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construction of a concept.

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Showing results: 91 - 105 of 133 items found.

  • Particle-in-Cell Plasma, Electromagnetic & Electrostatic Simulation Software

    VSim - Tech-X Corporation

    The VSim electromagnetic, particle, and plasma high performance application is a flexible, multiplatform, Particle-in-Cell (PIC) simulation tool for running computationally intensive modeling problems. VSim enables you to switch easily between 1, 2, or 3 dimensions and then watch your model run lightning-fast. Using algorithms designed for the exacting demands of high performance computing systems, VSim can run simulations on your laptop or supercomputing cluster.

  • Fluids And Thermal

    Altair Engineering, Inc.

    Whether you’re an analyst performing advanced computational fluid dynamics (CFD) modeling or a design engineer who quickly needs to understand fluid or thermal effects on a design proposal, Altair offers a complete line of tools to support your project. From detailed component analysis to full systems performance, Altair provides a range of scalable solvers under Altair CFD™, as well as robust pre- and post-processing software for CFD.

  • Protective Relay Testing

    Manta Test Systems

    Choose from Doble’s F6300e and F6350e External Amplifiers for your specific protection testing needs and requirements. These amplifiers are useful in high power protection testing applications when you need additional current and/or voltage sources, for critical high burden relay testing, as well as system modeling.

  • IndySoft for Calibration Management

    IndySoft Corporation

    The IndySoft Calibration Management workflow offers a rich feature set to manage the entire lifecycle of your quality assets. With support for leading enterprise platforms it's perfect for deployment in the corner lab of a startup manufacturing facility or a multi-site international quality-driven operation. With the IndySoft exclusive process modeling engine, companies can re-configure the event-driven workflows with checkpoints, rule sets, and documentation at every point along the equipment path, ensuring assets are handled according to their exacting requirements.

  • Noise Receiver Modules And Noise Switching Modules

    MT7553 Series - Maury Microwave Corporation

    Noise Parameters are the non-50Ω extensions of Noise Figure, and are an important modeling and model validation tool to understand how a device-undertest’s performance changes as a function of source impedance. Noise Parameter measurements are typically performedusing a Vector Network Analyzer (VNA) to measure the S-Parameters of the DUT, and a Noise Analyzer (either Noise Figure Analyzer NFA or Spectrum Analyzer SA) to measure the noise power of the DUT. Noise parameters are calculated from a combination of knownsource impedances, S-parameters and noise powers.

  • Electromagnetic Simulation Software

    Wave3D CMD - CEMWorks Inc.

    Wave3D CMD 'command-line' controlled suite of tools is designed for large-scale parametric modeling of electromagnetic phenomena using High-Performance Computing (HPC) facilities and Cloud computers. The package utilizes the same computational engine based on MLFMA aided Moment Method solution of the Surface-Volume Integral Equation as the Wave3D CAD package. Method of Moment analysis with multilayered media Green's function enables efficient analysis of wide range of 3D planar applications such microstip antennas, microwave circuits, and interconnects.

  • Turn-key ATE Interface Boards

    R&D Altanova

    We offer services for modeling and simulation and complement that work with measurement and validation of those models, at your desired frequency and your required fidelity specifications. Our design and programming expertise includes: Teradyne Catalyst through Integra FLEX; Advantest 3340 through T2000; Verigy 82000 through 93000. turn-key solution for ATE interface boards, we understand the limits of the interconnect technology (laminate, conductors and via’s, connectors and sockets) and use that understanding to guide our principles of design.

  • Probe Card

    VC20E Series - Celadon Systems, Inc.

    The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.

  • MPI Automated Probe Systems

    MPI Advanced Semiconductor Test

    MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.

  • Laser Scanner w/ Reality Capture & 3D Scanning Software

    BLK360 & Autodesk ReCap 360 Pro - Leica Microsystems

    Leica BLK360 is a truly amazing laser scanner, that fits in your hand, you can carry in your pocket, take it to places that a bulky laser scanner is hard to carry. It’s trendy, stylish, easy to use and looks like the Apple of the laser scanners. Autodesk ReCap 360 Pro is a reality capture and 3D scanning software that helps make building renovation, construction verification, and complex modeling projects more efficient. Key features include automatic scan registration, point cloud viewing & editing and collaboration.

  • Automated Design Analysis Software

    Sherlock - DfR Solutions llc

    Sherlock Automated Design Analysis Software is the only Physics of Failure (PoF) based electronics design reliability analysis tool that streamlines new product development. Sherlock automatically translates ECAD and MCAE data into 3D finite element models, automates thermal derating and democratizes the thermal and mechanical analysis of electronics meaning analysis is done in hours, not weeks. Plus, Sherlock reduces FEA modeling time and provides insights before prototyping, eliminating test failures and design flaws, accelerating product qualification and introductions of groundbreaking technologies.

  • Drop Tester

    SKZ122 - SKZ Industrial Co., Ltd

    Drop tester is mainly applying in modeling the falling impact influence of packages in transportation and loading. It is used to identify the impact endurance and designable rationality of packages, Standards: TAPPI 802, ISO2248 ASTM D5276.The use of double-column, two-wing orientation, drop height can be input, work stable and reliable. It meanly used in simulating package used in the transport, loading and unloading process by the fall of the impact of shocks, inspect its impact strength and whether packaging design of the impact strength is reasonable, in order to improve and perfect the packaging design.

  • Software Modules for Smooth, Freeform CAD Surfaces in Verisurf Reverse

    Verisurf Quick Surface - Verisurf Software, Inc.

    Quick Surface is a powerful option for Verisurf Reverse that efficiently creates smooth, high-quality surfaces from meshes derived from scan data or STL files. Quick Surface maintains curvature continuity between adjacent surfaces and is ideal for creating smooth, high-speed toolpaths.With Quick Surface, it’s a snap to produce freeform CAD surfaces from organic or prismatic Verisurf meshes and assess the surface-to-mesh fit quality prior to export for additional, downstream modeling or other processing. Quick Surface is an ideal enabler for scan-to-part or scan-to-3D-printing workflows.

  • Drive-Train/Power-Train Performance/Endurance Test System

    Ono Sokki

    This system is suitable for engine drive test or transaxle test of HEV/EV in combination with the real-time model calculation by the measurement/control panel and low inertial motor. Simulation test of an actual vehicle running condition can be executed by modeling a real tires or an engine. The tires and vehicles are modeled by MATLAB® / Simulink®, so they can be evaluated under various conditions by changing parameters or replacing models.

  • Wireless Cmmunications and Networks

    Fraunhofer Institute for Telecommunications

    The Wireless Communications and Networks Division has been working on mobile and wireless radio communications solutions for more than 20 years. The work covers a wide range and ranges from information and network theory via channel measurements and radio channel modeling, algorithms and protocol design, systematic reviews at link, system and network level to prototypical implementations in demonstrators and field tests.

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