically.
Wafer Sort TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
NCS-200SA - Semi-Automatic Contactless Wafer Detector Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
281x Series - Brightfield Patterned Wafer Inspection Systems The 2810 and 2815 are the industry's first memory- and logic-specific full-spectrum DUV/UV/visible brightfield patterned wafer defect inspection tools, detecting a broad range of defect types on all processing layers at high production throughputs.
ART Wafer Level Tester & Cycler Equipped with the same ART technology which sets the package level ART platforms apart from the competition, ELES proudly introduces its ART WLT&C product line with the purpose of reducing the customer time-to-quality. Moving ahead the process monitor to wafer level has definitive advantages but requires equipments able to stress the devices during the time consuming burn-in or bake. The ART WLT&C can interface the probing equipments available on the customer test floor.
2830 ZT - XRF Wafer Analyzer The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, PANalytical?s 2830 ZT Wafer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
F80-T - Product-Wafer Metrology Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up, industry-leading throughput, and all at a mere fraction of the cost of competing metrology tools.
Candela CS20 - High Brightness LED Automated Wafer Inspection System The Candela CS20 is the first automated wafer inspection system designed to address the defect management requirements of the rapidly growing high-brightness light-emitting diode (HB-LED) market. Leveraging a proprietary, multi-channel detection architecture, the CS20 can inspect transparent wafers and epi layers for micro-pits and other defects non-destructively at throughputs of up to 25 wafers per hour--enabling, for the first time, a true production line monitor for wafers used to produce HB-LED devices.
P4 - Semi-Automatic Wafer Probing System The Pacific Western Systems Probe 4 is a time proven semi-automatic wafer probe system. The Probe 4 was introduced over ten years ago as a cutting edge smart probe system, and PWS has continued to improve and upgrade the drive and control system to meet the many changing requirements of our customers. The P4 evolution has been customer driven, and explains the longevity of the P4 as a production platform for Test and Mapping systems.
Wafer Edge Inspection The wafer edge inspection system measures the surface of the wafer with high precision using three image processing cameras. Defects larger than 300 nm are thus reliably detected.
Semiconductor Wafer Shuttle Stage The Prior Scientific motorized Shuttle Stage is designed to be used with the Nikon and Olympus wafer loader systems for 3, 4, 6, and 8 inch wafers. The system greatly reduces operator fatigue while increasing inspection accuracy and repeatability.
TC series - TEMPERATURE CONTROLLED WAFER CHUCKS The Artic TC series of temperature controlled wafer chucks are used for test and characterization of semiconductor wafers and other components at hot and cold temperatures. Several models are available with temperature ranges from -65 degrees C to + 400 degrees C. Chucks are available in 4,6,8 and 12 inch diameters. These systems offer several design features which provide excellent performance to meet the most demanding customer applications.
LS6800 - Wafer Surface Inspection System LS6800 are capable of detecting smaller than 40 nm defects on unpatterned wafers with high sensitivity and throughput. Those tools support yield enhancement through high precision discrimination and detection of COP defects, particles, CMP scratches and particles.
WT-2000 - Multifunction Wafer Mapping Tool The WT-2000 is a powerful tabletop measurement platform for performing many different semiconductor material characterization measurements.
EagleVIEW - Automated Macro Defect Inspection Equipment for Semiconductor Wafers EagleVIEW automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. The EagleVIEW macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette.
6EG 300MM WWD - CMP for 200mm and 300mm Whole Wafer Failure Analysis Strasbaugh's 6EC CMP system is an excellent tool for WholeWaferDeconstruct™, a whole wafer sample preparation technique for frontside failure analysis and yield enhancement. Its semi-automatic operations are programmable through a color, touch-screen GUI for repeatable and accurate process control.
WS50 - Double Side Wafer Prober Since the WS50 provides ideal test methods for testing high-voltage devices, it is capable of high-accuracy testing and high reliability using a newly-developed contact method for both sides probing wafers.
NC-6800 - Non-contact belt drive wafer sorting system Non-contact measurement of resistivity, thickness and conductivity (P/N) Standard cassettes station number: Loader (Sender); 4, Un-loader (Reciever) ; 6 Each cassette station number can be changed by customers request Eddy current method for resistivity, Electric capacitance method for wafer thickness
RTS300 - G5 Wafer Sorters Alone Range The new RECIF Technologies G5 300mm stand alone wafer sorter, RTS300 is providing IC manufacturers with the highest productivity solution. Its new motorization and cinematic enables the highest throughput ever achieved with a single robot, in the smallest footprint. The RTS300 is equipped with the RECIF Technologies patented End-Effector, proposing OCR and alignment embedded on the arm. This back side contact End-Effector ensures unsurpassed cleanliness, as well as a high secure wafer handling through our patented ACT (Advanced Contact Technology) resulting from a 2 years Research & Development program. Our revolutionary design will support you at each step of your manufacturing improvement.
04-9900-00-00 BL - Wafer Inspection System (WIS) Wafer Inspection System (WIS) with new Black Label Technology Inline Wafer Inspection System with Loader and Sorter This Wafer Inspection System (WIS) has been technically relaunched and is based on the latest Black Label Technology made by ATMvision AG.
Rapitran II 50X2Tx/Rx - Wafer Transfer System The Rapitran II 50X2B Wafer Transfer System will gently transfer wafers in a proximity back to back position using most quartz boat styles. The rotary table makes this transfer cycle totally automated, reducing the transfer time to a minimum. Because of its versatility, this system can also place wafers in between solid source disks
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