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Product
Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
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The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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3.5" SBC With Intel® Atom® X7835RE/x7433RE/x7211RE (Extended Temperature SKU) And Core™ I3-N305; Processor N97
MIO-5354
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Intel® Atom™ x7835RE, x7433RE, x7211RE, support Extend Temp.DDR5-4800 up to 16GB, support IBECC by Platform3 independent display: LVDS + HDMI + DP2x LAN, 6x USB, 4x COM, 2x CAN-FD, SMBus/I2C, DC-in 12~24VExpansion: 3x standalone M.2 slot: E-Key 2230, B-Key 2280 & 3052Supports EdgeBMC (for OOB control) & Software APIs, DeviceOn
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
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- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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MicroATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Edge Computing, Industrial Automation, And Compact Servers.
ASMB-589
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Powered by LGA 1851 Intel® Core™ Ultra 9/7/5 processors with W880 chipset for high-performance computing.Supports up to 192 GB of DDR5 ECC/Non-ECC UDIMM memory at speeds of 5600/4800/4400 MT/s for demanding applications.Features two PCIe x16 (Gen5) and two PCIe x8 (Gen4) slots for flexible expansion with high-speed peripherals.Offers versatile display connectivity with DisplayPort, VGA, and HDMI 2.0 ports, supporting triple simultaneous displays.Provides extensive storage options with five SATA 3 ports and eight high-speed USB 3.2 ports for peripheral connectivity.Includes one M.2 2280 slot (PCIe x4) for fast NVMe SSD storage, enhancing system boot and application load times.Designed with rackmount-optimized placement and positive airflow for enhanced thermal performance in server environments.Ensures reliable operation in industrial environments with an ambient operating temperature range of 0 ~ 60°C (32 ~ 140°F).
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SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)
EKF-SC9-TOCCATA
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SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.
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Ultra Compact, Uncooled Thermal Imaging Core
Dione 640 OEM Series
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The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution. The NETD is less than 40 mK (available upon request) or 50 mK. The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
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The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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THIN AI Motherboard 12th Gen Intel® Core™ Processor (Alder Lake), MXM GPU Integration
AIMB-288E
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12th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport Intel Arc Embedded MXM GPU or NVIDIA Quadro Embedded MXM GPUUp to 64GB DDR5 4800 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 B-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Intel® 12/13 &14th Gen. Core™
DPX-S455
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Very high-performance Intel Hybrid Multi-core CPUs. CPUs up to i9 24 Core, Three independent monitors including 8k & HDR options. PCIe x16 graphics card slot.
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K-Band Silicon SATCOM Rx Quad Core IC
AWS-0102
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The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Product
Quad Optical Loss Test Set
KI27624-INGAAS-APC
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A Quad Optical Loss Test Set used to test power, insertion loss, continuity and faults on multimode and single mode fiber with an APC connector at 850 / 1300 nm & 1310 / 1550 nm. In a small package, it provides a powerful solution to improve test flexibility and productivity.
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Most Versatile All-in-One Medical Panel Computer Family with Selectable 8th Generation Intel® Core™ Processor Performance
MLC 8-21/23/27
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ADLINK’s new series of MLC 8 medical computers with 8th generation Intel® Core™ processors delivers high computing performance and outstanding graphics processing capabilities. The MLC 8 series are designed with optimum viewing capabilities and hygienic, fully-sealed and easy-to-clean housings. They can be used for patient’s vital sign monitoring, nursing care, clinical diagnosis, PACS (Picture Archiving and Communication System), anesthesia monitoring and operating room documentation. With additional safety design and expansion capabilities, our medical panel computers and monitors provide a reliable and flexible system with high usability and convenience for doctors and hospital staff.
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Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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3U I7 Core 2.1 GHz CPCI Controller
GX7936
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The GX7936 is a single-slot embedded cPCI 3U controller for use with Marvin Test’s GX7300 PXI chassis. The GX7936 features a 2.1 GHz i7 Quad Core processor. When combined with the embedded storage peripherals of the GX7300 Series chassis, it is the ideal solution for an integrated, high performance PXI chassis / controller configuration.
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Detector of Earth Faults on Multi/Single-Core Terminations
CableTroll 2320
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CableTroll 2320 is an indicator for detection of Earth faults (PtG) and short circuit (PtP) faults on multi-core and single core cable terminations. The unit uses NorTroll type current sensors.
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COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
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The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
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Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
Robust DIN-rail Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Dual Modular I/O Expansion Design
ICO500-518
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The ICO500-518 featuring flexible I/O expansion, sufficient storage and network capability is well-suited for transportation, public utility, smart building, solar energy, as well as factory automation fields. By bundling Axiomtek’s intelligent AMS software solution for device monitoring and remote management, the ICO500-518 is able to implement environment signal monitoring, edge analytics and remote device management in the IIoT world. It has also passed the EN 50121-4 certified for railway applications. The rugged high computing edge gateway has scalable CPU options with the 7th gen Intel® Core™ i7/i5/i3 (codename: Kaby Lake-U) or Celeron® processors and supports one DDR4-2133 SO-DIMM slot for up to 16GB of system memory. The ICO500-518 features basic benefits whether low latency or cost efficiency; moreover, offering much more other advantages for IIoT applications. It not only supports multiple OT communication protocols that can significantly reduce the effort required to collect data from different field devices, but also provide local intelligence to allow operators respond faster to events that happen at the remote site and minimizes latency between edge devices and the cloud server. Also, with TPM 2.0, this IIoT edge gateway provides tailored levels of security depending on the application needs. Axiomtek’s ICO500-518 has two optional plug-in I/O module slots and four different types of I/O modules to meet different customization requirements. An integrator can choose from four available I/O modules including an 8-port GbE LAN module; 8-port isolated RS-232/422/485 module; 4-port isolated RS-232/422/485 with one isolated DIO (8-in/8-out) module; 8-port isolated CANbus 2.0A/B module to customize the ICO500-518 to fit its specific project requirements. Additionally, the ICO500-518 offers flexible communication options - two full-size PCI Express Mini Card slots and one external SIM card slot for 4G/3G, GPS, LoRaWAN, Wi-Fi and Bluetooth connections. Furthermore, it supports swappable 2.5-inch SATA drive and external CFastTM card to provide sufficient storage capability. For withstanding harsh operating conditions, this IP40-rated embedded box PC offers an extended operating temperature range of -40°C to 70°C, a wide range DC input of 12V to 48V with OVP, UVP, OCP, RPP power protection, and up to 3G vibration endurance.
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Product
Intel® Core™ Ultra 5/7/9 LGA1851
AIMB-589
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Intel® Core™ Ultra Series 2 Processors, max. 24Core. Support W880/Q870 chipsetsUp to 192GB DDR5 UDIMMs/CUDIMMs for data transfer2 x 2.5GbE LAN and 2 x GbE LAN for digital devices1 x USB4, 8 x USB3.2, 4 x USB2.02 x M.2 M-Key 2280 for NVMe SSDAccommodate 2 double-deck GPU cards by PCIe x16 slots (x8 lanes)
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Product
12.1" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-312
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Industrial-grade 12.1 XGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with 5-wire resistive touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Diverse system I/O and isolated digital I/O via iDoor technologySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupport TPM2.0 hardware security
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Product
Compact High-Performance IoT Gateway With NXP I.MX8M Quad Core Cortex A53, 2 LAN, 2 COM & 1 USB
ECU-150
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NXP i.MX8M Quad Core Cortex A53 1.3G CPUDDR4 2GB RAM, 16GB eMMC for system storage2 x RS-232/485 isolated serial ports2 x 10/100/1000 Ethernet ports1 x Mini-PCIe for WIFI/Cellular/4GSupport web service for remotely on-line monitoringSupport SD card & on-line firmware updateSupport Modbus, IEC-60870-5, DNP3.0, OPC-UA, BACNet protocol （ECU-150-12A1&ECU-150-12A1U need container EdgeLink）Support Data logger on SD card
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
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ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
Industrial ATX Motherboard With 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processor
IMB-M47
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ADLINK's IMB-M47 ATX Motherboard is a driving force behind industrial automation, supporting 14/13/12th Gen Intel® Core™ processors, and delivering substantial improvements in performance, capacity, and GPU support through its seven PCIe slots, PCIe 5.0 compatibility, DDR5 memory, and 2.5GbE PoE capability. Tailored for a range of industrial applications including automation, machine vision, factory automation, and logistics, the IMB-M47 features up to 128GB DDR5 memory at 4800MHz, supports three independent displays, offers USB 3.2 Gen2x2 (20Gb/s), 3x 2.5GbE LAN, multi-M.2 Key M, TPM 2.0 security, and PCIe 5.0 slots for high-performance add-on cards. Optimized for the latest Intel processors, this motherboard blends efficiency and performance cores, bolstering edge applications with swift memory performance via DDR5 technology. With a commitment to technology leadership, ADLINK equips customers with the tools to harness the latest processors, streamline real-time graphics processing, and fuel innovation in Edge AI applications, solidifying its role in the future of industrial edge computing.
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Product
15.6" Fanless Widescreen Panel PC With Intel® 13th Gen Core™ I7/i5/i3 Processor
PPC-415W
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15.6" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i7-1365URE/i5-1345URE/i3-1315URE processor with fanless system designSupports PCIe x4 or PCI expansion1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology3 x Independent displays1 x M.2 bay (2242/2280) for storage onlySupport TPM2.0 hardware security
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Product
15" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-315
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Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Supports expansion via Full-size Mini PCIe and NVMe.Diverse system I/O and isolated digital I/O via iDoor technology.Supports fieldbus protocols via iDoor technology.
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
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Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
14th Gen Intel® Core™ Ultra 7/5-Based Advanced Embedded Box PC
EMP-520 Series
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- 14th Gen. Intel® Core™ Ultra 7/5 Processors (Meteor Lake-H/U)- DDR5-5600MHz up to 96GB (48GB per DIMM)- 4x independent displays support EDID Emulation- 2x 2.5GbE, 1x COM, 6x USB ports, Type C Thunderbolt (optional)- 2 x Wi-Fi/BT/LTE antenna holes- M.2 2280 (SSD), M.2 3042 (LTE), M.2 2230 (Wi-Fi/BT)- VESA mount (optional)
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Product
Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, Dual DisplayPort++, HDMI, LVDS, USB 3.0, MSATA, M.2 And Dual GbE LAN
MANO520
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The MANO520 is powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake), Intel® Pentium® Gold or Intel® Celeron® processor with the Intel® Q310 chipset (Intel® Q370 optional). The Intel® Coffee Lake-based MANO520 is specifically designed for performance-demanding applications with its excellent reliability as well as communication and real-time computing capabilities. The MANO520 supports two 260-pin DDR4-2666/2400 SO-DIMM sockets for up to 32GB of memory. Also, the mini-ITX motherboard features three SATA-600 connectors and one mSATA for additional storage. It is equipped with one full-size PCI Express Mini Card, one PCIe x16 and one M.2 Key E slots for wireless devices such as Wi-Fi, Bluetooth, and 3G/LTE. Moreover, the mini-ITX form factor single board computer features an ATX connector with AT mode auto power function.
