Environmental Chamber

REXMED REC-200 - REXMED Industries Co., Ltd.

MOD. REC-200, AC 230/380/415V, 1/3 phase, Environmental chamber, HS CODE: 841989, UNCCS CODE: 484384, UMDNS CODE: 16327, Main construction: SS304, Interior: SS304, Exterior: SS304 powder coated, Insulation: Rigid polyurethane foam and glass wool, Controller: Fix point PID controller, temperature ˚C/PV and ˚C/SV, humidity %/PV and %/SV display and setting, Temperature range: -20˚C~100˚C, Humidity range: 20%RH~98%RH, Constancy: ±0.3˚C ±2.5%RH, Uniformity: ±1˚C ±3%RH, Temperature and humidity sensor: PT 100Ω, Temperature and humidity audio and visual warning and OFFS correction setting, Temperature heater: 1.5KW X 2pcs, Humidity heater: 2.5KW X 1pc, Heat up transition time: -20˚C~100˚C within 35 min, Refrigeration system: Air cooled, single stage, Cooling compressor: Bristol hermetic compressor, Cooling capacity: 1,892 Watts, 6,455 BTU/hr, 1,630 Kcal/hr, Cool down transition time: 20˚C~-20˚C within 45 min, Safety devices: No fuse breaker, refrigerator over load relay, refrigeration high pressure switch, over temperature protector, protection relay, protection fuse, water level control and overheat protector, Chamber: L50 X W60 X H75cm, Capacity: 225L, chamber with key lock, with lamp (DC 12V 50W) X 1pcs and double glass viewing window, testing cable port with cover: Ø25mm, 4 castors, W/S: shelf X 2pcs, standard testing wet cloth X 5pcs, PCV water container X 1pc

Fanless Embedded System With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 4-CH PoE And MXM 3.1 Type A

eBOX671-521-FL - Axiomtek Co., Ltd.

The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.

ARINC818 Cards

AIM GmbH

> ARINC818 is a specification which has become an Industry standard for the transmission of uncompressed digital video. This commercial standard uses Fibre Channel as a point-to-point communication link for low latency with the ARINC818 defining the packetized protocol for transmission of the digital video information. It is highly flexible and can be used for a variety of onboard display systems in both commercial and military applications. AIM’s ARINC818 cards use our field proven Common Core hardware design giving the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive DDR3 memory and IRIG-B time encoder/decoder functions are standard. The ARINC818 modules are available in PCIe formats.The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for ARINC818 interfaces. The dual core processor provides onboard processing and data transfer capabilities for the most demanding applications including ARINC818 support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized ARINC818 Interfaces enabling the board to analyze incoming data in real time. Each module provides 2 ARINC818 compliant ports. SFP cages make it suitable for different media types as optical or electrical network technologies. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our ARINC818 cards.

Coating Thickness Gauge for Ferrous and Non-Ferrous Materials

CM8856 - Rinch Industrial Co.,Limited

* It meets the standards of both ISO2178 and ISO 2361 as well as DIN, ASTM and BS. It can be used both in the laboratory and in harsh field conditions.* The F probes measure the thickness of non-magnetic materials (e.g. paint,plastic, porcelain enamel, copper, zinc,aluminum , chrome etc.) on magnetic materials (e.g. iron, nickel etc.) . often used to measure the thickness ofgalvanizing layer, lacquer layer, porcelain enamel layer, phosphide layer, copper tile, aluminum tile, somealloy tile, paper etc.The N probes measure the thickness of non - magnetic coatings on non-magnetic metals .It is used on anodizing, varnish, paint, enamel,plastic coatings, powder, etc. appliedto aluminum, brass, non-magnetic stainless steel, etc.* Automatic substrate recognition.* Manual or automatic shut down.* Two measurement mode: Single andContinuous* Wide measuring range and highresolution.* Metric/Imperial conversion.* Digital backlit display gives exactreading with no guessing or errors.* Can communicate with PC computerfor statistics and printing by theoptional cable.* Can store 99 groups of measurements.* Statistics is available.2.SPECIFICATIONSDisplay: 4 digits LCD, backlitRange: 0~1250 μm/0~50mil(other ranges can be specified )Min.radius workpiece: F: Convex 1.5mm/Concave 25mmN: Convex 3mm/ Concave 50mmMin. measuring area: 6mmMin.Sample thickness : 0.3mmResolution: 0.1 μm (0~99.9μm);1 μm (over 100μm)Accuracy: ±1~3%n or 2.5 μm or 0.1mil(Whichever is the greater)Bttery Indicator: Low batter indicator.PC interface: with RS-232C interfacePower supply: 2x1.5 AAA(UM-4) batteryOperating condition: Temp. 0~50℃ .Humidity <95% .Size: 126x65x35 mm; 5.0x2.6x1.6 inchWeight: about 81g(not including batteries)Standard accessories:Carrying case ...................1 pc.Operation manual ............ 1 pc.F probe in built .................1 pc.NF probe in built...............1 pc.Calibration foils ..............1set.Substrate (Iron) ................1 pc.Substrate (Aluminium)......1 pc.Optional accessories: RS-232C cable & software:1.USB adaptor for RS-232C2.Bluetooth interface

Coating Thickness Gauge

CM8855 - Rinch Industrial Co.,Limited

It meets the standards of both ISO2178 and ISO 2361 as well as DIN, ASTMand BS. It can be used both in the laboratory and in harsh field conditions. The F probes measure the thickness of non-magnetic materials (e.g. paint,plastic, porcelain enamel, copper, zinc, aluminum , chrome etc.) on magneticmaterials (e.g. iron, nickel etc.) . often used to measure the thickness ofgalvanizing layer, lacquer layer,porcelain enamel layer, phosphidelayer, copper tile, aluminum tile, some alloy tile, paper etc. The N probes measure the thickness of non - magnetic coatings on non-magnetic metals .It is used on anodizing, varnish, paint, enamel,plastic coatings, powder, etc. appliedto aluminum, brass, non-magnetic stainless steel, etc. Automatic substrate recognition. Manual or automatic shut down. Two measurement mode: Single and Continuous Wide measuring range and high resolution. Metric/Imperial conversion. Digital backlit display gives exact reading with no guessing or errors. Can communicate with PC computer for statistics and printing by the optional cable. Can store 99 groups of measurements. Statistics is available.2.SPECIFICATIONSDisplay: 4 digits LCD, backlitRange: 0~1250 μm/0~50mil (other ranges can be specified )Min.radius workpiece: F: Convex 1.5mm/Concave 25mmN: Convex 3mm/ Concave 50mmMin. measuring area: 6mmMin.Sample thickness : 0.3mmResolution: 0.1 μm (0~99.9μm);1 μm (over 100μm)Accuracy: ±1~3%n or 2.5 μm or 0.1mil(Whichever is the greater)Bttery Indicator: Low batter indicator.PC interface: with RS-232C interfacePower supply: 2x1.5 AAA(UM-4) batteryOperating condition: Temp. 0~50℃ .Humidity <95% .Size: 126x65x35 mm; 5.0x2.6x1.6 inchWeight: about 81g(not including batteries)Standard accessories:Carrying case ...................1 pc.Operation manual ............ 1 pc.F probe in built .................1 pc.NF probe in built...............1 pc.Calibration foils ..............1set.Substrate (Iron) ................1 pc.Substrate (Aluminium)......1 pc.Optional accessories: RS-232C cable & software:1.USB adaptor for RS-232C2.Bluetooth interface

Turns Ratio Testers

TRT Standard Series - IBEKO Power AB

When it comes to choosing a transformer turns ratio tester, TRT Standard series offers some of the most advanced instruments with LCD display out in the market. Each model measures transformer excitation current and phase shift performs automatic vector group detection and magnetic balance on three-phase transformers and three-phase autotransformers. Furthermore, they have a built-in true three-phase power source. Because of that, TRT Standard instruments can test transformers with special configurations, such as phase-shifting, rectifier, arc-furnace, traction transformers, etc.The instruments can output test voltages from 1 V AC to 250 V AC, depending on the chosen model. High test voltage of 250 V AC provides more accurate turns ratio testing compared to other turns ratio testers on the market and extremely low test voltage of 1 V AC enables turns ratio verification of current transformers.TRT Standard series consists of:TRT03 Models (TRT03A, TRT03B, TRT03C) – single-phase voltage up to 100 VTRT3x Models (TRT30A, TRT30B, TRT30C, TRT33A, TRT33B, TRT33C) – single and true three-phase voltage up to 100 VTRT63 Models (TRT63A, TRT63B, TRT63C) – single and true three-phase voltage up to 250 VMore about models differences can be found under the downloads tab, in brochures and comparison sheets.A user can create test templates using the DV Win software and store them in the PC’s memory for later use when in the field.TRT Standard series models have a built-in tap changer control unit. Consequently, it enables remote control of an on-load tap changer (OLTC) directly from the tester. In order to make the most out of this feature, the DV-Win software can be programmed to do everything automatically – running turns ratio tests, changing OLTC tap positions and saving results. This option, especially in combination with test templates, significantly facilitates and shortens the turns ratio testing time.

3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

MIC-6330 - Advantech Co. Ltd.

Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.

Three-Phase Transformer Winding Resistance Meters

TWA Standard Series - IBEKO Power AB

When it comes to winding resistance measurement on three-phase power transformers and autotransformers, TWA Standard series offers some of the most technically advanced instruments with LCD display in the market. Both models are capable of testing six transformer windings with a one-time cable connection, as well as three-phase automatic transformer demagnetization. The stored magnetic energy is safely automatically discharged at the end of the test. The built-in tap changer control unit enables automated test mode, where the instrument operates the tap changer without operator input and records winding resistance results based on pre-selected stabilization criteria. This option makes the operator’s job significantly easier.Both models can output test currents from 5 mA to 25 A DC for the purpose of winding resistance measurement. TWA40D has a special test mode for checking the synchronization of on-load tap changers with three phases simultaneously tested in parallel, in which the total test current can rise to up to 40 A DC.TWA40D has additional advantages when it comes to non-intrusive tap changer analysis. The unique DVtest method enables checking the moving contacts of on-load tap changers during the transition, measuring the transition time, detecting open circuits, and many other types of faults. It is performed with 0.1 ms sampling rate, simultaneously with the measurement of tap changer motor current which helps with the detection of motor and mechanical issues. A special proprietary algorithm is used for testing tap changers connected through a built-in series (booster) transformer. The DVtest can be performed either on one phase or on three phases simultaneously. It can also be performed as an additional test simultaneously with the winding resistance test in all tap positions.An additional unique advantage of TWA40D is the capability of simultaneously testing the winding resistance of all three phases of a three-phase transformer (connected in a YN configuration). This can significantly shorten the total testing time – for example, it enables the operator to perform 33 measurements instead of 99 on a tap changer with 33 tap positions.The test leads for TWA three-phase transformer winding ohmmeters are interchangeable with the TRT turns ratio testers, which means that both sets of tests can be performed with a single test lead connection to the power transformer terminals.

6U CompactPCI 4th Generation Intel® Core™ i3/i5/i7 Processor Blade with ECC support

MIC-3396 - Advantech Co. Ltd.

Using 4th generation Intel® Core™ i3/i5/i7 processors based on 22nm process technology supporting up to four cores / eight threads at 2.4GHz and 6MB last level cache, the MIC-3396 blade boosts computing performance deploying the latest virtualization, techniques and CPU enhancements. Onboard soldered low voltage DRAM (1.35V) with ECC support and optional memory expansion via an SODIMM socket extend the memory to a maximum of 16GB supporting the most demanding applications in high performance or virtualized environments. Dual channel design and memory speeds up to 1600MT/s along with increased cache size and cache algorithms guarantee maximum memory performance. Combined with the powerful Intel® QM87 chipset, the 4th generation Intel® Core™ processors offer improved I/O performance by leveraging 5GT/s DMI and 3rd generation PCIe interfaces. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines such as the MIC-3666 dual 10GE XMC card. With SATA-III support and up to 7Gbps I/O. the latest enhancements in storage technology such as high speed SSDs or traditional HDDs can be used on the MIC-3396. Five gigabit Ethernet ports based on Intel® GbE controllers for front and rear,including two PICMG 2.16, ensure best in class network connectivity The processor’s integrated enhanced graphics engine (Iris) offers twice the performance over previous generations. With triple independent display support, the MIC-3396 is an ideal fit for demanding workstation applications. RASUM features integrated in the CPU and chipset combined with PICMG 2.9, IPMI-based management make the MIC-3396 a highly available and reliable computing engine. The RIO-3316 RTM module supports one PS/2 connector with both keyboard and mouse ports, one USB 3.0, two USB 2.0 ports, two RS-232 ports, two SATA ports, two DVI ports, and two Gigabit Ethernet ports. In case of the SATA disk drives and SATA RAID support of the QM87 do not meet performance and reliability requirements, the RIO-3315 SAS version supports a 4-port SAS controller with RAID and fail over support.

Mini Receiver

FB7-NX - National RF, Inc

In about 1935, the National Radio Company of Malden, Mass., brought out a “hot” high frequency receiver, called the FB7, and the subsequent FB-7X. It featured a super-hetrodyne design with plug-in coils that gave it a broad frequency range. The “X” model also incorporated a crystal filter in the intermediate frequency section, thus giving it additional selectivity. The receiver was viewed by radio amateurs as a technological breakthrough, and it was also used commercially for point to point high frequency communications. As the receiver did not have an internal RF amplifier section, a separately tunable RF amplifier was later provided in a separate enclosure for additional performance capabilities. Now, National RF, Inc., is resurrecting the fabled receiver name with an all solid-state, hot mini receiver, which also utilizes plug-in coils to cover the HF spectrum. The mini-receiver is designed for use by radio amateurs as well as serious short-wave listeners, and allows reception of AM, CW, and SSB signals. It incorporates a super-hetrodyne design with a dual gate FET built-in RF preamplifier and a ceramic filter for selectivity, often required when used in a crowded amateur radio band. In addition, the receiver has a buffered rear panel output of the high frequency oscillator for use with either a frequency counter for exact receive frequency display, or for interface with an outboard transmitter. A rear panel jack is also provided for muting the receiver when a transmitter is placed into the transmit mode. And, the receiver is small enough to fit into carry-on luggage and taken on trips when it is desired to “keep an ear” on amateur radio or other high frequency activity. The receiver utilizes rear panel plug-in coil assemblies which contain the RF amplifier, mixer, and oscillator tuned circuits. Each plug-in coil assembly also comes with a separate dial scale, which is inserted onto the front panel for displaying the tuned frequency. A very smooth 6 to 1 planetary drive is used for tuning the receiver. Other front panel controls include RF preamplifier peak, volume control, Beat Frequency Oscillator adjustment, and RF gain control. Other switches include filter bandwidth, AM/CW/SSB selection, Power, and a general coverage/band spread control for certain plug-in assemblies. The receiver is intended to drive head-phones via a rear panel jack, but has sufficient output to drive a small external speaker.

Wiring Analyzers for Cables, Wire Harnesses, Backplanes

CableEye M2Z, M3Z, M4 - CAMI Research Inc. (CableEye®)

Fast ● Simple ● Precise Advanced wiring analyzer scans for continuity (opens, shorts), miswires, resistance, capacitance, components (resistors, diodes, LEDs, capacitors), insulation resistance, intermittent connections. For diagnostic and Pass/Fail Testing All CableEye^® testers are suitable for production, fault diagnosis, QC (Quality Control), assembly, and prototyping of standard or custom cables. Each combines test, fault location, design, documentation, labeling, and database storage in one instrument. Tests can be performed on long cables (with or without connectors) or no cables (e.g. connectors, backplanes, PCBs, components). Standard Features & Benefits:

• USB certified, PC-based tester for a versatile, fast, robust system with long life-cycle.
• Multilingual, dynamic, graphic-rich display (netlist & wiring schematic) provides clarity and speeds diagnostics.
• 128 Test Points, expandable to 1024 providing flexibility as your product line changes.
• Real-time screening for intermittent connections for pinpointing elusive faults and improving quality.
• Automation scripting in a simple, intuitive language allowing non-programmers to reduce operator error by automating repetitive steps.
• Pop-Up Work Instructions. choose the exact amount of detail, imagery, language and automation you need to ensure your work instructions and tests are carried out flawlessly.
• Flexible tolerancing: optionally define as percentages or absolute terms, as well as asymmetrically (e.g. +0%/-10%) for improved yields.
• Barcode-tracking & archival data-logging to achieve error-proof test process and improved traceability & productivity.
• Print PASS/FAIL labels, test reports (with or without color wiring schematics/netlists) and log reports to satisfy ISO9000 reporting requirements.
• Compatible with laptop and touchscreen PCs for fieldwork and rack/off-bench mounting.

Includes: CB15C board set (Item 745C) for common computer and peripheral device cables; comprehensive PC software with Database of >200 standard cables; 2 yr Product Support Subscription comprising Warranty, free tech support, and free software upgrades. Select Add-On Options: Hardware: 128-point Expansion Modules (attach to base); Environmental Sensor Software: PinMap™ fixture editor, Connector Designer™ connector editor, or Autobuild™ guided assembly modules camiresearch.com |@CAMI_CableEye |+1.978.266.2655

Universal Programmer Superpro 6100N

Xeltek

Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.

76kWh Lithium Battery 384V 200AHSolar Energy Storage LiFePO4 battery System

SPVLI-76KWH - Zhejiang Sandi Electric Co., Ltd

SANDI ESS lithium battery system is composed of lithium battery modules, BMS system, PV charge controller, AC/DC Charger, central control unit CCU, temperature detector, integrated structure and other parts; the solar panels in the system are battery storage and power for output; BMS module completes the detection and control of voltage, current, temperature, SOC, SOH and charging and discharging related parameters of power battery pack; PV controller and inverter realize bidirectional AC/DC function to meet the charging and discharging conversion demand of power battery pack; each detector is used to monitor the ambient temperature in real time to ensure the safety of the system.Features1. Standardized components, modular architecture, easy for expansion2. High energy density, small footprint, short construction period, strong environmental adaptability3. Battery module within the layered stack design, with more than 10 years of long design life4. Long Cycle Life LiFePO4 Lithium ion Battery system from 20KWH-500KWH optional5. The use of international advanced Mitsubishi IPM module and intelligent power module, with high power fast adjustment capability6. BMS battery management system with SOC automatic calibration and high current active balance function, combined with the perfect operation control and management strategies to achieve accurate and efficient management7. The combination of software and hardware protection, with alarm protection and automatic diagnostic functions, improve the protection strategy to ensure safe and efficient operation of the system8. Product communicates with the monitoring platform in real time through RS232, CAN communication interface, and reports various records in time to ensure real-time monitoring of the battery pack of the monitoring platform9. PV charge controller adopts three charging stages (buck charging, equalize charging and float charging) which can maximize the utilization of PV modules and batteries10. Colorful LCD display all module working information and statusSpecificationModel SPVLI-76.8KWHType of cell LiFePO4 (Lithium iron phosphate)Battery configuration 3.2V 200AH 120PCSRated capacity (KWH) 76.8kwhNominal capacity (AH) 200AHNominal voltage (VDC) 384VOperating voltage range (VDC) 312-438VRecommended Charge Voltage (VDC) 420VRecommended discharge cutoff voltage (VDC) 360VRecommended charge current(A) 100AMax Charge Current (A) 200ARecommended discharge current (A) 100AMax Discharge Current (A) 200ACharge temperature range 1~45℃Discharge temperature range -10～45℃Solar Charge Controller InputMaximum. Input voltage of solar array（Vdc） <750VdcBattery system voltage 384VDCMaximum power of solar array 40KWMaximum charge current（A） 100AEqualization charging voltage (Vdc) 426VEqualize charging recovery voltage (Vdc) 405.6VOver voltage disconnect voltage (Vdc) 438VOver voltage recovery (Vdc) 432VWorking temperature -20~50℃Protection level IP20Communication interface CAN2.0, BMSDisplay 5" LCD, EnglishCooling system Fan coolingWorking Altitude (m) ≤3000mReference Weight (Kg) 920KgReference size (W*D*H mm) 900*1100*1700mm

OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

MIC-6314 - Advantech Co. Ltd.

The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.

OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

MIC-6313 - Advantech Co. Ltd.

The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.