Geometry
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Product
High Current Probes
High Current Probe
*Low internal resistance to minimize arching*PogoPlus bias ball design*High current optimized base material and plating*Higher temperature spring design*Specialized high current tip geometry
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Product
Industrial Computed Tomography
TomoScope® XS
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Coordinate measuring machine for three-dimensional measurement utilizing computed tomographyFast measurement with high resolution via the next generation transmission tubeReduce measurement time by 90% with OnTheFly TechnologyLow operating costs as a result of the new monoblock designExtremely precise air bearing rotary axis for low measurement uncertaintyLow space requirement thanks to compact designLow weight allows for installation almost anywhereFast amortization through low acquisition costsStandard-compliant calibration for reliable and traceable measurement results, optionally with DAkkS certificateVersatile fields of application such as plastic, metal and multi-material componentsSoftware for 3D real-time reconstruction of workpiece geometries during tomography
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
High Quality UCI - And Leeb-measuring Technology
SONODUR Product Family
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Foerster Instruments, Incorporated
The non-destructive UCI test method (Ultrasonic Contact Impedance) as well as the Leeb test method enable fast and mobile measurement as a supplement to the classical hardness test. Due to the compact measuring probes and sensors of the SONO series, the devices can also be used in difficult test positions and with complex component geometries. Fields of application are e.g. incoming goods inspection, mix-up testing, production control, quality assurance, weld seam testing, cut edge testing, maintenance on installed components as well as the replacement of dynamic hardness testers for small material thicknesses (below 50 mm, e.g. boilers, tubes).
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Product
Diagonal Measurement Kit
10768A
Mechanical Calibration Kit
The Keysight 10768A Diagonal Measurement Kit is designed for use with the Keysight 5530 Laser Calibration System. It allows linear measurements to be made on the four body diagonals of a machine tool's working volume. These measurements document the machine's capability and quickly perform a complete check of volumetric positioning performance. In addition, long-term drift tests can be performed over hours or days, showing possible effects of temperature on geometry.
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Product
Fiber Geometry System
FG500
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The FG500 is a fiber geometry system that measures the physical dimensions of the fiber including core, cladding, and coating diameter, non-circularity, and eccentricity. The FG500 is designed to produce accurate measurements quickly and with confidence.
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Product
Coordinate Measuring Machines
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Coordinate Measuring Machines (CMMs) measure the geometry of physical objects by sensing points on the surface of the object with a touch probe. They are commonly used in manufacturing processes to inspect a physical part or assembly against the design specification.
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Product
Drawing Die And Wire Measurement
DGMS – Die Geometry Measuring System
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Optik Elektronik Gerätetechnik GmbH
Measuring system for diameter, roundness, reduction angle and bearing length of wire drawing dies.
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Product
Digital Automated Interferometer and Microscope for Surface Inspection
DAISI-V3
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The ultimate production interferometer for measuring end-face geometry on single-fiber connectors, equipped with a revolutionary «no-exterior-moving-parts» mechanical design.
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Product
Substrate Manufacturing
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KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Product
High Impedance Active Probes
7
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Designed as a companion probe to Models 12C and 18C for driving integrated circuit lines so the Model 12C and 18C can be used to measure the response of adjacent nodes. The Model 7 consists of a flexible 6 foot, 50 ohm coaxial cable accurately terminated to 50 ohms in order to avoid undesirable reflections. A special miniature connector receives replacement coaxial probe tips that provide a shielded environment to within 3 mm of the fine tungsten probe point, thus minimizing capacitive coupling to other parts of the circuit. The replaceable coaxial probe tips are offered in various point sizes and can also be bent to any shape in order to accommodate a variety of probing geometries.
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Product
High Power LED Test System
Lumere-GM
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Evolusys Technologies Sdn. Bhd.
Lumere GM is a LED test and measurement system for various parameters of LED light. It is a high-accuracy system with a temperature-controlled CCD, its geometry conforms with CIE-Publication 127, and the test program is easy to configure and adjust. The Lumere GM is used in laboratory applications and in the production of high-power LEDs.
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Product
Non-Destructive Testing (NDT)
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Marposs complements its geometric measurement solutions with solutions for non-destructive testing using eddy current technology.The testing options can be divided in three large groups:Material integrity test, to check for the presence of defects (cracks, porosity, blow holes, inclusions) on the surface and in the layer just below the surface.Material properties test, to check if the thermal cycles (hardening, hardening and tempering, annealing, stress relieving, etc.) have been performed correctly. Material identification checks are done to sort parts with the same geometry but made with different materials.Thread inspection to check if the treading has been carried out and its quality.In addition to the non-destructive checks performed with the eddy currents, we have developed a durometer for the conventional measurement of surface hardness, according to the Rockwell scale (HRC or HRA); which uses a diamond penetrator to measure the hardness of the sample being tested.
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Product
100μm Flexible PET IDE Sensor Chip
FPI1
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100μm flexible PET interdigitated electrode (IDE) sensor chip for gas sensing, humidity monitoring, biosensing, and capacitive sensing research. The electrode geometry is designed for repeatable response, compact sample volumes and easy integration with potentiostats or custom fixtures.
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Product
High Precision Angular Position, Calibration and Geometry Inspection
GeoOrdinate
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Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.The GeoOrdinate has been designed specifically for the inspection of large and heavy components and is fully compatible with any shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
