Sockets
receive conductors.
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Test Sockets
Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Aspen Sockets
Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Test Sockets
QFN/QFP
For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Test Sockets
socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Relay Sockets & Accessories For Power Relays
Suitable for 35mm rail (DIN), wall or PCB mounting, timer modules, key receptables and retaining clips. See below for all models/series.
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Test Sockets
Non Standard
Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Custom Sockets
Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Evaluation Modules And Sockets
Figaro USA offers a wide range of evaluation modules and sockets for test use.
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4G Concurrent Device Programmer for PC /USB (4 sockets)
ProMax 4G
ProMax is the most innovative and cost effective 4- or 8-gang programming solution on the market. ProMax supports a wide variety of programmable devices. Its state-of-the-art technology and high-speed programming algorithms optimize throughput, reliability and yields.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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High Performance Chipscale Test Sockets
SC
Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Off-Set Kelvin Test Sockets
This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Module Sockets
Ardent Optical Engine
The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Test Sockets
Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Fine Pitch Connector Test
C.C.P. Contact Probes Co., LTD.
Our Ceramic/Aluminum sockets have a lifetime of up to 30,000 cycles.
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180V-260V AC Socket Tester (For UK)
1941
Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*LED indicators & Digital display.*Test for 180-260VAC circuit.I*t can perform self test after plug-in ( Voltage sould be above 180V ).*Detect faulty wiring status in 3 wire receptacle.*This socket tester will give LED indication as well if the main voltage is below 200V or above 260V.*Earth loop impedance test.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 4W*Frequency: 50Hz
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Interior Temperature Transmitter
T0318
For exacting interiors in building energy management and HVAC systems. Are designed for easy installation on ordinary KU68 wiring boxes for household switches and sockets.
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Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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Super Fast Stand-Alone ISP Programmer
848Pro2
The Dataman 848Pro2 is a super fast stand-alone gang programmer with eight independent 48-pin ZIF sockets, ISP capabilities and internal control PC driven by Windows Embedded 8.1 Industry Pro • Stand-alone operation with touch screen control • Internal control PC driven by Windows Embedded 8.1 Industry Pro • Up to 75% faster programming of high-capacity memory devices • Over 105,000 devices supported with new devices added monthly • Independent modules supporting concurrent programming • Intelligent pin drivers operate down to 1.8V so you'll be ready to program the full range of advanced low-voltage devices • Full ISP capabilities including JTAG compatibility • Comprehensive 3 years parts and labor warranty • Free life-time software updates
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® H110, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, HDMI And MSATA
IMB501
The IMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® & Celeron® processors with Intel® H110 chipset. The IMB501 utilizes two high bandwidth 288-pin DDR4-2400/2133/1866 with system memory up to 32GB to meet the needs for high memory capacity and high data transfer speed. The upcoming industrial-grade ATX motherboard offers long-term support and upgradeability that can ensure the best performance and lifespan for its extended industrial computer system. To allow flexible and rapid development of custom functions, the industrial-grade ATX motherboard comes with rich expansion options including one PCIe x16 slot, two PCIe x4 slots (only support x1 signal), four PCI slots, and one PCI Express Mini Card slot. The ATX mainboard is suitable for industrial automation, factory automation, advanced communication, gaming, entertainment, POS/kiosk, surveillance, medical, just to name a few.
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Impedance Stabilization Network
Beijing KeHuan Century EMC Technology Co,.LTD
KH8158 is a device for measuring the common mode interference voltage of unshielded twisted pair cables. Cable testing according to CISPR 16-1-2. The equipment under test (EuT) and auxiliary equipment (AE) are directly connected to the corresponding ports. The port adopts RJ-45 socket (the distribution conforms to T568A/B.) This equipment is divided into three specifications: CAT3, CAT5, and CAT6, and the corresponding equipment is selected according to the cable model.
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Fanless Embedded System With Intel® Celeron® N3350 2.4 GHz/ Pentium® N4200 2.5 GHz, HDMI, VGA, 2 GbE LAN, 6 USB And 3 COM
eBOX625-312-FL
The eBOX625-312-FL is powered by the Intel® Celeron® processor N3350 or Intel® Pentium® processor quad-core N4200. It has one 204-pin DDR3L-1866 SO-DIMM socket for up to 8GB of memory. With wide operating temperatures and rich I/O interfaces, the rugged embedded box computer is well-suited for Industrial Internet of Things (IIoT), retail equipment, factory automation, and many more. Axiomtek's eBOX625-312-FL offers great customer value with a combination of rich features, good computing performance, flexible connectivity options and effective pricing. It is designed with anti-vibration of up to 3Grms and a wide operating temperature range with non-turbo mode from -20°C to +65°C (-4°F to +149°F). Furthermore, this low power embedded system adopts an IP40-rated rugged aluminum extrusion and steel case, allowing it to withstand operations in harsh and hazardous environments.
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Open-Frame Collet Socket with Wire Wrap Pins
Series 508
Open Frame Collet Sockets with Wire Wrap Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. 2 and 3 level wire wrap pins available. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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IEC60065 Socket Torque Balance Tester Torsion Tester
Shenzhen Chuangxin Instruments Co., Ltd.
*Plug and Socket Torque Tester/Device is for compliance is checked by engaging the device, as during intended use, with the socket-outlet of a test apparatus. *Plug Torque Tester/Equipment is a device provided with pins intended to be introduced into fixed socket-outlets shall not impose undue strain on these socket-outlets.The balancing arm of the test apparatus pivots about a horizontal axis through the centre lines of the contact tubes of the socket-outlet at a distance of 8 mm behind the engagement face of the socket-outlet.*With the machine not in engagement, the balancing arm is in equilibrium, the engagement face of the socket-outlet being in the vertical position.After the device has been engaged, the torque to be applied to the socket-outlet to maintain its engagement face in the vertical plane is determined by the position o a weight on the balancing arm.
