Common Core
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
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- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Product
Open Pluggable Specification (OPS) Digital Signage Player With 4th Gen Intel® Core™ Processor, Intel® HM86 And TPM 1.2
OPS880-HM
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The OPS880-HM is powered by 4th Generation Intel® Core™ i5 and i3 processors (codename: Haswell) with the Mobile Intel® HM86 Express chipset. The OPS880-HM supports one DDR3L SO-DIMM socket with memory maximum up to 8GB. In addition, it features one mSATA interface as storage device and two PCI Express Mini Card slots for graphics-enhanced video card, wireless LAN card for 802.11 b/g/n and 3G/GPRS, and tuner/AV capture card. The outstanding OPS digital signage module is an ideal choice for various display applications in different environments, e.g., shopping mall, corporate, education, bank, transportation, retail store, restaurant, performing art center.
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Product
Mini-ITX 12th/13th/14th Gen & And Series 2 Intel® Core™ Processor LGA1700
AIMB-279 B1
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Intel® Core™ Desktop Processors 12/13/14th Gen and Series 2Dual channel DDR5 5600MHz, max. 96GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power Input via ATX 8pin+5VSB pin headerWindows 11 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron®, Intel® Q170, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS962-512-PoE
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The IPC962-512-PoE meets the increasing requirements for maximum quality and flexibility in modern production plants. It features flexible expansion capacity, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control. This machine vision controller is powered by the LGA1151 socket 7th/6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® Q170 chipset. The IPS962-512-PoE comes with a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The real-time vision system PS962-512-PoE enables a fast and high accurate inspection to ensure that the desired quality is achieved with no manufacturing defects. It supports four IEEE802.3at PoE LAN ports and four USB 3.0 ports for connection with industrial cameras. Operating over a wide temperature range from -10°C to +55°C, the IPS962-512-PoE provides reliable and stable performance within severe environments. Its easy setup and compact design are ideal for space constrained environments. Moreover, one PCIe x16 and one PCIe x4 expansion slots allow quick installation of I/O cards and graphics cards. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
785158-33
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PXIe, 2.6 GHz Dual Core Processor PXI Controller—The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Product
Intel Core Series - Medium Branch
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Rackmount Network Appliances with Intel® Core™ Family for NFV and SD-WAN.
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Product
PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN
SHB130
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The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.
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Product
Modular Embedded Box PC With 11th Gen Intel® Core™ I CPU
UNO-2484G V2
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Intel® Core™ 11th i7/i5/i3 Processor with 8GB DDR4 3200Mb/s memory4 x GbE, 3 x USB 3.2 Gen2, 1 x USB2.0, 1 x HDMI 1.4, 1 x DP 1.4a, 4 x RS232/422/485Optional 2nd stack supports up to 2 x iDoor extension for expending wireless connectivity, industrial fieldbus or more I/OCompact fanless designRuggedized by zero cable and lockable I/O designSupports NVME storage with high data-transmission efficiency
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3100-CF Series
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- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM) and 5x Intel® i210-AT
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Product
PXI 5A Power Multiplexer, 8-Bank, 5-Channel, Isolated Common
40-651A-014
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The 40-651A-014 is part of our range of high density power multiplexer modules is suitable for switching inductive/capacitive loads up to 5A at 250VAC. It is available in the following 1-pole multiplexer formats.
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Product
MAPS Core
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An all-in-one core package includes the ADLINK products’ driver, device management utility-ACE and, PXI configuration setting utility
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Product
PICMG 1.3 Full-size CPU Card With LGA1151 8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1/Gen2, Dual LAN And DVI-I
SHB150
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The SHB150 is based on the latest LGA1151 socket 8th generation Intel® Core™ processors (code name: Coffee Lake) and Intel® C246, Q370 or H310 chipset. The SHB150 features multiple I/O options and high-speed transfer interfaces as well as superior graphics capability (Intel® HD Graphics), making it an ideal solution for smart factory automation. The Intel® Core™-based full-size SBC, SHB150, comes with two 288-pin DDR4-2666/2400 Long-DIMM sockets with up to 32GB of system memory. The PICMG 1.3 single board computer has a maximum of six SATA-600 ports supporting software RAID 0/1/5/10 for data redundancy. It also has one M.2 Key M 2280 SSD slot with a PCIe x4 interface. The SHB150 with the Intel® HD Graphics brings a true high definition visual experience with triple display configurations (Intel® C246 or Q370) via DVI-I and DisplayPort (header) ports. Moreover, the Intel® Coffee Lake-based SHB150 supports optional Trusted Platform Module (TPM) 2.0 for optimum security, Intel® Active Management Technology (Intel® AMT) 12 for remote management, as well as Intel® vPro™ technology. The industrial single board computer provides significant advantages to customers in the fields of machine vision and industrial automation operations
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Product
Digital Signage Player With 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 3 HDMI 2.0, 4 USB And GbE LAN
DSP500-523
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*8th gen Intel® Core™ i7/i5/i3 & Pentium® processor (Coffee Lake)*2 DDR4-2400 SO-DIMM for up to 32GB of memory*3 HDMI 2.0*4 USB 3.1 and 1 GbE LAN*1 M.2 Key E 2230 for Wi-Fi/BT*1 M.2 Key B 3042 for 4G LTE*1 M.2 Key M 2280 for storage
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Product
14/13/12th Gen Intel® Core™ I9/i7/i5/i3 With Intel® R680E Chipset Industrial ATX Motherboard
IMB-M47-R680E
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Discover the pinnacle of industrial computing with our flagship IMB-M47-R680E ATX motherboard, tailored for the latest 14/13/12th Gen Intel® Core™ processors. Featuring the advanced Intel R680E chipset and integrated PCIe 5.0 technology, this motherboard accommodates up to seven high-speed PCIe slots, ensuring exceptional expandability and superior performance.
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Product
Intel 8th Gen U Series CORE I3/i5/i7 CPU, EDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.1 Gen2, 4 COM (RS-232/422/485), M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe
AIMB-U233
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Intel® Whisky Lake Core™ i3-8145UE / i5-8365UE / i7-8665UESupports 1 x DDR4-2400 SO-DIMMSupports 1 x eDP (LVDS co-lay), 2 x HDMI, 3 Independent DisplaysSupports 2 x LAN, 2 x USB3.1 Gen2 Type-A Ports, 4 COM Ports (RS-232/422/485, selected via BIOS)Supports 1 x M.2 E-Key, 1 x M.2 B-Key, 1 x M.2 M-Key NVMeSupports Intel vPro (For i5 and i7 CPU)Supports RAID 0/1/5Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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Product
SBC326, 3U OpenVPX 4th Generation Intel Core i7 Single Board Computer
SBC326
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The SBC326 Rugged Single Board Computer features the high performance, highly integrated 4th Generation Core i7 processor platform from Intel.
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Product
10th Gen Intel® Core™ Processor LGA1200
AIMB-287
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Supports Intel® 10th Gen Core™ i processor (LGA1200) with Intel H420E chipsetTwo 260-pin SO-DIMM up to 32GB DDR4 2666/2933 MHz SDRAMSupports 1 M.2 M key, 1 M.2 E key, 4 COM, 6 USB 3.0 and 2 SATA IIISupports dual display of HDMI 2.0/ HDMI 1.4b/ eDPSupports TPM 2.0 (optional)THIN Mini-ITX with 12~24V DC InputSupport SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
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The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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Product
Fanless Embedded System With Intel® Core™ I7-6600U/i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LAN, 4 USB 3.0, 2 COM And PCI Express Mini Card Slot
eBOX560-500-FL
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The eBOX560-500-FL is an Intel® Skylake-based fanless embedded system with compact size and full-featured I/O interface. To bring both excellent performance and ultra-low power consumption, the palm-sized embedded box PC is powered by the 6th generation Intel® Core™ i7-6600U or Celeron® 3955U processor (formally codename: Skylake). One 260-pin DDR4-2133 SO-DIMM socket with system memory up to 16 GB is available. The power efficient IP40 embedded system supports 12V DC input with screw-lock and features a user-friendly AT/ATX DIP switch. The compact eBOX560-500-FL is suitable for Industrial Internet of Things (IIoT) solutions, digital signage, retail equipment, smart factory automation, thin clients, industrial controller systems and many more.
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Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
Intel® 12/13 &14th Gen. Core™
DPX-S455
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Very high-performance Intel Hybrid Multi-core CPUs. CPUs up to i9 24 Core, Three independent monitors including 8k & HDR options. PCIe x16 graphics card slot.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ MicroATX Server Board with 4 DDR4, 4 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-586
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- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
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Product
PICMG 1.3 Full-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1/Gen2, Dual LAN And DVI-I
SHB150R
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor (up to 95W)*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 Long-DIMM for up to 64GB of memory*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported (optional)*Supports M.2 Key M (C246/Q370)
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Product
COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor
CEM521
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The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
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Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, VGA, EDP, USB 3.0, M.2 And Dual GbE LAN
MANO523
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor*Intel® Q370 chipset*2 DDR4 SO-DIMM for up to 32GB of memory*4 USB 3.0 and 4 USB 2.0*6 COM ports*2 SATA-600 and 1 M.2 Key M*PCIe x16 and M.2 Key E
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LGA 1700 Intel® 12th Gen. Core™ ATX Server Board with 4 x DDR5, 5 x PCIe(1 x Gen 5, 3 x Gen 4, 1x Gen 3), 7x USB3.2, 4xSATA3, Quad/Dual LANs, and IPMI
ASMB-788
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and four PCIe x4 (3 x Gen 4 & 1 x Gen 3) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Four SATA 3 ports and seven USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
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Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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15.6" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-315W TGL
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Industrial-grade 15.6" FHD LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive contrHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione 640 OEM Series
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The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution. The NETD is less than 40 mK (available upon request) or 50 mK. The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
