3D
three dimensions.
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Product
3D Software
Geomagic Freeform
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Geomagic Freeform is the best solution for the design and manufacturing of organic shapes, giving you the real sensation of clay modeling but with all the added benefits of digital design. Now combined with Artec’s precise 3D scanners, you can effortlessly capture a large variety of objects in high detail directly into Geomagic Freeform software in order to easily solve any design and manufacturing challenges.
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Product
3D LaservScanners
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With unsurpassed accuracy and scan quality API’s Hemispherical Scanner is ideal for use Building Information Modeling (BIM), historical preservation and forensics.
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Product
Portable Metrology‑Grade 3D Scanner
Black Series
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The HandySCAN 3D | BLACK Series delivers accurate, high-resolution and repeatable results, regardless of the measurement setup quality and no matter the user experience. Featuring dynamic referencing, both the scanner and part can move during measurement and still provide an accurate and high‑quality scan.
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Product
3D Scanning Reverse Engineering Services
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Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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Product
3D Solder Paste Inspection system
PI Series
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PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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Product
Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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Product
3D Cameras
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Imaging Development Systems GmbH
3D Machine Vision is considered to be the future of Robot Vision. The integration of 3D data makes it possible to precisely capture and interpret the environment, enabling tasks in robot technology to be solved more efficiently. This applies both to demanding assembly processes, such as gluing or welding, and to the notoriously tricky process of "bin picking". With the Ensenso 3D cameras and the Nion ToF camera, IDS offers powerful camera systems for 3D imaging – with a focus on precision, cost-effectiveness and easy integration.
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Product
Benchtop 3D Optical Profilometers
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Compact, non-contact metrology instruments used for high-precision, sub-nanometer to micrometer-level measurement of surface topography, roughness, and step heights.
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Product
3D Cameras
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3D cameras open up an additional dimension of machine vision: in addition to length and width, you can also capture height and volume – the basis for precise dimensional inspections, surface checks, or reliable robot guidance.
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Product
Optical Inspection
3D AOI
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In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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Product
3D Optical Surface Profiler
NewView™ 9000
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The NewView™ 9000 3D optical surface profiler provides powerful versatility in non-contact optical surface profiling. With the system, it is easy and fast to measure a wide range of surface types, including smooth, rough, flat, sloped, and stepped. All measurements are nondestructive, fast, and require no sample preparation.
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Product
3D Building Scanning Services For Existing Conditions
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Trusted by industries across USA, Tejjy 3D laser scanning company facilitates high-resolution reality capture of as-built data. Our on-site 3D scanning professionals gather accurate measurement with quality point clouds of as-built condition. We facilitate precision of 4-6 mm approx. in field measurement for renovation, surveying, facility management, digital twin, heritage preservation as per client requirements.
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Product
High-speed 3D Solder Inspection Machine
YSi-SP
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a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Product
3D Audio Servers
GoldSeries
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AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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Product
3D CT AXI
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PCB manufacturers can enjoy comprehensive, high-speed inspection with Omron’s revolutionary technology that reliably captures defects in hidden areas.
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Product
3D AOI Series
MV-6 OMNI
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- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
Interface Unit
CMM Automation
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The Aberlink automation interface adds the capability for Aberlink 3D programs to be remotely controlled and monitored using an external system allowing any Aberlink CMM to be integrated with an automated component handling system, whether this be a fully controlled, PLC driven manufacturing system, a robotic loader or just an automatic bar feeder. The package comprises of an optically isolated digital I/O system and a software module that enables the software to be setup to follow a defined operating sequence to allow the automated operation.
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Product
1600x1200 Pixel Sapphire CMOS Image Sensor
Sapphire 2M
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This 1,600 x 1,200 pixel Sapphire CMOS image sensor, designed on Teledyne e2v’s proprietary Eye-On-Si CMOS imaging technology, is ideal for diverse applications where superior performance is required. The innovative pixel design offers excellent performance in low-light conditions with both electronic rolling shutter and electronic global shutter, with a high-readout speed of 50/60 fps in full resolution. Novel industrial machine vision application features such as multi ROI, histogram outputs and 3D range gating are embedded on-chip.
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Product
Industrial AI Camera
CAM-5330-U
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3D Stereo USB3 camera with RGB 2MP rolling shutter and depth 1MP global shutter. Baseline: 50mm. Depth range: 0.1m~20m+. Works indoors/outdoors.
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Product
ATR 3D Layout Machine
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ATR Model is standrad layout machine for marking work and 3D measruing.
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Product
EPIC SBC With AMD G-Series APU, AMD A50M FCH, Dual DisplayPort/VGA/LVDS, Dual LANs And Audio
EP100
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The EP100 EPIC board, supporting either the AMD G-Series APU dual core T56N with Radeon™ HD 6320 graphics or AMD G-Series APU single core T40R with Radeon™ HD 6250 graphics, combined with the AMD A50M FCH, is ideal for graphics-intensive applications such as high-end medical imaging, digital signage, kiosks/POI, thin clients, and gaming machines. The onboard SO-DIMM socket supports maximum up to 4 GB of DDR3 1333 memory. Integrated AMD HD graphics with DirectX 11 technology, the small foot print embedded board offers stunning 3D visual effects and dynamic interactivity. The EP100 comes with three display outputs with two combinations: two DisplayPort and one VGA or one DisplayPort plus a VGA and 18/24-bit single/dual channel LVDS. Additionally, it provides dual gigabit LAN ports for high-speed wired communication and two PCI Express Mini card expansion interfaces, one with SIM slot, for seamless wireless communication (WiFi + 3/4G).
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Product
Werklicht® Pro
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*Intelligent laser projector, *Exact positional representation on assemblies in 3D *For attachments, holes, bolts and more *Stencils, fixtures and coordinate measuring machines are superfluous *Avoid mistakes before they arise. *Simplifies, streamlines and speeds up work steps *Over the entire process chain - from data preparation to quality assurance With Werklicht® Pro , the "digital template", you build an elegant bridge between CAD data and the real object.
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Product
CAD Drafting Services In USA
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CAD design service providers for architectural, electrical, mechanical, plumbing, and structural drafting jobs are available to support your CAD drawing requirements. We provide impressive 3D outputs in combination with 2D orthographic projections and detailed shop drawings to felicitate your pre-construction operations.
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Product
3D Sensor
C6 Series
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The new 3D C6 series by AT is built on a novel sensor platform that supports the latest industrial standard GigE Vision/GenICam 3D at 1 Gbit/s. These new laser profilers offer an impressive combination of extremely fast and highly precise resolution, reaching up to 4,096 points per profile, a profile speed of up to 200 kHz, and high dynamic range 3D image capture. They are available as compact sensors, MCS, and 3D cameras.
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Product
Semiconductors
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Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Product
Dissolved Ammonia Delivery System
DI-NH3
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The DI-Solver™ NH3 is a compact, stand-alone system designed to provide dissolved ammonia water for use in rinsing processes in the semiconductor industry. With Semiconductor 3D IC architectures using new materials like Cu-Co and Si-SiGe, the ability to wet clean with precise alkaline chemistries is growing in frequency and importance. The system is specifically designed to provide optimal cleaning capability at a given conductivity. The alkaline chemistry of dissolved ammonia provides ESD protection during rinsing, particle lift-off, and residual particle removal. It also prevents corrosion of metal interfaces, which is a common problem in semiconductor manufacturing. The system uses closed-loop control to keep conductivity and pressure stable under changing flow conditions. It also monitors and adjusts the NH4OH concentration to deliver the desired level of dissolved ammonia.
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Product
MXI Computerized Tomography (CT) Option
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The Nordson TEST & INSPECTION µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson TEST & INSPECTION X-ray inspection systems. It uses the superior, sub-micron feature recognition 2D x-ray images, that Nordson TEST & INSPECTION X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. It reduces the number of time-consuming micro-section analyses needed and / or assists in identifying where micro-section preparation and investigation must concentrate. Available with a system order or as retro-fit to suit application and workflow needs.
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Product
Confocal Raman Microscope
LabRAM HR Evolution
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The LabRAM HR Evolution Raman microscopes are ideally suited for both micro and macro measurements, and offer advanced confocal imaging capabilities in 2D and 3D. The true confocal Raman microscope enables the most detailed images and analyses to be obtained with speed and confidence. With guaranteed high performance and intuitive simplicity, the LabRAM HR Evolution is the ultimate instrument for Raman spectroscopy. They are widely used for standard Raman analysis, PhotoLuminescence (PL), Tip Enhanced Raman Spectroscopy (TERS) and other hybrid methods.
