Wafer - aka Semiconductor Substrate,Solar Cell Substrate

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  • MicroSense PV-6060 - Photovoltaic Wafer Thickness, TTV, Resistivity Measurement Module The MicroSense PV-6060 is a high accuracy metrology module that offers unparalleled throughput and stability for measurement of solar wafer thickness, wafer total thickness variation (TTV) and wafer resistivity. All measurements are completely non-contact with real time analog outputs, for high throughput without wafer breakage. Designed for simple integration into automated wafer transports, the PV-6060 is intended for use by OEMs manufacturing in-line solar wafer inspection and sorting systems.
    MicroSense
  • MicroINSPECT 300 FA - Semiconductor Wafer Inspection Failure Analysis Tool The MicroINSPECT 300 FA is a multipurpose semiconductor wafer defect review and failure analysis inspection tool that recognizes wafers up to 300 mm. Open FOUP, FOSB, crystal Pak and 300mm cassettes with one tool! MicroINSPECT 300 FA is also a complete wafer sorter.
    Microtronic
  • Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
    Rudolph Technologies
  • ANTARES - Automatic Detection of Cracks in Wafer and Cells Microcrack detection is an important tool for wafer, cell and module production. With the new ANTARES system, a reliable tool for automatic detection of cracks in single wafers and cells is available. A similar technology, working on stacks of wafers and cells, has been shown at the Photovoltaic Technology Show in April this year.
    Intego GmbH
  • IRIS™ - Die & Wafer Inspection Systems SemiProbe's family of IRIS Wafer Inspection System (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die. With the intuitive PILOT control software, the user has the ability to create single and double sided wafer maps, bin and save the results, as well as ink. Built using the patented PS4L adaptive architecture, the WIS can be configured for manual or automatic inspection on either a semiautomatic or fully automatic platform.
    SemiProbe
  • 02-0000-09-00 - Wafer TTV, Bow, saw marks inspection system The ATM TTV, bow and saw mark inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in wafers for solar production application.
    ATMvision AG
  • RT-3000/RG-80N - Resistivity Measurement for Silicon Wafers Recipe setting, measurements and data processing with easy PC operation Test patterns: user programmable (Shape: Round / Square) Tester self-test function, wide measuring range 2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type) Mapping software: Up to 1,225 points (Option)
    NAPSON
  • HED-W5000M - Wafer ESD Tester Real device's ESD waveform The real device's ESD waveform can be displayed. ◆On wafer, assured waveform Standard waveform for HBM/MM is assumed on wafer. ◆Realization to achieve the automatic destruction judgment of just after zap Allows to implement the destruction judgment by Vf/If measurement after pulsing ◆Easy to selection between pin and pin It is possible to make a positioning of any two pins by using manipulator.
    Hanwa Electronic
  • SHR-1000 - Sheet Resistance Tester for Wafers Light excitation of the n+p or p+n layer structure and pick up of the resulting surface potential by capacitive probe. The detected potential is determined by the sheet resistance of the material.
    Semilab
  • WT-1000 - Lifetime Tester for Wafers The WT-1000 is provided for fast, non-contact carrier lifetime measurement method that is capable of characterizing silicon material in each process step of solar cell manufacturing from as-cut wafer to the finished solar cell. WT-1000b is a model for block measurements
    Semilab
  • ALTO-SD-150/200 - In-Line Wafer Surface Defect Inspection ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
    Alto Inspection
  • Wafer Thickness, TTV, Bow and Warpage ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
    Alto Inspection
  • RG-100PV - Semi-auto 4 Point Probe System for Solar Cell Substrate Semi-auto 4-point probe system for solar cell, thin film on substrate samples multi-points measurement Even pitch and random pitch for Max.1,000 points 2-D/3-D square mapping software for even pitch 2-D pseude square mapping software (option)
    NAPSON
  • TC series - TEMPERATURE CONTROLLED WAFER CHUCKS The Artic TC series of temperature controlled wafer chucks are used for test and characterization of semiconductor wafers and other components at hot and cold temperatures. Several models are available with temperature ranges from -65 degrees C to + 400 degrees C. Chucks are available in 4,6,8 and 12 inch diameters. These systems offer several design features which provide excellent performance to meet the most demanding customer applications.
    Trio-tech International
  • W-GM-5200 - Wafer Edge Grinding Machine Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. The modular concept to make the optimum process line possible. Low damage grinding method is available. Machine specification ready for 300mm and 200mm wafer. Visual system (optional) for measuring the chamfer width of periphery and notch.
    Tokyo Seimitsu
  • HED-W5100D - Wafer ESD Tester Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap. ◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily. ◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests. ◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
    Hanwa Electronic
  • NewView 3DPV-W - Photovoltaic Panel Wafer-Based Processes ZYGO's NewView 3DPV-W uniquely measures 3D cross-sectional area (CSA) providing you the information to optimize both optical and electrical efficiency in on-line and off-line applications.
    Zygo
  • PILOT - Control Software for wafer probing and inspection systems An integral part of SemiProbe’s patented adaptive architecture, PILOT control software consists of a number of DLL-based functional modules linked through the SemiServer for communicating to and from the PS4L and other test equipment. Standard control modules include the Navigator and Position Matrix, with a host of more sophisticated capabilities for applications like automated wafer mapping and pattern recognition.
    SemiProbe
  • Wafer Probing Systems Klocke Nanotechnik offers a complete series of Wafer Probing products, from single manipulators over sets of manipulators, different levels of automation and software - up to complete automatic systems including pattern recognition software. The manipulators resolution of 2 nm is by far enough to hit any existing wafer structure, also in the next years.
    Klocke Nanotechnik
  • Wafercheck 150 - Semiconductor Wafer Analyser The WaferCheck 150 system is a complete and easy-to-use system for Time-resolved Photoluminescence (TRPL) measurements. TRPL is a very powerful tool for the contact free characterization and investigation of semiconductor materials.
    PicoQuant GmbH
  • FC contact system (wafer level) Minimum 0.12mm pitch
    Unitechno
  • Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
    Tamar Technology
  • Fox 1 - Full Wafer Contact Test System Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
    Aehr Test Systems
  • Comet 2 station - 25 to 25 Wafer Transfer The Comet 2 station is the easy way to transfer 25 wafers from cassette to cassette or cassette to boat. This Comet is fast, clean, reliable and accurate. Customized for your different boats and carriers. Compatible with your communication requirements and other manufacturer's processing equipment. Integrated Infrared Heat Sensor.
    R2D Ingenierie

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Wafer - thin crystalline material sliced from ingot.