Showing results: 46 - 60 of 277 items found.
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FilmTek 2000 PAR-SE -
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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NGS 3500Z -
RMS Vision Systems Inc
This bench top lower cost, yet high performance system is designed for applications where defect detection and precisionmeasurements on wafers and other parts (up to 200 mm) are required. It is well suited for use as a dedicated productiontool or as a versatile process development system. It features a powerful set of automated as well as semi-automaticoptical/ video tools optimized for high accuracy, production throughput, and ease of use.This automated and versatile platform features a standard Nikon/ Olympus bright/ dark field microscope with optionalNomarski, and precise part staging. This system offers significant and unique advantages for dual production/ engineeringuse, and provides the perfect solution when both defect detection and dimensional metrology are required.
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PINNACLE PLUS -
VIEW Micro-Metrology
Pinnacle+ Plus elevates Pinnacle performance to the next level. Pinnacle+ Plus features a rigid granite optical support structure and a high performance Z-axis motion assembly to produce the lowest possible uncertainty on micro-electronic parts and assemblies/
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SUMMIT -
VIEW Micro-Metrology
The VIEW Summit systems are designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in the VIEW Pinnacle, the Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.
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Automated Precision Inc.
As a leading provider of precision measurement equipment we are experts at training new equipment customer on how to get the best out of the equipment and training in the accompanying software functionality. Training can take place at an API facility or your location. Customers will required to pass a competency test and will subsequently receive a certificate of training completion.
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4D Technology
4D custom interferometers and laser interferometers overcome difficult environments, complex setups and one-of-a-kind measurement problems, at wavelengths from DUV through IR.
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Shining 3D Tech Inc.
SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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GOM GmbH
The GOM CT scans complex components in one measuring sequence and thus makes the entire part including internal structures available with component positioning performed automatically. GOM CT technical specifications: 225-kV x-ray source | 3k detector | Measuring Volume: 240 mm x 400 mm | Photogrammetric Calibration | Temperature balancing | 5-axis kinematics.
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NGS 3500L -
RMS Vision Systems Inc
This top performance system is designed for applications where high-speed defect detection and precision measurements on wafers and other parts are required. It is well suited for use as a dedicated production tool or as a versatile processdevelopment system. It features a powerful set of automated as well as semi-automatic optical/ video tools optimized for high accuracy, production throughput, and ease of use.
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TableTop Shadow Moiré (TTSM) -
Akrometrix, llc
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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MTI Instruments
Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
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Archimedes -
Malvern Panalytical Ltd
Archimedes is an innovative instrument which uses the technique of resonant mass measurement to detect and accurately size and count particles in the size range 50nm to 5um*. Archimedes can distinguish different species from their buoyant mass is particularly useful when characterizing proteinaceous aggregates from contaminating silicon oil in biopharmaceutical preparations, in distinguishing bubbles from lipid micelles and contaminants in ultrasound contrast agents or protein from fat in dairy products.
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MTI Instruments
Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
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Labsphere, Inc.
Electrical and Spectral Flux Measurement System for Lighting
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ASML
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.