Strain Gages
measure of displaced surface elements.
See Also: Strain Gauges, Strain Gage Amplifiers, Strain Gage Signal Conditioners, Strain
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Product
FEA and Strain Gauge Testing
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Circuit Check began Strain Gauge Testing in 1999 when BGA/SMT technology started replacing PTH components, reducing strain levels was a reactive post fixture fabrication process. We quickly recognized that the “reactionary” process was neither efficient nor were we capable on knowing the lowest achievable strain levels. Our engineering team came up with visual tools utilized during design to easily identify areas of excessive probe force, though still not enough data was generated to identify the lowest possible strain. Finite Element Analysis software models the PCBA and test fixture and applies the pressures from test probes and board supports and indicates the micro strain level applied to the PCBA. Using the FEA software during our design process allows our engineers to modify fixture designs to attain the lowest possible micro strain before fabrication begins.
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Product
High-Capacity Cylindrical Shaft Gage
1200-HC
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For higher capacity requirements, the 1200-HC delivers exceptional accuracy and repeatability, powered by the same trusted laser interferometer technology as the 1200-LX but with a 52-86% larger swing diameter. With five models available to suit various shaft lengths and weights, the 1200-HC can accommodate shafts up to 4,572 mm (180 inches) in length and weighing up to 1,814 kg (4,000 lbs). Refer to the specifications for detailed model information.
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
