SEM
surface imaging from 1 to 5 nm in size.
See Also: Scanning Electron Microscopy, Scanning Electron Microscopes, EBSD
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Product
Scanning Electron Microscope (SEM)
Prisma E
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Prisma E scanning electron microscope (SEM) combines a wide array of imaging and analytical modalities with new advanced automation to offer the most complete solution of any instrument in its class. It is ideal for industrial R&D, quality control, and failure analysis applications that require high resolution, sample flexibility and an easy-to-use operator interface. Prisma E succeeds the highly successful Quanta SEM.
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Metrology/SEM
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Our SEM products use scanning electron microscope technology to measure and review tiny surface structures such as photomask etching and circuitry on wafers with high precision and stability.
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Scanning Electron Microscopy (SEM Analysis)
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Rocky Mountain Laboratories, Inc.
Scanning Electron Microscopy (SEM Analysis) can produce images of almost any sample at magnifications of 15-300,000X. The SEM has tremendous depth of field allowing for imaging that cannot be accomplished using optical microscopy. Conductive and nonconductive samples can be imaged. When operated in the backscatter (BSE) detection mode, differences in material composition can be observed. Elemental analysis can be performed on any feature observed with an integrated Energy Dispersive Spectroscopy (EDS) detector.
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Electron Probe Microanalyzer
EPMA-8050G
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This instrument is equipped with a cutting-edge FE electron optical system, which provides unprecedented spatial resolution under all beam current conditions, from SEM observation conditions up to 1 μA order. Integration with high performance X-ray spectrometers that Shimadzu has fostered through the company's traditions achieves the ultimate advance in analysis performance.
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Scanning Electron Microscopes
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Our Scanning Electron Microscopes (SEMs) resolve features from the optical regime down to the sub-nanometer length scale.
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Plane Wave Converter
PWC200
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The R&S®PWC200 Plane Wave Converter is a bidirectional array of 156 wideband Vivaldi antennas placed in the radiating near field of the device under test (DUT). The phased antenna array can form planar waves inside a specified quiet zone within the radiating near field of the 5G massive MIMO base station for realtime radiated power and transceiver measurements (EVM, ACLR, SEM, etc.).
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Scanning Electron Microscope
JSM-IT510
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Scanning electron microscopes (SEMs) are indispensable tools not only for research but also for quality assurance and manufacturing sites.At those scenes, the same observation processes need to be performed repeatedly and there has been a need to improve the efficiency of the process.
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CD-SEM
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Our CD-SEM tools measure the width, height, sidewall angle, etc. of wiring patterns on semiconductor photomasks and wafers.
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Electron Microscope Analyzer
QUANTAX Micro-XRF
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Micro-X-ray Fluorescence (Micro- XRF) spectroscopy analysis is a complementary non-destructive analytical technique to traditional Energy Dispersive Spectroscopy (EDS) analysis using a Scanning Electron Microscope (SEM).
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Scanning Electron Microscopes
SEM
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Scanning Electron Microscopes (SEM) scan a sample with a focused electron beam and obtain images with information about the samples’ topography and composition.
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SEM Dual-Purpose Glassy Carbon Electrode
DP-1-3
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Dual-purpose glassy carbon working electrode for electrochemical measurements and SEM analysis. Available in 2-6 mm diameters with PTFE or PEEK housing, plus magnetic or detachable electrode configurations for surface characterization workflows.
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MASK MVM-SEM® E3600 Series
E3650
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Amid the progress of multiple-exposure technology, and the development of finer-pitch and more complicated circuits, as well as increases in the number of masks and the number of measurement points on each mask, the size of wiring patterns formed on photomasks needs to be measured and evaluated stably with high precision. Advantest’s E3600 series meets the needs of state-of-the-art devices with high measurement repeatability and stable throughput.
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Cross Sections and Metallography
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Rocky Mountain Laboratories, Inc.
Cross sections are prepared by mounting samples in epoxy and then grinding and polishing the mount for imaging in the optical microscope or Scanning Electron Microscopy (SEM). Valuable information from cross sectioning can include: film thicknesses, inclusions, corrosion thickness, dimensional verification, and subsurface defects. Metallographic cross sections are typically etched to reveal the microstructure. Microstructural analysis can provide information about heat treatment history, corrosion susceptibility, as well as undesirable microconstituents.
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Electron Microscope Analyzers
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Bruker’s electron microscope analyzers EDS, WDS, EBSD and Micro-XRF on SEM offer the most comprehensive compositional and structural analysis of materials available today. The full integration of all these techniques into the ESPRIT software allows you to easily combine data obtained by these complementary methods for best results.
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WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Scanning Electron Microscope
Verios G4 XHR SEM
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The Thermo Scientific™ Verios G4 scanning electron microscope (SEM) provides sub-nanometer resolution from 1 to 30 kV and enhanced contrast needed for precise measurements on materials in advanced semiconductor manufacturing and materials science applications, without compromising the high throughput, analytical capabilities, sample flexibility and ease of traditional Scanning Electron Microscope (SEM).
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MASK MVM-SEM® E3600 Series
E3640
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Ongoing semiconductor process shrinks are driving new demand for stable, highly precise measurement of pattern dimensions for photomask and wafer production. The E3640 satisfies these requirements with industry-leading precision measurement capabilities and upgraded functionality that enhances mask R&D and production efficiency.
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MultiBeam System
FIB
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An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.
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EBSD tools
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EDAX EBSD tools provide leading performance and groundbreaking technology for analyzing crystallographic microstructure, using electron backscatter diffraction in the SEM.
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Real-time Chemical Imaging System
AZtecLive & Ultim Max
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AZtecLive is a revolutionary new approach to EDS analysis that enables a radical change in the way users perform sample investigation in the SEM. It combines a live electron image with live X-ray chemical imaging to give an intuitive new way of interacting with your samples. 100 mm2 and 170 mm2 sensor areas. Quantitative analysis at 400,000 cps. EDS mapping at >1,000,000 cps.
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Spectroscopic Platform
Allalin
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The Allalin is a nanometer resolution spectroscopy instrument, based on a disruptive technology known as quantitative cathodoluminescence that integrates a light microscope and a scanning electron microscope (SEM) into one tool.
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Electron Microscope Analyzer
QUANTAX FlatQUAD
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QUANTAX FlatQUAD is the EDS microanalysis system based on the revolutionary XFlash® FlatQUAD. This annular four-channel silicon drift detector is inserted between SEM pole piece and sample, achieving maximum solid angle in EDS.
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MASK DR-SEM
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Our defect review SEM tools perform detailed reviews of minute defects on photomasks.
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Sputter Coater & Freeze Fracture Solutions
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To obtain high-quality images of samples with scanning (SEM) or transmission electron microscopy (TEM), your samples need to be conductive to avoid charging. If a sample does not have a high enough conductivity, then you can quickly cover it with a conductive layer using the method of sputter coating. Also, a carbon or e-beam evaporator coating can be used. Such coatings protect the sample, allow enhancing of the EM image contrast, or can act as a TEM-grid support film for small scale samples.
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Energy Dispersive X-ray Spectroscopy
EDS
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Materials Evaluation and Engineering
EDS is an elemental chemical microanalysis technique performed in conjunction with each of the SEMs at MEE. Features or phases as small as about 1 micron can be analyzed.
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Electron Microscope Analyzer
QUANTAX EDS for TEM
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Long standing expertise in EDS ensures the configuration of the best solution for your specific microscope (STEM, TEM or SEM) thanks to slim-line detector design and geometrical optimization for each microscope pole piece and EDS flange type
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Nanomechanical Instruments for SEM/TEM
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As the world leader in nanomechanical testing systems, Bruker makes it easy for you to conduct in-situ mechanical experiments in your microscope with the Hysitron PI Series PicoIndenters. Our unique transducer design delivers unmatched stability throughout your experiments, resulting in precise data even at the nanoscale.
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Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Magnetic Field Cancelling System
MR-3
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3-axis magnetic field cancelling system for electron microscopes (SEM and TEM), electron and ion beam experiments, nanotechnology, biomagnetic investigations, etc. High reliability through rugged analog design. No tedious programming, no chrashs. More than 1000 MR-3 systems sold worldwide.
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Magnetic Field Testing
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Response Dynamics Vibration Engineering, Inc.
As magnetic field consultants, we have been working with magnetic field issues for sensitive tools for many decades from cutting edge development of scanning electron microscopes (SEMs) to active cancellation systems for MRI tools, to site surveys for specification compliance, debugging, and tool Magnetic Field Sensitivity Testing.
