-
-
Product
21.5" Fanless Widescreen Panel PCwith Intel® 13th Gen Core™ I7/i5/i3 Processor
PPC-421W
-
21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i7-1365URE/i5-1345URE/i3-1315URE processor with fanless system designSupports PCIe x4 or PCI expansion1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology3 x Independent displays1 x M.2 bay (2242/2280) for storage onlySupport TPM2.0 hardware security
-
Product
6U CompactPCI Intel® 6th Gen. Core™ i3/i5/i7 Processor Blade with ECC support
MIC-3399
-
- Supports 6th Generation Intel® Core™ i3/i5/i7 processors and Intel® CM236 PCH with embedded graphic (up to 3 independent displays)- Up to 32GB (DDR4-2133) memory (max 16GB on board, socket SO-DIMM x1, max 16GB)- Optimized dual-slot SBC with 2.5" SATA-III HDD/SSD, 2240 or 2280 M.2 socket, on-board Nandflash (optional)- Two SATA ports, two USB 3.0, six USB 2.0 ports, two DP ports, two COM ports, one PS/2, one Audio, one VGA and PCIe x8 interfaces to the Rear Transition Module (RTM)- Five Gigabit Ethernet ports including two PICMG 2.16 for front and rear connectivity- PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.0 R3.0, PICMG2.9 R1.0 compliant
-
Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784970-01
-
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
-
Product
Modular Embedded Box PC With 11th Gen Intel® Core™ I CPU
UNO-2484G V2
-
Intel® Core™ 11th i7/i5/i3 Processor with 8GB DDR4 3200Mb/s memory4 x GbE, 3 x USB 3.2 Gen2, 1 x USB2.0, 1 x HDMI 1.4, 1 x DP 1.4a, 4 x RS232/422/485Optional 2nd stack supports up to 2 x iDoor extension for expending wireless connectivity, industrial fieldbus or more I/OCompact fanless designRuggedized by zero cable and lockable I/O designSupports NVME storage with high data-transmission efficiency
-
Product
3.5 Inch SBC with 7th Gen Core i7 CPU and PCIe/104
VENUS
-
Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
-
Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
-
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
-
Product
ATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Workstations, General-Purpose Servers, And Multi-Tasking.
ASMB-789
-
Features an LGA 1851 socket for Intel® Core™ Ultra 9/7/5 processors with the W880 chipset, delivering next-gen performance.Supports up to 192 GB of high-speed DDR5 ECC/Non-ECC UDIMM memory at up to 5600 MT/s.Provides extensive expansion with one PCIe x16 (Gen5), one PCIe x8 (Gen5), and five PCIe x4 slots.Drives triple independent displays through DisplayPort, VGA, and HDMI 2.0 for advanced visual workspaces.Includes four SATA 3 ports for traditional storage and seven USB 3.2 ports for high-speed peripherals.Features one M.2 2280 slot (PCIe x4) for fast NVMe SSDs, accelerating boot times and application performance.Its rackmount-optimized design ensures positive airflow, enhancing cooling and system reliability in server environments.Built to operate reliably in a 0 ~ 60°C (32 ~ 140°F) ambient temperature range, suitable for various industrial settings.
-
Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
-
The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
-
Product
COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Alder Lake-P
-
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
-
Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
-
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
-
Product
Compact Fanless System With 10th Gen Intel® Xeon®/Core™ I CPU Socket (LGA 1200)
MIC-770 V2
-
Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipsetWide operating temperature (-10 ~ 60 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports Advantech i-Modules, FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IOVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)Microsoft Azure PnP, AWS IoT Greengrass, Ubuntu CertifiedRED Compliance
-
Product
Intel® Core™ Ultra Processor-Based Fanless Open Frame Touch Panel PC
SP2-MTL Series
-
- Intel® Core™ Ultra H series (Meteor Lake) processor- 10.1"/15.6"/21.5" Projected capacitive touch screen- 3x independent display output, LVDS, DP, USB type C- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Extensive I/O and function expansion through board-to-board connectors (Function Modules)- Support PoE by extension module (optional)- Support NVIDIA MXM GPU type A by carrier board (optional)- Pre-compliance EMC testing and high ESD tolerance
-
Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
-
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
-
Product
COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor
CEM521
-
The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
-
Product
Loss Measuring System for Transformers
LiMOS
-
HIGHVOLT Prüftechnik Dresden GmbH
The transformer loss measuring system LiMOS is designed for highly accurate measurement of losses and other parameters required in the framework of routine and type testing of power transformers. The combined voltage/current sensors and the digital signal processing enable a very compact design with only one HV device per phase with smallest volume and footprint. The digitized and preprocessed signals are transmitted via fiber optic cable to the receiver unit (LiMO-MCSU).
-
Product
Computer With 8th Gen. Intel® Core™ I5 Processor, Built-In 8G DDR4 RAM And UL Class 1 Division 2
TPC-318WH
-
Industrial-grade 18.5" WXGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i5-8365UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with PCAP touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Support TPM2.0 hardware security
-
Product
Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C47H
-
The next level of industrial performance with the ADLINK IMB-C47H Value Series motherboards. These boards redefine what's possible in cost-effective industrial computing, combining dependable performance with an accessible price point.Ideal for a variety of industrial scenarios—from embedded automation to IoT integration—the IMB-C47H series stands out with its support for the latest high-performance processors, versatile I/O capabilities, and robust expansion potential. They provide a stable and scalable platform that accommodates the growing demands of industrial environments.
-
Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784227-01
-
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
-
Product
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
-
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
-
Product
Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor For Railway And Vehicle PC
UST500-517-FL
-
The UST500-517-FL is powered by the LGA1151 socket 7th/6th generation Intel® Core™ and Pentium® processors up to 65W with the Intel® Q170 chipset. The integrated 16 PoE ports are available in RJ-45 or M12 connectors for IP cameras. It provides a full scope of power protection that includes intelligent vehicle power management technology for ACC on/off delay, shutdown delay, and over/under voltage protection. Enhanced by its robust structure and system design, the UST500-517-FL is able to operate under a wide temperature range from -40°C to +70°C and vibration endurance up to 3 Grms. This transportation embedded box is in compliance with ISO 7637-2 and EN 50155 for mobile surveillance applications. There are 16 Gigabit LAN ports which support 802.3at/af Power over Ethernet with a total power budget of 200W. Its DVI-D, HDMI and VGA interfaces support three surveillance monitors. Furthermore, its external accessible SIM card slot enables users to easily change SIM card for different telecommunication service. With wireless LAN modules, this user-friendly transportation embedded system can real-time transmits the video to the control center. The two built-in or four swappable SATA hard drives are used for mass storage of video files.
-
Product
Air Core Test Lab Reactors
-
Test Laboratory Reactors are designed for high voltage and high power test laboratories. They are designed to withstand the most extreme electrical service conditions during test periods. Design techniques are implemented in accordance with the most demanding service conditions. These reactors are used for various purposes in test laboratories such as current limiting and synthetic testing of circuit breakers, capacitor testing, artificial line simulation etc.
-
Product
21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
-
21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
-
Product
Compact Size Tower IPC With 12th / 13th Gen Intel® Core
IPC-320
-
Compact Size Tower IPC with 12th / 13th Gen Intel® Core™ i CPU Socket (LGA 1700) and 250W PSU. Intel® 12th / 13th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with H610E chipset. Design for operator IPC and application with space limit, Dual USB 3.2 and dual USB 2.0 port on both front and rear side. Dual Independent Display (HDMI/ DP) 2 low profile Expansion slots (PCIe x16 and PCIe x4).
-
Product
Drum Core Inductors
-
Drum core inductors are so named as the conductor (round magnet wire) is wound directly onto the ferrite core which is shaped like a drum or spool. The wire is then connected to the core, a plastic base or metal lead frame to form the surface mount termination. Drum core inductors come in unshielded (high saturation current but potentially more EMI) and shielded constructions (lower saturation current but closed magnetic path for lower EMI). The shielded constructions use either a second ferrite core or a magnetic resin epoxy to create the magnetic shield.
-
Product
Fanless Embedded System With Intel® Atom™ Processor E3845 Quad Core™ (1.91 GHz) For Railway PC
tBOX323-835-FL
-
The tBOX323-835-FL, a fanless railway PC, is designed for in-train applications. Integrated with onboard quad-core Intel® Atom™ E3845 processor and 4 GB low-powered DDR3L memory. The fanless railway PC boosts its computing performance and specializes its I/O design with five isolated COM ports, two M12-type LAN connectors, USB 2.0 ports, and one isolated digital I/O. The railway PC also provides VGA and HDMI outputs for in-train surveillance. The tBOX323-835-FL is an ideal all-in-one IoT (Internet of Things) solution for various applications, including railway multi-functions of gateway, controller, digital signage management and surveillance. Certificated with EN50155 and EN50121 for rolling stock and complied with EN45545-2 for fire resistance, the rugged embedded system operates reliably in a -40ºC to 70ºC operating temperature range (EN50155 Class TX) and in a high vibration environment.
-
Product
Insulating Oil Dielectric Loss Tester
HDLT
-
Hention Electrical Equipment Co., Ltd.
This integrated precious insulation oil dielectric loss tester is for measuring dielectric loss TAN and capacitance of transformer insulation oil.This is a high precision instrument; integrated with oil cup, temperature control instrument, temperature sensor, dielectric loss test bridge, AC test power, and standard capacitor, etc.
-
Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
-
The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
-
Product
TAP Adapter for Corelis JTAG Controllers
Low Voltage Adapter
-
High technology, energy efficient, and small form factor products push JTAG interfaces to the limits; low power and high performance means low voltage, high speed, and high drive requirements. Building specialized interface circuits on product Printed Circuit Boards (PCBs) is inconvenient and costly—an out-of-the-box, external solution is needed.The Corelis Low Voltage adapter is an add-on accessory that provides existing scan controllers with an active, plug-in interface to access low voltage scan chains, without sacrificing performance.
-
Product
Vision Standard IP Cores
-
S2I’s Vision Standard IP Cores solutions are delivered as a working reference design along with FPGA IP cores. This minimizes development time and allows for top-notch performance at a small footprint, while leaving enough flexibility to customize the design. Sensor to Image cores are compact and leave enough space in the FPGA for your application.
