Ground Bond
Checks a ground circuit's ability to handle fault current in the event of insulation failure.
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Product
Earth Ground Testers
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It is critical for facilities to have grounded electrical systems, so that in the event of a lightning strike or utility overvoltage, current will find a safe path to earth. To ensure a reliable connection to earth, the International Electrical Testing Association specifies ground electrode testing every three years.
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Multimode Bond Tester
BondMaster 600
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The BondMaster® 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications.
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Earth Bond Test Set
EC-12
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The Earth bond test is a basic safety test prescribed in many standards to test samples for the integrity of earthing continuity throughout the sample.
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Bond Tester
Sigma Lite
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Sigma lite is a low cost of ownership bond tester that grows with your company. It gives you a low-cost entry point without sacrificing performance to meet future demands.
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Personal Grounding Tester
PGT120
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Electronic test apparatus for checking personnel grounding systems such as electrostatic wrist straps and conductive footwear. The unit is equipped with two separate measuring circuits and is therefore capable of checking wrist straps and footwear separately or in parallel. The test result is signaled visually, acoustically (only if error is detected) and via contacts.
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Ground Set Tester
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Self-contained, portable convenienceThis tester provides an easy way for an electric utility to check the resistance in protective grounding sets used by line personnel.
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Battery Ground Detector
BGD
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Battery Ground Detectors supply contact closures for alarm indications at precise ground fault resistance settings.
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Bonding Ohmeters
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bonding ohmmeter is an affordable, highly accurate, and intrinsically safe electrical bond tester. This meter is capable of performing bond measurements on a variety of components and metal-to-metal connections. The 620LK has been independently UL-913 certified, ensuring quality and safety at each step of manufacturing. Due to its safety certifications and high level of accuracy, the 620LK meter is the choice bond tester for many commercial airliners, while its sibling the 620UK-B is in countless USAF programs.
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Product
Neutral Grounding Resistors
NGR
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Neutral Grounding Resistors (NGRs) are used to limit the fault current for safety of equipment and personnel in industrial systems.
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Protective Bonding Testers
RMO-E Series
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The RMO-E instruments are designed and ideal for testing protective bonding (grounding) of equipment following the standard IEC 61010-1. Also, they can measure the resistance of high, middle and low voltage circuit breakers, high-current bus bar joints, cable splices, and welding joints. The instruments accurately measure not only in factory environments but also in high-induction fields and substations.Both models generate a true DC ripple-free (less than 1 %) current with automatically regulated test ramps. During a test, the protective bonding testers automatically generate increasing current before measuring and decreasing current after the measurement. Consequently, this significantly decreases magnetic transients and ensures great accuracy.These instruments can store up to 500 measurements in the internal memory and have a built-in thermal printer available as an option.DV Win software communicates with the RMO-E earth resistance meter via USB or RS232 interface. It allows a user to run the test remotely from PC, as well as to download test results, analyze and generate fully configurable test reports.The RMO-E series contains two models, RMO60E and RMO100E. The main difference between these two models is in the maximal test current:60 A DC for RMO60E100 A DC for RMO100E
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Product
Ground Fault Monitors
IFT
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In most industrial settings, ground faults can cause significant damage. Since these leaks are unavoidable in almost all industrial environments, our ground fault monitors allow you to quickly and easily find the source of the leak before a major problem occurs and damages your equipment. The IFT-120 is designed to help you rapidly locate ground faults.
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Product
Ground Fault Finder
FST-JD200 DC
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Foresight Electronics Co., Ltd.
FST-JD200 not only can provide a solution on accurately testing the faults of the indirect-grounding of the direct current system, non-metal grounding, loop grounding, simultaneous grounding of the anode and cathode, balanced grounding of the anode and cathode and multi-point grounding 1.The high-precision sampling clamp meter The device uses a high resolution (0.1mA) signal sampling direct current clamp meter that can achieve multi-point grounding and high resistance ground point positioning...
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Product
Scott Internal Bond Impact Tester
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The Scott Internal Bond Impact Tester is used to determine tear resistance (Elmendorf). A sample is torn with the help of the pendulum device starting from a predetermined cut. The work required for a tear of a given length is measured.
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Fusion Bonded Cable Jumpers
Series 152FB
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Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
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Ground Weather Analytics
HELIOS
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L3Harris Geospatial Solutions, Inc
Microclimates are on the rise, and as a result, there are extreme deviations of wind, snow, fog and visibility even over short distances. Organizations of all sizes need hyperlocal ground information and weather data to enhance operational efficiencies and make better decisions that can save time, money, property and even lives.
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Post Wire and Die Bond Inspection Machine
IV-E1700
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IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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Permanent Bonding Systems
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The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
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Resistance Wire Bonding
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Electronic Systems of Wisconsin, Inc.
ESW's Resistance Wire Bonding System comes equipped with the latest features the market has to offer. Our system is capable of bonding armatures, stators or coils. The on-screen display in our bonder makes it easy to read, track, and record your bonding data. If desired, ESW offers complete electrical testing of the part prior to the bonding sequence as well. This ensures only good parts that have been electrically tested are processed through bonding. It is our duty to make sure you never have to worry about losing important information again. Our Sales and Engineering staff will work closely with you to make sure that a bonding systems will meet your needs. See the slideshow below to see some of our Resistance Wire Bonding Testers.
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Product
PE/ Ground, Insulation Resistance Tester
Handheld
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The safety testers of the Handheld class are used to measure PE/ Ground resistances, insulation resistances and to perform a simple functional test. The small and sturdy universal testers are intended for standard-compliant safety tests in workshops and production as well as for mobile operation during repair, installation, service and more.
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Ground Fault Locator
DC Trace
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SCOPE introduces DC Trace, the most advanced and user friendly DC Earth (Ground) Fault Locator. This portable instrument consisting of Signal Generator & Signal Receiver (DC TraceR) uses latest digital signal processing technology. It’s ability to detect earth faults in live DC system quickly & accurately in online condition greatly relieves the substation maintenance engineers from nightmare of earth leakages & it’s detection.
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Earth Ground Clamp
1630-2
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The 1630-2 FC clamp measures earth ground loop resistances for multi-grounded systems using the dual-clamp jaw. This test technique eliminates the dangerous and time-consuming activity of disconnecting parallel grounds, as well as the process of finding suitable locations for auxiliary test stakes.
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Handheld Grounding Tester
HGT1
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The HGT1 is a handheld meter to measure ground impedance as well as step and touch voltages. Using the CPC 100 and CP CU1, test currents at variable frequencies can be fed into power cables or overhead lines safely to simulate a ground fault.
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Ground Tactical Data Link System
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Curtiss-Wright Defense Solutions
Fulfilling the increasing need for secure, reliable, and efficient communication systems in the battlefield, TCG GTS is an affordable and combat proven TDL solution with comprehensive situational awareness (SA), command and control (C2) and non-C2 data link capabilities.
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Post Wire and Die Bond Inspection Machine
IV-T3300
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IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
