Showing results: 106 - 117 of 117 items found.
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Teledyne Defense Electronics
Teledyne e2v HiRel provides microelectronics packaging and products with a full range of packaging solutions from COTS to MIL-PRF-38534 compliant (Class H & K) qualifications. HiRel provides a one stop solution for your microelectronic assembly, evaluation, test and screening requirements. Our MCM packaging technology enable our customers to meet size, weight, power and cost (SWaPC) requirements without a sacrifice in performance. Our numerous certifications including AS9100, ISO 9001, and MIL-PRF-38534 Class H accreditation, all of which are integral factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customers' stringent requirements. We are a DOD Trusted Source for Microelectronics Packaging, Assembly, and Test.
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Multidyne
Sometimes you just want to connect everything at once. Recognized worldwide as a leading supplier of fiber-optic solutions, MultiDyne now operates a full-service cable fabrication lab. Our rigorous in-house qualification and testing processes bring greater quality control to our product manufacturing workflow. As a Neutrik COCA member, MultiDyne is one of the few certified assemblers of ruggedized opticalCON hybrid fiber cables. MultiDyne also terminates SMPTE 304M LEMO connectors and offers other tactical cables that easily mate to SMPTE fiber-optic cameras, standard breakout boxes, and our other fiber-optic transport solutions. With all assembly happening in-house by specialized technicians, customers can purchase all components of a complete MultiDyne fiber transport solution - or new cables and assemblies to upgrade existing fiber systems.
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KLA-Tencor Corp
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Shimadzu Corp.
EDXIR-Analysis software is specially designed to perform qualitative analysis using data acquired by an energy dispersive X-ray (EDX) fluorescence spectrometer and a Fourier transform infrared spectrophotometer (FTIR). This software is used to perform an integrated analysis of data from FTIR, which is excellent at the identification and qualification of organic compounds, and from EDX, which is excellent at the elementary analysis of metals, inorganic compounds and other content. It then pursues identification results and the degree of matching. it can also be used to perform EDX or FTIR data analysis on its own. The library used for data analysis (containing 485 data as standard) is original to Shimadzu, and was created through cooperation with water supply agencies and food manufacturers. Additional data can be registered to the library, as can image files and document files in PDF format. It is also effective for the linked storage of various types of data as electronic files.
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EDXIR-Analysis Contaminant Finder/Material Inspector -
Shimadzu Corp.
EDXIR-Analysis software is specially designed to perform qualitative analysis using data acquired by an energy dispersive X-ray (EDX) fluorescence spectrometer and a Fourier transform infrared spectrophotometer (FTIR). This software is used to perform an integrated analysis of data from FTIR, which is excellent at the identification and qualification of organic compounds, and from EDX, which is excellent at the elementary analysis of metals, inorganic compounds and other content. It then pursues identification results and the degree of matching. it can also be used to perform EDX or FTIR data analysis on its own. The library used for data analysis (containing 485 data as standard) is original to Shimadzu, and was created through cooperation with water supply agencies and food manufacturers. Additional data can be registered to the library, as can image files and document files in PDF format. It is also effective for the linked storage of various types of data as electronic files.
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DDR4 -
FuturePlus Systems
Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured StatesContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsMargin analysis shows where command timing fails and where it can be improvedThousands of counters for DDR4 analyze performance metrics real time, all the time, for all commands, total Clocks, by Rank also power management informationInteractions among up to 8 ranks, over two slots are analyzed.Mode register and SPD capture are providedSupports Auto-Clock rate detect and clock stoppageConnects to the target under test with DIMM, SO-DIMM, and BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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SIA-118 Series -
SESSCO Technologies, Inc.
Whether you are testing at room, cold or hot temperatures, our tri-temp test handlers are suited for a wide range of applications, from the basic to the most stringent and demanding test requirements. The SIA-118 series offers an open platform for packages from 3 x 3 mm up to 100 x 50 mm at a temperature range from -55 °C to +125 °C and optional full temperature range from -60 °C to +175 °C. Offering easy and flexible configuration, this tri-temperature handler supports both Kelvin and PTB contactors for SOIC, QSOP, SSOP, QFN, TO, MEMS and other custom packages. It is ideally suited for Engineering, Qualification Lot, and small-to-medium production run with easy migration to full production capability. This is a popular model for custom applications with very low NRE. Powered by a cutting-edge 80 ns/step all integrated controller and modular programming design for easy customization.
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17020 -
Chroma ATE Inc.
Chroma's 17020 is a high precision system specifically designed for secondary battery modules and pack tests. Accurate sources and measurements ensure the test quality that is suitable to perform repetitive and reliable tests that are crucial for battery modules / packs, for both incoming or outgoing inspections as well as capacity, performance, production and qualification testing. Chroma's 17020 system architecture offers regenerative discharge designed to recycle the electric energy sourced by the battery module ei ther back to the channel s in the sys tem performing a charging function or to the utility mains in the most energy efficient manner. This feature saves electricity, reduces the facilities thermal foot print and provides a green solution by reducing the environmental impact on our planet. Chroma's 17020 system is equipped with multiple independent channels to support dedicated charge / discharge tests, on multiple battery modules / packs, each with discrete test characteristics. The channels can easily be paralleled to support higher current requirements. This feature provides the ultimate flexibility between high channel count and high current testing.
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The Eastern Specialty Company
Do you have new AMI meters going into the field? Or have you already deployed your new meters, but will have firmware upgrades soon? Allow us to introduce the TESCO Meter Farm, our newest offering to support your AMI Meter Deployment. The Meter Farm powers up banks of meters and runs a current load through each meter. TESCO Meter Farms are designed to serve as a cost effective method for testing communication, functionality and firmware upgrades from your meter manufacturer(s). The Meter Farm can be used as part of the qualification process prior to deployment, but has been more popular as a post deployment tool to allow large scale testing of all new releases of firmware over hundreds or even thousands of meter points prior to upgrading the entire system. The Meter Farm can also be used to perform long term testing for new hardware releases prior to introducing later generation meters into the field. As with all of our products, the TESCO Meter Farm is built with the tradition of reliability and ruggedness.
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HBM-VT -
High Power Pulse Instruments GmbH
- HBM pulse generator verification tester according ANSI/ESDA/JEDEC JS-001 up to ±10kV- To be used in HBM test and qualification labs for regular pulse generator specification compliance test in order to fulfill lab audit and certification requirements- Fully automatic compliance test and verification of HBM pulse generators regarding ANSI/ESDA/JEDEC JS-001 normative standard at 3 different load conditions: Short Circuit, 500 Ω, and a reference diode at VBR=15 V reverse breakdown voltage, including DC test- Parameter evaluation and verification of the transient HBM current waveforms: Peak Current, Rise Time, Decay Time, Maximum Ringing Current- Optionally available upgrade for all HPPI TLP-3010C, 4010C, 8010A, 8010C, HBM-TS10-A hardware systems in combination with HBM-S1-B (6kV) pulse generators (upgrade on request)- Fully automatic test report generation (PDF)- Electrically floating (no fixed system ground): The HBM loads, current sensor output, USB control interface and the enclosure are electrically floating. There is no limiting system ground which may introduce common-mode interference induced HBM current measurement errors.- Isolated industrial full-speed USB control interface- Isolated power supply derived from USB port- Compact size 126mm x 82.5mm x 44.5mm
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Keighley Laboratories LTD
NDT covers a wide group of testing techniques used to evaluate the properties of a material, part, product, weld or system without causing damage. NDT carried out at KLL includes:Liquid Penetrant Testing (LPT) is used for the detection of surface breaking discontinuities on magnetic and non-magnetic metallic materials.Fluorescent and colour contrast penetrants are available to be used in the following methods:-Water washableSolvent removablePost emulsifiableMagnetic Particle Inspection (MT/MPI) is used for the detection of surface breaking and slightly sub-surface (up to 2mm) discontinuities.Bench type crack detectors and portable units are employed producing various waveforms (i.e. A.C, HWDC and induced magnetic flow) to give both circular and longitudinal magnetism.On-site testing is carried out using electro magnetic yokes and permanent magnets producing induced magnetic flow.Ultrasonic Flaw Detection (UT), also known as Ultrasonic Inspection, is used for the detection of volumetric discontinuities in ferrous and non-ferrous products (forgings and castings etc.), and welds in magnetic and non-magnetic materials.UT is capable of penetrating metals, dependent on the material characteristics, up to 10m in length.Some thickness and depth checks can also be carried out using ultrasound.Radiography services are available through sub-contract booked in advance. Notice is required for on-site work.Personnel are available at short notice for in-house or on-site work in the UK and overseas.All inspectors undertaking non destructive testing (LPT, MT/MPI and UT) are qualified to, and meet a minimum of, PCN Level 2.PCN Level 3 supervision is available in-house for LPT, MT/MPI, UT offering consultancy services including procedure writing and commentary, auditing of techniques and Level 3 Supervisor cover.We can assist clients in product qualification, material testing, quality assurance and audit programmes.
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
