EMMC
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Product
Pico-ITX
RSB-3410
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*NXP ARM Cortex-A9 i.MX6 Dual Lite 1 GHz high performance processor*Onboard DDR3 1 GB, 4 GB eMMC Flash*Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators, full HD 1080p video codecHDMI 1920x1080*Single Channel 18/24 bit LVDS*Dual mini-PCIe for WIFI/3G support*1 USB 2.0, 1 USB OTG client*Multiple OS support in Linux/Android
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Product
Yocto/Android 7" Touch Panel Computer With ARM Cortex™-A53 Processor
TPC-107W
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arm SystemReady IR certified.NXP® ARM® Cortex™-A53 i.MX 8M Mini quad-core processor.7" 16:9 LCD with multi-touch P-CAP and true-flat IP66-rated front panel.Up to 4 GB DDR4 RAM and 16 GB eMMC storage onboard.2 x 10/100/1000 Mbps LANs with optional IEEE 802.3at/af PoE-PD module support.1 mb FRAM backup memory for unexpected power interruptions.
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Product
SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK350A (SD card / eMMC tester)
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This product is compatible with SD Memory Card Physical Layer Specification Version 3.01. Supports UHS-I interfaces (SDR12,25,50,104,DDR50). There is a SpeedClass measurement mode that measures SpeedClass that supports SDXC, and a simple performance measurement mode that performs sequential / random access to any address. In addition, the SD card access library (for Visual Studio) is open to the public, and any command can be executed on the SD card in any pattern.
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Product
4G Router
ICR-2734A02
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ICR-2700, EMEA, 2× ETH, USB, Metal, UK Power supply LTE Cat.4 with 3G/2G fallback. 1.3 GB eMMC storage to host customer SW applications 2× SIM with cover, eSIM ready.
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Product
OSM Size-L Module With NXP® I.MX8M Plus Series
OSM-IMX8MP
Computer on Module
The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
Single Board Computers
PX1-C441
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WINSYSTEMS’ PX1-C441 single board computer (SBC) is a PC/104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel Apollo Lake-I Dual-core or Quad-core SOC processors for processing graphics. It includes up to 8 GB of soldered down LPDDR4 system memory and a non-removable eMMC device for solid-state storage of an operating system (OS) and applications. In addition, the board supports M.2 and SATA devices.
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Product
SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK400 (Analyzer for UHS-II)
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SGDK400 is a UHS-II dedicated analyzer.
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Product
Robust Din-rail Fanless Embedded System With RISC-based (iMX-287) Processor 4 COM, 2 CAN Bus And DIO
rBOX610
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The rBOX610 din-rail fanless embedded system utilizes the low power RISC-based module (iMX-287) processor and is designed to withstand temperatures ranging from -40°C to +70°C for using in extreme operating environment and industrial automation applications. The rBOX610 box PC features 4 RS-232/422/485 serial ports, dual LANs, 4 digital input channels,4 digital output channels, 2 CAN bus and 1 eMMC onboard 4 GB & 1 x SDHC socket for storage expansion (easy to access) in a compact, IP40 protected, industrial-strength robust case. Two power paths input minimize the risk of data loss in the event of a single power failure. Its vertical din-rail form factor makes it easy to install the system in a small cabinet. Due to the RISC-based architecture, rBOX610 will not generate a lot of heat while being operated. The ready-to-run rBOX610 is specially designed for remote control/monitoring management applications like unmanned control room, industrial machine, automatic parking lot, traffic cabinet and more.
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Product
4G Router
ICR-2734A01-S1
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ICR-2700-S1, EMEA, 2× Ethernet, USB, Metal, EU Accessories LTE Cat.4 with 3G/2G fallback. Security based on IEC 62443-4-2 level 1, 1.3 GB eMMC storage to host customer SW applications 2× SIM with cover, eSIM ready.
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Product
Zynq Ultrascale+ MPSoC (ZU19/17/11EG) 3U-VPX Plug-in Module
iW-RainboW-G35V®
FPGA Module
AMD Xilinx’s ZU19/17/11EG Zynq Ultrascale+ MPSoC64bit, 8GB PS DDR4 RAM with ECC (Upgradable)Dual 64 bit, 8GB PL DDR4 RAM (Upgradable)8GB eMMC Flash (Upgradable)3U VPX Connectors based on ANSI/VITA 46.30 (P0+P1A & P1B+P2A)8 Optical transceivers through MT Ferrule Connector (P2B) based on VITA66.4
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Product
SOM Module
TEO820-ZU3EG
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784EZU3EG (optional ZU5EV) 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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Product
4G Router
ICR-2734PA02
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ICR-2700, EMEA, 2× ETH, USB, Plastic, UK Power Supply LTE Cat.4 with 3G/2G fallback. 1.3 GB eMMC storage to host customer SW applications 2× SIM with cover, eSIM ready.
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Product
4G Router
ICR-2834G
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ICR-2800, EMEA, 2x Ethernet, 2× RS232/RS485, USB, GPS, Metal, Without Accessories LTE Cat.4 with 3G/2G fallback. GNSS receiver, 1.3 GB eMMC storage to host customer SW applications 2× SIM with cover, eSIM ready.
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Product
4G Router
ICR-2734WPA01
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ICR-2700, EMEA, 2x Ethernet, USB, Wi-Fi, Plastic, EU Accessories LTE Cat.4 with 3G/2G fallback. 1.3 GB eMMC storage to host customer SW applications 2× SIM with cover, eSIM ready.
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Product
4G Router
ICR-2734W
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ICR-2700, EMEA, 2x Ethernet, USB, Wi-Fi, Metal, Without Accessories LTE Cat.4 with 3G/2G fallback. 1.3 GB eMMC storage to host customer SW applications 2× SIM with cover, eSIM ready.
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Product
SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK320A (SD Host Tester)
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SGDK320A (SD Host Tester) is a product that has the functions of SD emulator (SD Emulator), host tester (Host Tester), SD analyzer (SD Analyzer), and eMMC analyzer (eMMC Analyzer). Supports SD Memory Card Physical Layer Specification Version 3.01. It covers the test contents of Test Specification Ver3.00 and Supplement Note. Supports SDR104 and eMMC ver4.41 (analyzer).
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
SOM Module
TEO820-ZU4EV
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784EZU4, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)
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Product
Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO 2-in/2-out (Sink Type) And 2 PCIe Mini Card Slots
IRU131-SI
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*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*1 isolated COM port*1 isolated DIO 2-in/2-out (Sink Type)*Power input range of 9V to 48V DC with terminal block*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports OPC UA
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Product
Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, 1 COM, 1 LAN, DIO (4-in/4-out) And Optional CANbus
Agent200-FL-DC
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*RISC-based (i.MX 6UltraLite) processor 528 MHz*256MB DDR3 SDRAM onboard*4GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi or 3G/4G)*4 digital inputs and 4 digital outputs*Power input range of 9V to 48V DC with terminal block*Embedded Linux (Yocto) operating system*Fanless and compact design*Wide operating temperature range from -40°C to +70°C
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Product
RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s) And 2 PCIe Mini Card Slots
IRU152
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The IRU152 is powered by the low-power NXP i.MX 6 UltraLite processer. It can withstand an extended operating temperature range of -40°C to +70°C and up to 2G of vibration for operating in harsh environments. Furthermore, it supports NI LabVIEW to allow users to design graphical user interfaces for their measurement applications quickly and efficiently. In order to provide data collection and device control, the IRU152 comes with various I/O connectors, including four analog input (AI) channels, one isolated RS-232/422/485 port, one isolated LAN and one isolated DIO (2-in/2-out). The four analog input channels have differential input configuration and overvoltage protection of 55V DC. The maximum sampling rate of IRU152 is up to 250 kS/s with a 16-bit resolution for low-speed high-resolution sensor monitoring and signal measurements. Apart from the abovementioned features, the IRU152 comes in two PCI Express Mini Card slots and one SIM card slot for Wi-Fi, 3G/4G and LoRa connections. The DIN-rail embedded system is equipped with onboard 512MB DDR3 SDRAM; besides, they have an 8GB eMMC flash memory. The extremely low power industrial IoT gateway has passed the Heavy Industrial certification and FCC part 15 to ensure the excellent quality and highly reliable performance.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
Computer on Module
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
EMBEDDED MMC (EMMC)
SD 3.0 / eMMC 4.51 IP Family
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The eMMC Host IP is an RTL design in Verilog that implements an MMC / eMMC host controller in an ASIC or FPGA. The core includes RTL code, test scripts and a test environment for full simulation verifications. The Arasan MMC / eMMC Host IP Core has been widely used in different MMC applications by major semiconductor vendors with proven silicon.
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Product
4G Router
ICR-2734
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ICR-2700, EMEA, 2× ETH, USB, Metal, No ACC LTE Cat.4 with 3G/2G fallback. 1.3 GB eMMC storage to host customer SW applications 2× SIM with cover, eSIM ready.
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Product
4G Router
ICR-2734WP
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ICR-2700, EMEA, 2x Ethernet, USB, Wi-Fi, Plastic, Without Accessories LTE Cat.4 with 3G/2G fallback. 1.3 GB eMMC storage to host customer SW applications 2× SIM with cover, eSIM ready.
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Product
Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s, 0 - 20mA, ±20mA) And 2 PCIe Mini Card Slots
IRU152-I
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*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*4 isolated analog input channels (16-bit, 250 kS/s, 0 - *20mA, ±20mA)*1 isolated COM port*1 isolated DIO (2-in/2-out)*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports LabVIEW versions later than 2016*Supports OPC UA
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Product
QSeven
ROM-7510
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*TI Sitara AM5728 Dual core cortex-A15 1.5GHz high performance processor*Onboard DDR3 memory 2 GB and eMMC Flash 8 GB*Support 1 LVDS, 1 HDMI, 1 USB2.0 OTG, 4 USB2.0 HOST, 1 USB3.0,2 UART, 1 CAN, 1 SATA, 2 I2C, 1 I2S, 2 PCIE 1 lane,*Operating temperature 0 ~ 60 °C / -40 ~ 85 °C*Supports Linux Yocto
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Product
COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
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The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
