Semiconductor Substrate
thin crystalline material sliced from ingot.
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Semiconductor Test System
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IST Information Scan Technology, Inc.
As power modules age, their performance degrades. Proper testing and maintenance of semiconductor devices used in power switching can ensure optimal performance and prevent down-time throughout a device’s lifecycle. The IST Model 8900 Series Discrete Semiconductor Test Systems allows you to effectively identify the percent of degradation in semiconductor devices by simulating the exact current and voltage of the parameters used by devices under real operating conditions.
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Semiconductor Automation
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Brooks' years of experience providing application-specific solutions backed by unparalleled technology leadership, industry expertise.
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Semiconductor Test
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Tecap SPACE offers all the functions necessary to control test systems (ATE) for the semiconductor test. Tecap is hardware-independent and can be used with all customer-specific concepts.
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Product
Automated Discrete Semiconductor Tester (ATE)
5300HX
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The Model 5300HX Automated Discrete Semiconductor Tester (ATE) is designed for fast, reliable testing of a wide range of discrete devices. Using an on-board Intel SBC, can provide stand alone testing capability or connected to a PC for intuitive test development and data capture.
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Product
Power Cycling Semiconductor Life Test System
ITC52300
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The ITC52300 is designed for high-volume intermittent or steady-state operating life testing on Insulated Gate Bipolar Transistors (IGBTs), power MOSFETs, diodes, and other bipolar devices in a production environment. (The ITC52300 is an enhanced version of the ITC5230.)
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Semiconductor Testers
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Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Semiconductor
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With state-of-the-art manufacturing facilities in the U.S., Europe and Asia, local sales offices throughout the world, and on-site applications support, FUJIFILM Electronic Materials is your global partner.
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Product
Semiconductor Electrical Test
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We conduct electric property test (final test) of the completed (packaged) LSI products. We will support testing of analog devices, logic devices, other electronic parts, modules, application products and so on. We will test according to customer's specification regardless of evaluation, trial production, mass production, by know-how cultivated with long-time mass production results. Test initial examination ~ From consistent correspondence up to selection and evaluation, individual correspondence such as design only is accepted.
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Product
Semiconductor
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You can find Spring probes used for test process for production of semiconductor here. Spring probe is probe with spring inside and is also called Double-ended probe and Contact probe. It is assembled in IC socket and becomes electronic path, which vertically connects Semiconductor and PCB. By our excellent machining technique, we can provide spring probe with low contact resistance and long life. “MARATHON” series is our standard lineup of spring probe for testing semiconductor.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Measuring Microscopes, Image Processing + Semiconductor Technology, Micro Scriber
Line Width Measurement
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Optik Elektronik Gerätetechnik GmbH
COMEF is an image processing software with special functions for the highly accurate measurement of line width and line distance. Using grey value algorithms, the width and distance of conductor lines or structures on silicon wafers can be measured with subpixel accuracy.
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Product
Fully Automatic 4 Point Probe Sheet Resistance System For Semiconductor Process Evaluate
WS-3000
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*Automatic probe head selection(exchanger) among 4 kinds of probe head*[No need to exchange a probe head by each different sample measurement]*Edge 1mm measurement is available by dual meas. mode*High cost performance from high speed measurement*FOUP compatible, GEM / SECS compatible
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Product
Spread Resistance For Slanting Polished Sample Of Semiconductor By Tow Kinematically-mounted Probe Contacting .
SRS-2010
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*Resitivity map along with depth direction, thickness of epitaxial , depth of PN junctin and carier density profiles
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Semiconductor Test & High-Speed Digital
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Rosenberger Hochfrequenztechnik GmbH & Co. KG
The wide product range means that a variety of semiconductor test applications and high-speed digital applications are possible. To meet the ever-challenging technological requirements and increasing demands of the semiconductor test equipment industry, Rosenberger has developed and produces multiport mini-coax connectors and cable assemblies – for applications up to 40 GHz – , and spring-loaded coax products. Probes and customer-specific cable assemblies are also available.
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Comprehensive Suite of Software Tools for Semiconductor Test Applications
ICEasy Test Suite
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Marvin Test Solutions' ICEasy Test Suite is supplied with both the TS-900 and TS-960 semiconductor test platforms and provides a comprehensive set of software tools - facilitating the development and debugging of test programs for semiconductor devices. In addition the suite includes I-V curve and Shmoo plot tools for analyzing a device's DC and AC characteristics. The complete suite of tools interfaces seemlessly with Marvin Test Solutions' ATEasy®, a test executive and test development evironment which is supplied with each TS-900 / TS-960 system.
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Product
Semiconductor Test Platform
PAx
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PAx semiconductor test system delivers uncompromised RF performance in a low-cost system for testing RF power amplifiers and front-end modules for next-generation wireless standards.
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300 Mm Semiconductor Processes
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With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
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Product
Semiconductor Test Services
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Tests regarding function, electrical and optoelectronical parameter. Electrical test of wafer up to 8? and packaged devices - selection and volume test.
