SEM
surface imaging from 1 to 5 nm in size.
See Also: Scanning Electron Microscopy, Scanning Electron Microscopes, EBSD
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Scanning Electron Microscopy (SEM Analysis)
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Rocky Mountain Laboratories, Inc.
Scanning Electron Microscopy (SEM Analysis) can produce images of almost any sample at magnifications of 15-300,000X. The SEM has tremendous depth of field allowing for imaging that cannot be accomplished using optical microscopy. Conductive and nonconductive samples can be imaged. When operated in the backscatter (BSE) detection mode, differences in material composition can be observed. Elemental analysis can be performed on any feature observed with an integrated Energy Dispersive Spectroscopy (EDS) detector.
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Metrology/SEM
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Our SEM products use scanning electron microscope technology to measure and review tiny surface structures such as photomask etching and circuitry on wafers with high precision and stability.
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Field Emission SEM
FESEM
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Materials Evaluation and Engineering
The FESEM is an advanced microscope offering increased magnification and the ability to observe very fine features at a lower voltage than the SEM found in most laboratories.
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Scanning Electron Microscope (SEM)
Prisma E
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Prisma E scanning electron microscope (SEM) combines a wide array of imaging and analytical modalities with new advanced automation to offer the most complete solution of any instrument in its class. It is ideal for industrial R&D, quality control, and failure analysis applications that require high resolution, sample flexibility and an easy-to-use operator interface. Prisma E succeeds the highly successful Quanta SEM.
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MultiBeam System
FIB
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An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.
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Electron Microscope Analyzer
QUANTAX FlatQUAD
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QUANTAX FlatQUAD is the EDS microanalysis system based on the revolutionary XFlash® FlatQUAD. This annular four-channel silicon drift detector is inserted between SEM pole piece and sample, achieving maximum solid angle in EDS.
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Ion Beam Milling Systems
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When material specimen surfaces are prepared for SEM or incident light microscopy, the specimen usually undergoes multiple processes until the layer or surface to be analyzed is machined with precision. Leica Microsystems’ workflow solutions for solid state technology cover all steps required for demanding high-quality sample preparation.
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Electron Microscope Analyzer
QUANTAX WDS
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The QUANTAX WDS (WDX) for SEM consists of the XSense wavelength dispersive spectrometer yielding the best resolution among all parallel-beam WDS systems.
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Atomic Force Microscope for SEM/FIB
AFSEM® AFM Insert
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AFSEM is an atomic force microscope (AFM), designed for integration in a SEM or Dualbeam (SEM/FIB) microscope. Its open access design allows you to simultaneously operate SEM and AFM inside the SEM vacuum chamber. The correlated image data of AFM and SEM enable unique characterization of your sample, and the combination of complementary techniques is a key success factor for gaining new insights into the micro and nano worlds. AFSEM enables you to easily combine two of the most powerful analysis techniques to greatly extend your correlative microscopy and analysis possibilities.
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Sematech Analysis and SEMI Standards Analysis
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Rocky Mountain Laboratories, Inc.
Rocky Mountain Laboratories, Inc. provides SEMI Standards analyses that conform to the following SEMATECH and SEMI Standards for testing of passivated 316L stainless steel components being considered for installation into a high-purity gas distribution system:SEMASPEC #90120401B-STD (SEM Analysis)SEMASPEC #90120402B-STD (EDS Analysis)SEMASPEC #90120403B-STD (XPS Analysis)SEMASPEC #91060573B-STD (Auger (AES) Analysis)SEMI F60-0306 (based on F60-0301) (XPS Analysis)SEMI F72-1102 (Auger (AES) Analysis)
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SEM- Based Dectors
ScintiFast™
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ScintiFast™ is El-Mul’s flagship scintillator technology enabling the next generation of detectors with shorter response time and higher sensitivity. Recently released, ScintFast™ has the highest available photon yield for the nanosecond scintillator category. ScintiFast™ is the scintillator of choice for detectors in SEM-based tools for the semiconductor market as well as in Time of Flight Mass Spectrometry instruments.
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Scanning Electron Microscope
JSM-IT510
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Scanning electron microscopes (SEMs) are indispensable tools not only for research but also for quality assurance and manufacturing sites.At those scenes, the same observation processes need to be performed repeatedly and there has been a need to improve the efficiency of the process.
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CD-SEM
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Our CD-SEM tools measure the width, height, sidewall angle, etc. of wiring patterns on semiconductor photomasks and wafers.
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Stand alone Software
MeX
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MeX is a stand alone software package that turns any SEM with digital imaging into a true surface metrology device. Using stereoscopic images the software automatically retrieves 3D information and presents a highly accurate, robust and dense 3D dataset which is then used to perform traceable metrology examination. The results are obtained irrespective of the SEM magnification providing metrology at macro and micro levels. No additional hardware is necessary to run MeX and it can be used with any SEM. Due to the unique AutoCalibration routine the calibration data is automatically refined. Thereby only MeX enables traceable 3D measurements at any magnification in the SEM.
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Energy Dispersive X-Ray Spectroscopy (EDS)
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Rocky Mountain Laboratories, Inc.
Energy Dispersive Spectroscopy (EDS Analysis) is used in conjunction with the Scanning Electron Microscope (SEM) providing chemical analysis in areas as small as 1 µm in diameter. EDS detects all elements except for H, He, Li, and Be. EDS can be performed exactly on any features or particles seen in the SEM images and can “MAP” elements on a surface. Unknown materials can be identified and quantitative analysis can be performed.
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Scanning Electron Microscope
Verios G4 XHR SEM
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The Thermo Scientific™ Verios G4 scanning electron microscope (SEM) provides sub-nanometer resolution from 1 to 30 kV and enhanced contrast needed for precise measurements on materials in advanced semiconductor manufacturing and materials science applications, without compromising the high throughput, analytical capabilities, sample flexibility and ease of traditional Scanning Electron Microscope (SEM).
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Electron Microscope Analyzers
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Bruker’s electron microscope analyzers EDS, WDS, EBSD and Micro-XRF on SEM offer the most comprehensive compositional and structural analysis of materials available today. The full integration of all these techniques into the ESPRIT software allows you to easily combine data obtained by these complementary methods for best results.
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Microscopy Software/Hardware
ZEISS Atlas 5
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Atlas 5 is your powerful hardware and software package that extends the capacity of your ZEISS scanning electron microscopes (SEM) and ZEISS focused ion beam SEMs (FIB-SEM). Use its efficient navigation and correlation of images from any source, e.g. light- and X-ray microscopes. Take full advantage of high throughput and automated large area imaging. Unique workflows help you to gain a deeper understanding of your sample.
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MASK MVM-SEM® E3600 Series
E3650
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Amid the progress of multiple-exposure technology, and the development of finer-pitch and more complicated circuits, as well as increases in the number of masks and the number of measurement points on each mask, the size of wiring patterns formed on photomasks needs to be measured and evaluated stably with high precision. Advantest’s E3600 series meets the needs of state-of-the-art devices with high measurement repeatability and stable throughput.
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EBSD tools
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EDAX EBSD tools provide leading performance and groundbreaking technology for analyzing crystallographic microstructure, using electron backscatter diffraction in the SEM.
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Saluki CSA Series Signal Analyzer (Modular)
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Saluki CSA series signal analyzer reaches the frequency from 100 kHz to up to 26.5 GHz with a maximum of 40 MHz analysis bandwidth. It can test signal power, frequency, phase, P-1, TOI, OBW, channel power, spurious, ACPR, CCDF, SEM, EVM, and other indicators. It can be used independently or combined with the chassis to form a test system.
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Plane Wave Converter
PWC200
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The R&S®PWC200 Plane Wave Converter is a bidirectional array of 156 wideband Vivaldi antennas placed in the radiating near field of the device under test (DUT). The phased antenna array can form planar waves inside a specified quiet zone within the radiating near field of the 5G massive MIMO base station for realtime radiated power and transceiver measurements (EVM, ACLR, SEM, etc.).
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Electron Microscope Analyzer
QUANTAX EDS for TEM
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Long standing expertise in EDS ensures the configuration of the best solution for your specific microscope (STEM, TEM or SEM) thanks to slim-line detector design and geometrical optimization for each microscope pole piece and EDS flange type
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Electron Microscope Analyzer
QUANTAX EBSD
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QUANTAX EBSD system, with its popular OPTIMUS 2 detector head, is the best available solution for analyzing nanomaterials in the SEM
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Saluki CSA-M Series Signal Analyzer (Benchtop)
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Saluki CSA-M series benchtop signal analyzer reaches the frequency from 100 kHz to up to 26.5 GHz with a maximum of 40 MHz analysis bandwidth. It can test signal power, frequency, phase, P-1, TOI, OBW, channel power, spurious, ACPR, CCDF, SEM, EVM, and other indicators.
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Nanomechanical Instruments For SEM/TEM
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As the world leader in nanomechanical testing systems, Bruker makes it easy for you to conduct in-situ mechanical experiments in your microscope with the Hysitron PI Series PicoIndenters. Our unique transducer design delivers unmatched stability throughout your experiments, resulting in precise data even at the nanoscale. Video capture from the microscope enables real-time monitoring and direct correlation of mechanical data to microscope imaging. With solutions designed to fit many of the microscope brands in use, you are sure to find one that is ideally suited to your research.
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X-Ray Photoelectron Spectrometer
AXIS Supra
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AXIS SupraTM is an X-ray photoelectron spectrometer (XPS) with unrivalled automation and ease of use for materials surface characterisation. The patented AXIS technology ensures high electron collection efficiency in spectroscopy mode and low aberrations at high magnifications in parallel imaging mode. XPS spectroscopy and imaging results can be complemented by additional surface analysis techniques such as: ultraviolet photoemission spectroscopy (UPS); Schottky field emission scanning Auger microscopy (SAM) and secondary electron microscopy (SEM) and ion scattering spectroscopy (ISS). The AXIS Supra replaces the AXIS Ultra DLD as Kratos' flagship x-ray photoelectron spectrometer.
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Magnetic Field Testing
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Response Dynamics Vibration Engineering, Inc.
As magnetic field consultants, we have been working with magnetic field issues for sensitive tools for many decades from cutting edge development of scanning electron microscopes (SEMs) to active cancellation systems for MRI tools, to site surveys for specification compliance, debugging, and tool Magnetic Field Sensitivity Testing.
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Magnetic Field Cancelling System
MR-3
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3-axis magnetic field cancelling system for electron microscopes (SEM and TEM), electron and ion beam experiments, nanotechnology, biomagnetic investigations, etc. High reliability through rugged analog design. No tedious programming, no chrashs. More than 1000 MR-3 systems sold worldwide.
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WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
