Showing results: 106 - 116 of 116 items found.
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3900 Series -
Probe Master Inc.
Now Probe Master offers a rugged, heavy duty oscilloscope probe at low prices. This probe features a snap-on rotating ground lead, and a heavy duty fixed tip. The switchable model allows for quick finger tip change between 1X, 10X and reference ground. The probe body is made of high impact ABS. Soft molded strain reliefs at all stress points assure long cable life. In short it has been designed to offer you high performance coupled with high quality at a low cost. Accessories include Sprung Hook, 6" Ground Lead and Trimmer Tool.
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Food-B15/B17/B19 IP69K -
ADLINK Technology Inc.
The ADLINK Food series Panel PCs, based on the Intel Atom® E3845 quad-core processor at 1.91 GHz integrate the Intel® GMA graphics chip into the chipset. In addition, the ADLINK Food series is equipped with up to 4GB of DDR3 RAM and failsafe automotive HDDs or SSDs as bootable storage media for increased data security and system reliability. The abrasion-resistant resistive touch display offers a maximum resolution of 1024x768 or 1280x1024 pixels and is available in 15, 17 and 19 inches. To connect additional peripherals such as 1D/2D barcode scanner, the ADLINK Food series features an extensive range of interfaces, including 2x USB 2.0, Ethernet, and 1x serial port, all with IP69K stainless steel connectors.
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CP62007N -
LinkedHope Intelligent Technologies Co.,Ltd.
CP62007N is a 6U CompactPCI® single board computer designed by LinkedHope® based on Intel® QM87 chipset. The compact and space-saving processor board meets the PICMG® CompactPCI® specifications. There are SATAIII, USB3.0, Gigabit Ethernet, and Keyboard/Mouse interfaces on the board. CP62007N supports 64GB SSD, facilitating the operating system installing.Part of CP62007N’s rear I/O uses high speed ZD connectors for transferring PCIe2.0, USB3.0, SATAIII and other high speed signals, leading to 2x 8 PCIe (to J3-J4) and a 1x 8 PCIe to XMC. All the PCIe is flexible configuration, for instance, a 2x 8 PCIe can be set into 2 x8, 1 x8 + 2 x4, or 4 x4.
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CP42102 -
LinkedHope Intelligent Technologies Co.,Ltd.
CP42102 is a 2U ruggedized data processing computer compliant with PICMG CompactPCI® specifications. With ruggedized conduction cooling structure and CompactPCI® module design, CP42102 has excellent performance on heat dispassion and anti-vibration, and can save costs on maintenance in the long run.CP42102 can meet the demands for big data processing, computing and storage, as CP42102 is equipped with a 3rd Gen embedded Core™ i7 high-performance processor with up to 16GB memory and 1TB storage. On CP42102, interfaces like Ethernet, USB, serial ports, VGA, etc. are routed to the rear through aviation plugs; inside the chassis, CPU slot and 2 service slots are connected by 1x LVTTL; outside the chassis, 2 N50K RF interfaces are added for external interconnection.
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CP32107 -
LinkedHope Intelligent Technologies Co.,Ltd.
Based on Intel® 4th Generation Core™ and Celeron® i7/i5/i3 processors, CP32107 is a high-performance 3U 8HP CPCI PlusIO SBC with up to 4x2.4GHz and 8 threads CPU. For better heat-dissipation, CP32107 is equipped with a noiseless fan that has adjustable rotational speed.CP32107 is provided with rich front and rear I/O interfaces, including 2x USB3.0 for peripheral, 2x GbE (through M12 Connector) for LAN, 1x Display Port supporting 3840x2160 output on front; 2x SATA III, 2x GbE, 4x USB2.0, 2x RS232/422/485 on rear. The rear is compliant with PlusIO Standard, and supports 3 x1 PCIe Gen2.0 interfaces. Besides, mSATA or CFast disk can be installed on CP32107.
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Teledyne DALSA
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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PCI592 -
Vadatech Inc
The PCI592 is based on the Xilinx XCKU115 Kintex UltraScale FPGA, which provides 5,520 DSP slices, 75.9 Mb RAM and 1,451,000 logic cells. The FPGA interfaces directly to the FMC+ DP-23 and all FMC+ LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 modules. It also has interface to three DDR4 memory channels (2x 64-bit wide and 1x 32-bit wide). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host. The unit has x8 PCIe edge connector routed to the FPGA PCIe Gen3 hard IP block. In addition, 16 uncommitted connection pairs are routed to a dual x8 expansion connector, providing direct connectivity to a neighbouring FPGA (e.g. via Aurora, 10G/40G, SRIO, PCIe) without the need to go through the host.
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PCI596 -
Vadatech Inc
The PCI596 is based on the Xilinx VU13P UltraScale+TM FPGA, which provides over 12,000 DSP slices, 360 Mb of UltraRAM and 3,780K logic cells. The FPGA interfaces directly to the FMC+ DP 0-31 and all FMC+ LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 and VITA 57.4 modules. It also has interface to DDR4 memory channels (1x 64-bit wide, 8 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host. PCI596 has x16 PCIe edge connector routed to the FPGA PCIe Gen4 hard IP block. In addition, 16 uncommitted connection pairs are routed to a dual x8 expansion connector, providing direct connectivity to a neighbouring FPGA (e.g. via Aurora, 10/40GbE, SRIO, PCIe) without the need to go through the host.
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68G5E -
North Atlantic Industries
The 68G5E is a 3U OpenVPX board that is configured with an Ethernet Switch module (choose the ES1, 12-Port GbE Cu legacy unmanaged Ethernet Switch, or the ES2 16-Port Cu GbE managed Ethernet Switch with optional 4x 10GBASE-SR 850 nm multimode Fiber Optic interface) and provides additional support for one NAI smart I/O and Communications function module. Uniquely designed, the 68G5E provides ‘independent’ Ethernet Switch capabilities and can operate as a MFIO board end point with access via the 1 x1 PCIe and/or 1x 10/100 Ethernet motherboard Control Port which hosts the NAI Ethernet Protocol Server/Listener application for direct GbE MFIO control. Ideally suited for rugged Mil-Aero applications, the 68G5E delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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CP62007 -
LinkedHope Intelligent Technologies Co.,Ltd.
CP62007 is a 6U processor blade based on Intel’s 4th generation core i7/i5 processors using 22nm process technology, supporting up to four cores / eight threads at 2.4GHz. CP62007 supports up to 16GB onboard soldered low voltage DRAM with ECC. It also offers up to 64/128GB SLC/MLC onboard SATA SSD for installing operating system and drivers. The onboard design of memory and SSD enhance the anti-shock and vibration performance dramatically.CP62007’s onboard processor integrates Intel® HD Graphics 4600 controller, supporting a variety of display outputs, such as eDP/DP/HDMI/DVI/VGA. And the VGA resolution is up to 2048x1536. With HDMI/DP/eDP outputs, the resolution can be up to “4K”.CP62007 supports 1x VGA and 2x DP/HDMI/DVI, up to 3 independent or cloned displays.CP62007 uses high speed CPCI connectors on J3 and J4 position for transferring high speed serial signals, such as PCIe2.0, USB3.0 and SATAIII. And the foot-print of high speed connectors are fully compliant with CompactPCI specifications.
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MIC-6315 -
Advantech Co. Ltd.
The MIC-6315 is the 6U OpenVPX processor blade echoing to the customer’s requirements. Based on the Intel® Xeon® D-1500 processor family, the MIC-6315 supports to 12 cores/24 threads, to fulfill the computing requirements form the customer. The MIC-6315 provides various high speed interfaces to communicate with the system: dual Serial Rapid I/O on the Data Plane, a configurable PCIe gen. 3 x 16 port on the Expansion Plane, with another x8 and x4 PCie ports on the user-define plane, and there are two 40GBase-KR4 ports available on the user-define plane. These interfaces enable the possibility of high speed data communication to optimize the performance of the product. Serial Rapid I/O and PCI express have low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards to create a system with vast functions. To maintain the maximum memory throughput in the different harsh environments, the Advantech R&D teams dedicate themselves to optimize the layout of the product. The MIC-6315 is capable to support ECC in a dual channel design running up to 2133MT/s with 64GB capacity*, and has the default capacity of the onboard DDR4 with 32GB or 16GB. The MIC-6315 offers three types of the storage options: A 64GB onboard NAND flash as the native storage, and three M.2 sites with 1x SATA M.2, 2x NVME M.2 interfaces are supported at the same time. The MIC-6315 has a reinforced convection-cooled heatsink as the thermal solution. Two native ruggedized connectors are available on the front panel, and several common I/O port connectors can be used for debugging purpose at the same time. Compliant with the IPMI 2.0, the MIC-6315 uses Adavantech-code-based board management solution, and supports iKVM, remote control and upgrade. This Advantech BMC code uses the LTS kernel for stability and security, and enables the possibility of customization. The user can setup the PCIe switch configuration in the BIOS menu without any firmware or hardware modification.
