Aligners
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Belt Alignment
Belt Hog
The Acoem USA Belt Hog uses the pulley groove as the reference, allowing you to achieve a precise belt alignment which reduces wear, bearing failures and vibrations.
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3U 4-Slot OpenVPX Backplane Aligned To SOSA With 2 VITA 67.3 Aperture Slots
1SVX304AxP-xxxx
Designed in alignment with the SOSA, Elma's 3U 4-Slot backplanes offer 4 Plug in Card (PIC) slots to support MOSA, CMOSS and HOST initiatives. It support high-speed signals on all data paths and VITA 67.3 connectors and VITA 66.5 optical connectors.
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Bond Alignment Systems
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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Laser Beam Alignment
The alignment product line provides full solutions for applications such as: alignment of laser cavities, straightness measurement, machine alignment, wide-bed printers alignment and others. The AlignMeter system simultaneously measures incoming laser beam position (in µm) and angle (in µRad).It is a powerful compact device perfect for alignment monitoring, for testing the drift, centration and beam alignment relative to the outer housing or tube.
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Compact Alignment Scope
ALSCO
F. W. Breithaupt & Sohn GmbH & Co.KG
*Magnification 6x*Measuring range 0,3m to infinity*Optional: with adjustable reticule*Either for integration in spindle or revolver*Different reticule designs available*Customer specific modifications possible*Made in Germany
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Core Alignment Fiber Fusion Splicer
SH-FS170H
Shenzhen Sharingtek Communication Co., LTD
●It adopts German technology with core alignment system and independent property rights.●The equipment takes advanced PAS technology not only can be used to FTTX also meet the requirements of trunk line with good properties of mini size four motor drive light weight fast speed.Features●Hardness - The body is made from titanium alloy and it has rubber protection function quakeproof waterproof dustproof .●Fast - 7s fast splicing 15s fast heating support continuous heating average efficiency improve 2-3times.●Long lifetime - 200 fiber splicing no memory effect lithium batteries the fiber cleaver has 24 blade longer lifetime.
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3U 6-slots 25Gb Backplane Aligned To SOSA, Apertures For VITA 66/67 Modules
1SVX306AxP-xxxx
Designed in alignment SOSA, this 3U backplane offers 6 PIC (Plug in Card) slots supporting high-speed signals on all data paths and VITA 67.3 connectors and VITA 66.5 optical connectors.
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8-Channel 250 MHz A/D with Virtex UltraScale+ HBM FPGA - SOSA Aligned 3U VPX
Model 5585
- Jade 5585 and 5586 FAQ- Complete radar and software radio interface- Wideband data acquisition- Multi-channel, multi-board synchronization for high channel count systems- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX processing powerhouse- Exceptional dynamic range and analog signal integrity- Features Xilinx Virtex UltraScale+ HBM FPGAs- Eight 250MHz 16-bit A/Ds- 10 GigE Interface- 40 GigE Interface- Dual 100 GigE UDP interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Navigation Design Suite for software and custom IP development
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3U 12-Slot Development Platform Aligned To SOSA 1.0 And CMOSS
39E12WUX98Y2VCM0-SOSA1
3U OpenVPX development platform aligned with SOSA 1.0. It supports both SOSA and CMOSS profiles. It includes: 2 I/O intensive SBC, 7 primary payload, 1 radial clock, 2 switch and 2 power. Includes VITA 67.3 RF and optical I/O modules.
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3U VPX SOSA Aligned Development Chassis
Model 8256
- Video: AOC 2021 Mercury's Model 8256 SOSA Aligned Dev. Platform and RFM3202 Microwave Transceiver- Video: Model 8256 3U VPX SOSA Aligned Development Platform, multi-vendor operation demonstration- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Developed in alignment with the SOSA™ Technical Standard- Ideal development platform for Pentek's- Model 5550 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- Model 5553 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- 8-slots provide space for a range of acquisition and processing boards- Optional rear panel RF and optical connections- Compatible with the Quartz product family
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8-slots 25Gb backplane aligned to SOSA
1SVX308ABP-1X31
3U 8-slots 25Gb backplane aligned to SOSA, with apertures for VITA 66/67 RF & optical modules.
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3U 2-slot OpenVPX Backplane Aligned To SOSA™ - VITA 67.3c Aperture In Slot 2
1SVX302AMP-1X31
Designed in alignment with SOSA, this 3U backplane offers 2 Plug-in Card (PIC) slots to support the DoD’s MOSA and CMOSS initiatives. The backplane supports high-speed signals on all data paths and VITA 67.3c aperture in slot 2.
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SOSA Aligned Family Of Chassis Managers, VITA 46.11
79-V46-CHMC-x-CHMC-CMx-S1
Designed to align with SOSA™, Elma’s VPX Chassis Manager assures the proper operation of the chassis and boards in defense embedded computing platforms. It monitors the health of the chassis, reports anomalies and takes actions when needed.
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3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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Core Alignment Splicer
Model：95S
OFS-95S fiber optic fusion splicer is designed as a highly flexible instrument with 6-motor precise micron levelcontrol and splice loss lower than 0.02dB for G.652 fiber. Equipped with removable universal fiber holders (250μm/900μm/patchcord/FTTx indoor fiber etc.), SOC holder and internal thermometer / barometer, OFS-95S can be deployed anywhere. Fast 5s startup, 9s splicing and automatic heating features enable the splicer an efficient tool for large volume splicing operation during fiber installation and maintenance.
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High-Speed & High-Precision Alignment for Display Metrology
LMK Position
TechnoTeam Bildverarbeitung GmbH
The LMK Position is a photometric robotic system combining LMK-based machine vision with the high precision and flexible movements of a 6-axis Denso VS industrial robot and, optionally, a JETI specbos spectroradiometer. It allows effective and cost-efficient accompanying measurements during research and development tasks and rapid small-series product testing of all kinds of display systems.
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Virtex UltraScale+ HBM FPGA Processor - SOSA Aligned 3U VPX
Model 5586
- Jade 5585 and 5586 FAQ- Co-processor for distributed FPGA processing tasks- High-Bandwidth Memory (HBM) delivers 20x more memory bandwidth than traditional DDR4 solutions- Board interfaces: 1 GigE, 10 GigE, 40 GigE, dual 100 GigE and PCIe- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX proessing powerhouse- Features Xilinx Virtex UltraScale+ HBM FPGAs- 10 GigE Interface and 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled- Navigation Design Suite for software and custom IP development
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Rugged Deployable, Rackmountable Chassis For 3U Cards Aligned To SOSA Or CPCI Serial
20037765
This unit is a rack-mountable, rugged deployable chassis for use in harsh environments. The chassis has been designed to provide modularity and flexibility to support the full design life cycle of a system from initial concept and lab development through to qualification and full platform deployment.
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MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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½ ATR For Deployable Applications Aligned To SOSA™
ATR-3600S
ATR-3600S is an off-the-shelf half-ATR specifically designed for deployable applications requiring alignment with the SOSA Technical Standard. This six-slot chassis is mission-ready to accept SOSA aligned plug-in cards (PICs) and VITA 62 power supplies and is an ideal way to rapidly integrate a deployable platform leveraging the power of SOSA.
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Laser Alignment
Laser beams are tracing a perfect straight propagating line. A special unique instrument was developed to monitor the direction and position of this laser beam, creating a cornerstone device for alignment. Typical applicationns are mechanical straightness and alignment, calibration articulated arms, accurate positioning, and many more. To facilitate unrestricted movement of the AlignMeter family a built-in wireless system was developed.
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3U OpenVPX™ SOSA™-Aligned Single Board Computer Intel® Xeon® W Processor (Tiger Lake)
68INT6H
The 68INT6H is a SOSA™-aligned 3U OpenVPX Intel® Xeon® W Processor (Tiger Lake) w/ 8 Cores & 24 M Smart Cache running up to 2.6 GHz Single Board Computer that can be configured with up to two smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6H delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Active Alignment Assembly & Test Platform
Quickly deliver flawless camera & LiDAR modules, MEMS devices, die based sensors, LED and laser-based headlights and other high-end products with a supremely accurate standardized platform.
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Inspection & Alignment Services
As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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7-Slot 3U OpenVPX Backplane Aligned To SOSA | 6 VITA 65 Slots + 1 VITA 62 PSU Slot
1SVX306AXX-XX31
These six VITA 65 slots plus one VITA 62 slot (6+1) backplanes are designed in alignment with The Open Group® Sensor Open Systems Architecture™ Technical Reference Standard, or SOSA®.
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Cladding Alignment Splicer
95EA
OFS-95EA optical fiber fusion splicer is designed with high-speed image processing technology and special precision-positioning technology. It will automatically finish the whole fiber fusion process in 9 seconds by fast mode, and splice loss is lower than 0.02dB for single mode fiber. 3.5-inch LCD, dual CMOS monitors, X and Y axis separately display or simultaneously display, thus different fusion stages can be showed clearly. It is compatible with ITU-T SM/MM/DS/NZDS/ED fiber, and is equipped with 4-in-1 holders and SOC adapter.
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3U – 6U SOSA™ Aligned VPX Backplanes
Using a modular concept based on open standards it is common practice in the civil sector to integrate subsystems components from different manufacturers into a single modular system. The SOSA™ Technical Standard aims at such an interoperability in embedded computing for military applications.
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Bi-Directional Alignment Laser
LA-01MB-AK
These bi-directional alignment lasers allow Quick & Easy adjustment of optical experiments and optical sets.
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Return Band Alignment System
6103/6106
Enable a single technician to perform return band alignment with this easy to use return band alignment system for CATV. This system consists of a headend signal level receiver/telemetry transmitter (the HECTER 6103) and a small, field portable, dual-carrier signal generator/telemetry receiver unit (HECTER'S PUP 6106).
