SEM
surface imaging from 1 to 5 nm in size.
See Also: Scanning Electron Microscopy, Scanning Electron Microscopes, EBSD
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Product
Scanning Electron Microscope (SEM)
Prisma E
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Prisma E scanning electron microscope (SEM) combines a wide array of imaging and analytical modalities with new advanced automation to offer the most complete solution of any instrument in its class. It is ideal for industrial R&D, quality control, and failure analysis applications that require high resolution, sample flexibility and an easy-to-use operator interface. Prisma E succeeds the highly successful Quanta SEM.
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Scanning Electron Microscopy
SEM
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Materials Evaluation and Engineering
JEOL JSM-6610 LV LaboratoryScanning electron microscopy (SEM) uses electrons for imaging to obtain higher magnifications and greater depth of field than light microscopes. The instruments at MEE are capable of variable-pressure, or low vacuum, SEM (VPSEM), as well as traditional high-vacuum conditions for sample observation. VPSEM is a specialized method using a variable-pressure sample chamber that allows direct evaluation of samples that are not readily examined with a traditional high-vacuum SEM. Nonconductive or vacuum sensitive samples that would typically require additional sample preparation can be directly analyzed in VPSEM without the need for additional sample preparation, such as carbon or metallic conductive coatings. This reduces both sample preparation time and distractions in microanalysis. Our laboratory also has a field emission SEM (FESEM) for critical high-magnification work and low-voltage (LVSEM) applications. Each instrument has a spacious sample chamber that can accommodate large and irregularly-shaped specimens and accessories for feature dimensional analysis and chemical microanalysis.
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Heavy Duty Dynamometers
MD-250-HD
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The MD-250-HD series dyno (SE/DE) was designed to be a performance dynamometer first with the added benefit of being able to test 2-wheel-drive heavy-duty vehicles such as truck, buses and commercial vehicles in addition to the standard car or light duty pick-up. The 250-HD is certified in the states of Colorado, Nevada and Utah for use in loaded-mode diesel smog testing programs because of its accuracy and reliability. No other dyno in its class offers more value or better in-house motor vehicle testing capabilities than the Mustang MD-250-HD. For starters, the MD-250-HD boasts a 1,500 horsepower measurement capacity at a top speed of 175 mph and a powerful air-cooled eddy current brake provides the MD-250-HD-SE with 900-hp worth ofloading capacity for steady state testing. Loading capacity can be increased to 1,500-hp via the optional DE model. The 250-HD can be upgraded to the 250-HD-SE-M via the addition of a 100 or 200 hp AC motor for transient testing of electric buses to measure range and regeneration or for emissions testing of IC engines. Do not be fooled by its compact size – the MD-250-HD is a serious dynamometer with serious tuning capabilities. The MD-250-HD uses a powerful eddy current power absorber, a frictionless, air-cooled braking device, to enable it to apply variable and steady state loading. A complete control and data acquisition system lets you design a wide range of tests or select from a host of pre-configured tests included with the standard system. The 250-HD’s four roller design makes setting up vehicles a snap – simply drive onto the 250-HD and let the tires settle in between the rollers. The 250-HD can be installed above-ground or below-ground, it’s your choice. The above-ground system utilizes an optional premium platform and ramp system with an above-ground restraint kit. The addition of an axle pull-down kit help keep the tires from slipping or trying to “climb out” of the rollers.
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Nanomechanical Instruments For SEM/TEM
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As the world leader in nanomechanical testing systems, Bruker makes it easy for you to conduct in-situ mechanical experiments in your microscope with the Hysitron PI Series PicoIndenters. Our unique transducer design delivers unmatched stability throughout your experiments, resulting in precise data even at the nanoscale. Video capture from the microscope enables real-time monitoring and direct correlation of mechanical data to microscope imaging. With solutions designed to fit many of the microscope brands in use, you are sure to find one that is ideally suited to your research.
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Electron Microscope Analyzer
QUANTAX FlatQUAD
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QUANTAX FlatQUAD is the EDS microanalysis system based on the revolutionary XFlash® FlatQUAD. This annular four-channel silicon drift detector is inserted between SEM pole piece and sample, achieving maximum solid angle in EDS.
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Electron Microscope Analyzer
QUANTAX WDS
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The QUANTAX WDS (WDX) for SEM consists of the XSense wavelength dispersive spectrometer yielding the best resolution among all parallel-beam WDS systems.
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Product
Scanning Electron Microscope
JSM-IT510
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Scanning electron microscopes (SEMs) are indispensable tools not only for research but also for quality assurance and manufacturing sites.At those scenes, the same observation processes need to be performed repeatedly and there has been a need to improve the efficiency of the process.
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Electron Microscope Analyzer
QUANTAX EDS for TEM
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Long standing expertise in EDS ensures the configuration of the best solution for your specific microscope (STEM, TEM or SEM) thanks to slim-line detector design and geometrical optimization for each microscope pole piece and EDS flange type
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SEM- Based Dectors
ScintiFast™
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ScintiFast™ is El-Mul’s flagship scintillator technology enabling the next generation of detectors with shorter response time and higher sensitivity. Recently released, ScintFast™ has the highest available photon yield for the nanosecond scintillator category. ScintiFast™ is the scintillator of choice for detectors in SEM-based tools for the semiconductor market as well as in Time of Flight Mass Spectrometry instruments.
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Magnetic Field Cancelling System
MR-3
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3-axis magnetic field cancelling system for electron microscopes (SEM and TEM), electron and ion beam experiments, nanotechnology, biomagnetic investigations, etc. High reliability through rugged analog design. No tedious programming, no chrashs. More than 1000 MR-3 systems sold worldwide.
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Product
Energy Dispersive X-ray Spectroscopy
EDS
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Materials Evaluation and Engineering
EDS is an elemental chemical microanalysis technique performed in conjunction with each of the SEMs at MEE. Features or phases as small as about 1 micron can be analyzed.
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Electron Microscope Analyzer
QUANTAX EBSD
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QUANTAX EBSD system, with its popular OPTIMUS 2 detector head, is the best available solution for analyzing nanomaterials in the SEM
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MASK DR-SEM
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Our defect review SEM tools perform detailed reviews of minute defects on photomasks.
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Electron Microscope Analyzers
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Bruker’s electron microscope analyzers EDS, WDS, EBSD and Micro-XRF on SEM offer the most comprehensive compositional and structural analysis of materials available today. The full integration of all these techniques into the ESPRIT software allows you to easily combine data obtained by these complementary methods for best results.
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MASK MVM-SEM® E3600 Series
E3650
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Amid the progress of multiple-exposure technology, and the development of finer-pitch and more complicated circuits, as well as increases in the number of masks and the number of measurement points on each mask, the size of wiring patterns formed on photomasks needs to be measured and evaluated stably with high precision. Advantest’s E3600 series meets the needs of state-of-the-art devices with high measurement repeatability and stable throughput.
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Sematech Analysis and SEMI Standards Analysis
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Rocky Mountain Laboratories, Inc.
Rocky Mountain Laboratories, Inc. provides SEMI Standards analyses that conform to the following SEMATECH and SEMI Standards for testing of passivated 316L stainless steel components being considered for installation into a high-purity gas distribution system:SEMASPEC #90120401B-STD (SEM Analysis)SEMASPEC #90120402B-STD (EDS Analysis)SEMASPEC #90120403B-STD (XPS Analysis)SEMASPEC #91060573B-STD (Auger (AES) Analysis)SEMI F60-0306 (based on F60-0301) (XPS Analysis)SEMI F72-1102 (Auger (AES) Analysis)
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RF Analyzer
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Occupied Bandwidth (OBW)Adjacent Channel Power (ACP)Channel Power (CHP)Complementary Cumulative Density Function (CCDF) Intermodulation (IMD)Spectrum Emission Mask (SEM) IQ (Waveform)Phase Noise
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Scanning Electron Microscopy (SEM Analysis)
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Rocky Mountain Laboratories, Inc.
Scanning Electron Microscopy (SEM Analysis) can produce images of almost any sample at magnifications of 15-300,000X. The SEM has tremendous depth of field allowing for imaging that cannot be accomplished using optical microscopy. Conductive and nonconductive samples can be imaged. When operated in the backscatter (BSE) detection mode, differences in material composition can be observed. Elemental analysis can be performed on any feature observed with an integrated Energy Dispersive Spectroscopy (EDS) detector.
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Sputter Coater & Freeze Fracture Solutions
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To obtain high-quality images of samples with scanning (SEM) or transmission electron microscopy (TEM), your samples need to be conductive to avoid charging. If a sample does not have a high enough conductivity, then you can quickly cover it with a conductive layer using the method of sputter coating. Also, a carbon or e-beam evaporator coating can be used. Such coatings protect the sample, allow enhancing of the EM image contrast, or can act as a TEM-grid support film for small scale samples.
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Nanomechanical Instruments for SEM/TEM
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As the world leader in nanomechanical testing systems, Bruker makes it easy for you to conduct in-situ mechanical experiments in your microscope with the Hysitron PI Series PicoIndenters. Our unique transducer design delivers unmatched stability throughout your experiments, resulting in precise data even at the nanoscale.
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Field Emission SEM
FESEM
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Materials Evaluation and Engineering
The FESEM is an advanced microscope offering increased magnification and the ability to observe very fine features at a lower voltage than the SEM found in most laboratories.
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Scanning Electron Microscopes
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Our Scanning Electron Microscopes (SEMs) resolve features from the optical regime down to the sub-nanometer length scale.
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Wafer Cathodoluminescence Microscope
Säntis 300
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Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Magnetic Field Testing
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Response Dynamics Vibration Engineering, Inc.
As magnetic field consultants, we have been working with magnetic field issues for sensitive tools for many decades from cutting edge development of scanning electron microscopes (SEMs) to active cancellation systems for MRI tools, to site surveys for specification compliance, debugging, and tool Magnetic Field Sensitivity Testing.
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Energy Dispersive X-Ray Spectroscopy (EDS)
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Rocky Mountain Laboratories, Inc.
Energy Dispersive Spectroscopy (EDS Analysis) is used in conjunction with the Scanning Electron Microscope (SEM) providing chemical analysis in areas as small as 1 µm in diameter. EDS detects all elements except for H, He, Li, and Be. EDS can be performed exactly on any features or particles seen in the SEM images and can “MAP” elements on a surface. Unknown materials can be identified and quantitative analysis can be performed.
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MASK MVM-SEM® E3600 Series
E3630
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Together with the miniaturization of semiconductors, high-accurate and stable measurement and evaluation is needed for circuit patterns such as mask patterns and holes. Advantest's E3600 series are used by a wide variety of companies, from semiconductor manufacturers to photomask makers to device and materials producers.
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Electron Microscope Analyzer
QUANTAX Micro-XRF
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Micro-X-ray Fluorescence (Micro- XRF) spectroscopy analysis is a complementary non-destructive analytical technique to traditional Energy Dispersive Spectroscopy (EDS) analysis using a Scanning Electron Microscope (SEM).
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Product
Stand alone Software
MeX
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MeX is a stand alone software package that turns any SEM with digital imaging into a true surface metrology device. Using stereoscopic images the software automatically retrieves 3D information and presents a highly accurate, robust and dense 3D dataset which is then used to perform traceable metrology examination. The results are obtained irrespective of the SEM magnification providing metrology at macro and micro levels. No additional hardware is necessary to run MeX and it can be used with any SEM. Due to the unique AutoCalibration routine the calibration data is automatically refined. Thereby only MeX enables traceable 3D measurements at any magnification in the SEM.
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MultiBeam System
FIB
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An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.
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WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
