Showing results: 16 - 30 of 30 items found.
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Curtiss-Wright Defense Solutions
The 3U VPX (VITA 46 and 48.2) Flash Storage Module (FSM) provides high-performance, high-capacity, solid-state SATA storage with AES-256 bit encryption using an Application Specific Integrated Circuit (ASIC) that is FIPS-140-2 validated (Certification #1472). The 1" pitch conduction-cooled solid state storage device utilizes high reliability SLC NAND flash designed for the most demanding application.
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T5851/T5851ES -
Advantest Corp.
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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ELMA Electronic, Inc.
Elma offers the most complete line of storage modules in the embedded computing industry. Board sizes include 3 U, 6 U, mezzanine and small form factors in VPX, VME, CompactPCI, PMC and XMC standards. Environmental capabilities address commercial and rugged applications with SSDs (solid state drives) and rotating drives (HDD) and surface mount NAND flash. Choose from features including RAID, front panel removability, high capacity conduction cooled mezzanine storage, secure erasure or write protection.
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Signals & Systems India Private Limited
SANDS DCU is an ideal gateway solution for the Energy Management System (EnMS). It provides connectivity to the cloud apart from data collection, local data storage. DCU is based on ARM Cortex-A5 processor having 512MB of DDR2 memory and expandable NAND Flash memory upto 2GB. Edge / Sensor data can be stored locally using the on-board SD card option. The cloud interface is LTE with 2G/3G fall back.
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T5835 -
Advantest Corp.
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Intellitech Corp.
The PT100Pro combines ARM Functional Test, Analog Test and Boundary Scan in one platform for testing up to 32 PCBs at a time. The PT100 Pro solves the test challenges and cost requirements of testing small, high-volume PCBs used in the home, mobile, entertainment, automotive and embedded markets. PCBs in these markets are cost sensitive yet require high volume, high fault coverage on leading edge technologies such as WiFi, DDR Memory, USB, Bluetooth, Nand Flash, MPEG decoders, Power Management Units, and MMC/Smart Cards interfaces.
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4900 -
BPM Microsystems
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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GX7927 Series -
Marvin Test Solutions, Inc.
The GX7927 is a Single Board Computer (SBC) that features the high performance, highly integrated Core i7 processor platform from Intel. Core i7 offers an integrated graphics and memory controller plus dual core processing, operating at speeds up to 2.53 GHz. Coupled with the Mobile Intel QM57 Express Chipset, the GX7927 provides an unmatched level of I/O bandwidth for both onboard and off-board functions. The module is supplied with 4 GB of DDR3 SDRAM and 16 GB of NAND Flash memory. Both standard and extended temperture operation range versions are available.
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SD Card v.3.0 / eMMC v.4.51 IP Family -
Arasan Chip Systems, Inc.
Designed for embedded applications that require high performance, small form factor, and high storage capacity, eMMC provides the support for embedded mass storage memory on embedded host systems. The eMMC protocol simplifies the access to NAND flash memories (such as MLC) to the host by hiding the functional differences among suppliers. Compliant to the latest JEDEC eMMC specifications, Arasan’s eMMC IP supports power-on-booting without the upper level software driver. The explicit sleep mode allows the host to instruct the controller to directly enter the sleep mode. The interface supports interface voltage of either 1.8V or 3.3V.
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Xeltek
Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.
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MIC-3396MIL -
Advantech Co. Ltd.
The MIC-3396MIL is specially design for ruggedized applications, and offers three different configurations that meet a wide range of environment requirements. Using 4th and 5th generation Intel® Core™ i5/i7 and Intel® Xeon® processors, it supports up to four cores / eight threads at 2.7GHz and 6MB last level cache. Ruggedized requirements are addressed by a conduction cooled design an extended operation temperature range (-40 ~ 85° C measured at wedge lock). Shock and vibration resistances of the board are increased by using wedge locks and a single-piece CNC-milled aluminum alloy plate that conforms to the major IC packages. With highly integrated functional capabilities, the MIC-3396MIL fully utilizes the I/O features of the Intel® chipsets. It supports maximum 16GB of 1600 MHz DDR3L RAM, an onboard 2.5" Serial ATA HDD or SSD, a CFast slot, for an onboard NAND flash (as optional), one PCIex16 and a set of I/O functions brought through the backplane to a unique rear transition module, which contains eight GPIOs, two USB 2.0 and four RS-232/422/485 console ports as pin headers, two SATA Gen III and two SATA Gen II as connectors, two/four LAN ports (two LAN ports are switchable form front panel to RTM), two DVI ports, two USB 3.0, one PCIex16, one P/S2 port and one RS-232/422/485 port on the front panel.
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MIC-3397 -
Advantech Co. Ltd.
Advantech’s MIC-3397 is a 6U CompactPCI single board computer with a choice of server class processors based on the Quad-Core Intel® Xeon® E3-1125C v2(40W), with DH8900 chipset. The processor is based on Intel® 22nm 64 bit process technology, with up to 2.5GHz clock speeds 8MB L3 cache, Intel® Hyper-Threading, Virtualization, and Trusted Execution Technology, all of which enable the board for applications requiring higher levels of performance and security. The MIC-3397 supports dual channel ECC memory, up to 16GB DDR3 at 1333/1600MHz with max 8GB on board and 8GB SO-DIMM memory, three 2.5” Serial ATA interfaces (one on board optional with one 8 GB NAND flash, two to RTM),one Cfast slot, five Gigabit Ethernet ports (two on front panel, two to PCIMG2.16, two to RTM with one optional on the front panel), six USB2.0 ports (three on front panel, three to RTM), two VGA ports (one on front panel, one to RTM) on the 4HP model, three COM ports (one to front panel, two to RTM), one PS/2 port, and one PCIe2.0 x4 interface reserved for user define extensions on the rear transition module. MIC-3397 Series can be installed in a standard CompactPCI system slot as system master, or peripheral slot as stand-alone server blade without CompactPCI bus communication, it meets the needs of applications operating in harsh enviroments and is ideally suited for datacom, telecom and military applications. Its outstanding graphics capabilities make it a good choice for image-processing in medical, defense system and many other vertical segments applications.
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MIC-6315 -
Advantech Co. Ltd.
The MIC-6315 is the 6U OpenVPX processor blade echoing to the customer’s requirements. Based on the Intel® Xeon® D-1500 processor family, the MIC-6315 supports to 12 cores/24 threads, to fulfill the computing requirements form the customer. The MIC-6315 provides various high speed interfaces to communicate with the system: dual Serial Rapid I/O on the Data Plane, a configurable PCIe gen. 3 x 16 port on the Expansion Plane, with another x8 and x4 PCie ports on the user-define plane, and there are two 40GBase-KR4 ports available on the user-define plane. These interfaces enable the possibility of high speed data communication to optimize the performance of the product. Serial Rapid I/O and PCI express have low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards to create a system with vast functions. To maintain the maximum memory throughput in the different harsh environments, the Advantech R&D teams dedicate themselves to optimize the layout of the product. The MIC-6315 is capable to support ECC in a dual channel design running up to 2133MT/s with 64GB capacity*, and has the default capacity of the onboard DDR4 with 32GB or 16GB. The MIC-6315 offers three types of the storage options: A 64GB onboard NAND flash as the native storage, and three M.2 sites with 1x SATA M.2, 2x NVME M.2 interfaces are supported at the same time. The MIC-6315 has a reinforced convection-cooled heatsink as the thermal solution. Two native ruggedized connectors are available on the front panel, and several common I/O port connectors can be used for debugging purpose at the same time. Compliant with the IPMI 2.0, the MIC-6315 uses Adavantech-code-based board management solution, and supports iKVM, remote control and upgrade. This Advantech BMC code uses the LTS kernel for stability and security, and enables the possibility of customization. The user can setup the PCIe switch configuration in the BIOS menu without any firmware or hardware modification.
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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Xeltek
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
