Bump
-
Product
Shock Test System
-
Labtone Test Equipment Co., LTD
Products are inevitably affected by impact, bump, free fall, tumbling etc. during production, transportation, loading and unloading as well as during the use of the products. All of these are transient excitation on the object, causing the object to produce mechanical characteristics of high speed, acceleration, strain rate instantly. These kind of characteristics are completely different from that in static load, and may cause problems to the object in terms of structural strength and stability and sometimes the object may fail. Therefore, it's necessary to study the effect of impact and reproduce the shock environment, to assess the structural strenghth and performance of the object under shock environment.
-
Product
Shock Tester
DP-1200
-
King Design Industrial Co., Ltd.
Shock or bump test mainly simulate the impact effects of product and its components encountered in usage and transit process. Through standard and high-reproducibility instant energy exchange, you can analyze the product ability to tolerate the strong external stress and the degradation of structural weaknesses to quickly obtain the data of structure strength, anti-shock appearance and anti-drop. Shock tester is one of destructive experiments, and do destructive test on the product to evaluate the product reliability and monitor the consistency of production line.
-
Product
Vibration Testing System
-
Torontech is now offering Vibration Test Systems, Shock Test Systems, Bump Test Systems, Drop Tester, and Packaging Transportation Simulators.
-
Product
ArgoBot Kit
ROB-00001
-
The ArgoBot Full Kit is a fully assembled robot and controls development platform. It is based on the Digilent chipKIT WF32(TM), a WiFi enabled development platform, and configured for LabVIEW targeting. Most importantly ArgoBot was designed with FIRST Robotics Competition teams in the front of our minds! Named after the FRC Team 1756 mascot, Argos, the ArgoBot development platform includes a fully-assembled, ready to drive mini WiFi enabled robot (about 8" x 5" x 4"), as well as tons of FRC controls tutorials and example code (LabVIEW VIs). Features included on the ArgoBot will look very familiar to anyone who has worked with National Instruments products (Compact RIO and RoboRIO) in the past. This includes three 5V Digital I/O modules (with jumpered pull-ups), three 5V analog inputs, and an I2C header. Example VIs have been streamlined to enable a 1-click configuration style to accelerate your development process. We also added a 2-channel motor driver that is used to supply the ArgoBot drive motors. Our ultimate goal is that everything you can build, control or implement on ArgoBot can be easily leveraged on your FRC bot! Complimenting its many electrical features, ArgoBot is easy to work with and easy to maintain. The chassis is a polycarbonate (the extremely tough stuff that is easy to drill and modify but easily takes bumps and bruises without cracking) case that is fully intact - meaning that ArgoBot doesn't just come with a case... it is a case! Clean-up and organization is simple - just close the case and turn off the power switch.
-
Product
Semiconductor
-
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
-
Product
Light and Energy Meter
Model 659
-
UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
-
Product
Probe Card
VS Series
-
Japan Electronic Materials Corp.
*Vertical contact Probe Card with Spring*Suitable for Area array Bump Test
-
Product
Pneumatic Vertical Shock Test System
KRD11 series
-
KRD11 series pneumatic vertical shock test system is featured with advanced design, high degree of automation and reliability, simple operation and convenient maintenance. The system meets the requirements of both shock and bump test, can perform conventional half-sine wave, post-peak sawtooth wave, trapezoid wave and other waveform shock tests.
-
Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
-
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
-
Product
Easy3DMatch
-
Align a scanned 3D object with another scan or with a reference meshCompute the local distances between 3D scans and a golden sample or reference meshDetect anomalies such as misplaced features, geometric distortions, gaps, bumps,...Compatible with all 3D sensors that produce point clouds, depth maps or height maps
