Computational Fluid Dynamics
qualitative and quantative simulation of fluid mechanics.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
Computer on Module
ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
Computer On Modules
COM Express Compact
Computer on Module
Advantech COM-Express Compact includes Intel core i, Intel 5th Generation, Intel atom processor, which are all designed with low power consumption processors. They perform the same functions and same pin definitions as the COM-Express Basic module but with smaller board dimensions of 95 x 95 mm. And COM Express Compact series provide from Intel core i, Intel 5th Generation, Intel atom processors, and is the best solution for mobile applications.
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Product
Enclosed Fanless Industrial Embedded Computer with NXP® i.MX8M Application Processor
SYS-444Q
Computer System
The SYS-444Q is a rugged enclosed fanless embedded computer system with NXP’s i.MX8M industrial application processor with quad-core Arm Cortex®-A53 for low-power processing. This rugged system has dual Ethernet, industrial I/O, expansion options, TPM 2.0 hardware security, and options for wireless connectivity. The processor supports industry-leading video processing along with an M4 microcontroller for real-time subsystems making it an ideal fit for industrial IoT applications requiring highly reliable performance in harsh conditions such as digital signage, industrial automation, energy management, building automation, and others.
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
Industrial Computer
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
3.5" Single Board Computer
RSB-4410
Single Board Computer
RSB-4410 is a RISC 3.5" single board computer (SBC) powered by a high-performance NXP ARM® Cortex®-A9 i.MX6 processor that supports full HD video encoding/decoding and Gigabit Ethernet networking. RSB-4410 also features mini PCIe and SIM card slots for integrating Wi-Fi and 3G modules. This system can be equipped with Linux BSP V3.0.35 or Android BSP 4.2.2, enabling customers to develop unique application software.
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Product
ARM Computer
SYS-398Q-2G-0
Single Board Computer
WINSYSTEMS’ SYS-398Q is an enclosed embedded computer system offering high-performance multimedia graphics and a rich industrial I/O mix. The NXP® i.MX6Q processor's integrated power management provides excellent power efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphical applications in security, transportation, medical, and digital signage.
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Product
4x 3U OpenVPX MOSA Mission Computer
SIU34-MCVARM-01
Mission Computer
SIU34-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
Computer on Module
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Mini Module
COMeT10-3900
Computer on Module
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
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Product
COM-HPC Server Type Modules
Computer on Module
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3100 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
SMARC Module
LEC-MTK-I1200
Computer on Module
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Product
3 Function Slot MOSA Nano Aircraft Interface Computer (AIC)
NIU3A-AIC-01
Aircraft Interface Computer
NIU3A-AIC-01 is a Modular Open Systems Approach (MOSA) Aircraft Interface Computer with low power high performance ARM Cortex -A53 processing. 8 GB RAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet.
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
Industrial Computer
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
MXE-1500 Series
Industrial Computer
The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
Industrial Computer
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Product
Computer-On-Module
Qseven®
Computer on Module
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
3.5" Single Board Computer
RSB-4760
Single Board Computer
RSB-4760 is a RISC 3.5" single board computer (SBC) powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GNSS. RSB-4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Debian BSPs, this SBC enables customers to easily develop unique application on specific OS.
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Product
ARM Computer
SYS-398D-2G-0
Single Board Computer
WINSYSTEMS’ SYS-C398DL single board computer combines high-performance multimedia graphics with a rich mix of industrial I/O. The NXP i.MX 6DL processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphical applications in security, transportation, medical, and digital signage.
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
Computer on Module
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Product
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
Industrial Computer
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Product
SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
Computer on Module
- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Product
Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Industrial Computer
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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Product
6x 3U OpenVPX MOSA Mission Computer
SIU36-MCVARM-01
Mission Computer
SIU36-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Product
3U OpenVPX ARM Cortex-A9
68ARM1
Single Board Computer
NAI’s 68ARM1 is a 3U VPX ARM® Cortex®-A9-based, Single Board Computer (SBC) that can be configured with up to three smart function modules. Ideally suited for rugged defense, commercial aerospace, and industrial applications, the 68ARM1 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.
