Ground Bond
Checks a ground circuit's ability to handle fault current in the event of insulation failure.
-
Product
Programmable Ground Resistance Tester
-
AllWin Instrument Science and Technology Co., Ltd.
Executive test in 40A/60A of UL60950-1Test resistance range 0~510m ohmOutput current range 5~40A
-
Product
Ground Support Equipment & Software
-
AMERGINT integrates our suite of RF communications, data acquisition and telemetry processing products into turn-key systems our customers use for precise monitoring and automated testing.
-
Product
Ground Resistivity and EarthService Tester
AD-510
-
Large, readable LCD display (2000 counts), Instant battery life indicator, Test frequency: 128 Hz (quartz generator), Test Voltage: max 30 V peak-to-peak, Range: 0,01 W ? 2 k W. Accuracy resistance measurement: 1 % 2 digits,
-
Product
Earth Ground Testers
-
Plant maintenance is a must! Confirming your ground resistance is crucial for instruments and machinery. Our Earth Ground Testers provide simple accurate measurement of earth resistance.
-
Product
Hybrid And Fusion Bonding Systems
-
Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
-
Product
Ground Detection and Earth Fault Location Equipment for Ungrounded or Floating DC Systems
ZX3
-
The ZX3 is a ground fault locator that finds grounds (current leakage) on a battery system positive rail, the negative rail, on both rails simultaneously, in a field device, battery bank or solar array/string, regardless if they are high resistance or low resistance or in a capacitive environment. It also can provide more information about the DC ground than any other equipment available, providing maximum analyzing capabilities.
-
Product
Earth Ground Test Lead Kit
TL-796
-
*Earth Resistance Test Lead Kit*For use with IDEAL 61-796 3-Pole Ground Resistance Tester
-
Product
Electrical Grounding Analysis
GroundMat
-
SKM GroundMat is a program for substation ground grid design and analysis. It is designed to help optimize grid design or reinforce existing grids of any shape. It uses a general-purpose finite element algorithm for potential analysis and graphical facilities to validate ground system efficiency
-
Product
Die-To-Wafer Bonding Systems
-
Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
-
Product
Post Wire and Die Bond Inspection Machine
IV-E1700
-
IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
