Computational Fluid Dynamics
qualitative and quantative simulation of fluid mechanics.
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ARM Computer
SYS-398Q-2G-0
WINSYSTEMS’ SYS-398Q is an enclosed embedded computer system offering high-performance multimedia graphics and a rich industrial I/O mix. The NXP® i.MX6Q processor's integrated power management provides excellent power efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphical applications in security, transportation, medical, and digital signage.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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PC/104 Single Board Computer with Vortex86DX3 System-on-Chip
CM1-86DX3
The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors.
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Extreme Rugged PC/104-Plus Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM2-BT2
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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3 Function Slot MOSA Nano Aircraft Interface Computer (AIC)
NIU3A-AIC-01
NIU3A-AIC-01 is a Modular Open Systems Approach (MOSA) Aircraft Interface Computer with low power high performance ARM Cortex -A53 processing. 8 GB RAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet.
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PC/104 Single Board Computer
PCM-VDX-2
The PCM-VDX-2-512 is a 1GHz, fanless PC/104 single board computer based upon the ultra low power Vortex86DX processor with wired networking capability. This board requires about 6 Watts under full load while operating over an industrial temperature range of -40° to +85°C.
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SMARC Short Size Module with Intel® 6th Gen. Atom® x6000 Processors (formerly codename: Elkhart Lake)
LEC-EL
The ADLINK LEC-EL is a SMARC module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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ARM Computer
SYS-398D-2G-0
WINSYSTEMS’ SYS-C398DL single board computer combines high-performance multimedia graphics with a rich mix of industrial I/O. The NXP i.MX 6DL processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphical applications in security, transportation, medical, and digital signage.
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3.5" Single Board Computer With 13th Gen Intel® Core™ I7/i5/i3/ Celeron® Processor
SBC35-RPL
SBC35-RPL is powered by Intel's latest processors, which offer improved performance, power efficiency, and support for the latest technologies based on Intel's 13th generation of 3.5-inch Single Board Computers (SBCs) offer a range of advanced features and capabilities for a variety of embedded applications.
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ARM Computer
SYS-398S-1G-0
WINSYSTEMS’ SYS-C398S low power single board computer combines high performance multimedia graphics with a rich mix of industrial I/O. The NXP® i.MX 6S processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphical applications in security, transportation, medical, and digital signage.
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3.5" Single Board Computers
SBC35 Series
ADLINK's SBC35 Series of 3.5" single board computers combines compact design with high performance, suitable for diverse industrial applications like automation, transportation, and smart cities. Featuring the latest Intel® processors within a 146x102mm footprint, these boards are enhanced by SBC-FM Adaptive Function Modules, offering powerful processing, extensive I/O options, and customizable scalability. Perfect for upgrading systems or developing new solutions, the SBC35 Series delivers advanced technology and adaptability to meet specific project needs efficiently.
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Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Computer-On-Module
Open Standard Module (OSM)
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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SMARC Short Size Module with NXP i.MX 8M
LEC-iMX8M
- Quad Arm® Cortex®-A53 and Cortex-M4- Cryptographic co-processor for end-to-end IOT security- Full 4K UltraHD resolution HDMI 2.0a and dual channel LVDS- Two MIPI-CSI-2 camera inputs- 2x GbE LAN (optional TSN support), USB 3.0/2.0 and OTG- Standard or rugged support: 0°C to 60°C or -40°C to 85°C- 15 year product availability
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COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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3U OpenVPX ARM Cortex-A9
68ARM1
NAI’s 68ARM1 is a 3U VPX ARM® Cortex®-A9-based, Single Board Computer (SBC) that can be configured with up to three smart function modules. Ideally suited for rugged defense, commercial aerospace, and industrial applications, the 68ARM1 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.
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COM Express Type 2 Starter Kit
The Starter Kit consists of a COM Express Type 2 core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included.
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Single Board Computers
NAI offers a comprehensive line of adaptable, 3U cPCI, 3U VPX and 6U VME, rugged Single Board Computers (SBCs) specifically designed for harsh, SWaP-constrained environments in a range of demanding, embedded computing applications for the defense, commercial aerospace and industrial applications. These Commercial Off-the-Shelf (COTS) and modified COTS SBCs are based on the latest Intel®, NXP (PowerPC™), and ARM® Cortex®- A9 processors, each delivering unique advantages in deployed applications.
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Mini Module
COMeT10-3900
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
