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Precision Picoprobe™ Micropositioner Probe Holder Kit
PHD-3001A
High Power Pulse Instruments GmbH
*Pulse force and pulse sense fixed pitch and flexible pitch RF probing solution for TLP/VF-TLP/HMM on-wafer measurements using Picoprobe™ Model 10*High peak current capability 80 A (100 ns)*DC – typ. 7 GHz bandwidth*Isolated probe-head ground shield for high pulse sense common mode signal rejection*Including fixed pitch replacement probe tip 50 Ω, right, 100 µm pad pitch*Including fixed pitch replacement probe tip 5 kΩ, left, 100 µm pad pitch*Including flexible pitch clamps plus 10-5k(0502)-125-W-1 and 10-50/30-125-W-1 replacement probe tips*True coaxial high-resolution 80:1 rotary probe-head for accurate probe tip adjustment
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Inline Micropositioner
SP-150
Signatone's most stable and precise micropositioner for sub-micron probing.
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TLP Probe Arm Kit
TPA-95
High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
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Micropositioner
Our broad range of micropositioners fill requirements for probing for different measurement applications as well as measurement environments. For example, a measurement system focused on cryogenic environments would not use the same product for room temperature probing. Likewise, a DC micropositioner is unfit for mmW measurement applications.
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Solid Tungsten Probe Tips
ST Series
The ST SERIESof probe tips, available from GGB Industries, Inc., are precision crafted from a 0.020 inch (0.51mm) diameter solid tungsten shaft that is electrochemically sharpened to a specified point. These durable, 1.5 inch long solid tungsten shaft probe tips are for use in most standard micropositioners when probing an integrated circuit, pad, or line. A variety of radius point sizes from 0.5 microns to 10 microns are available to accommodate any probing need.
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Micropositioner
XYZ 500 MIMT
Quarter Research and Development
Submicron manipulator and translation stage. The XYZ-500-MIMT Micropositioner is intended for precise probing and instrumentation for industrial, medical, biological, semiconductor, and general scientific applications. It provides 3-axis motion with .500" movement on each axis. Motion is controlled by three precision stepping motors attached to precision gear heads 64:1 (standard), that drive a 100 threads per inch screw (standard).
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Tungsten Probe Tips
T-4 Series
T-4 tips are for use in most standard commercial micropositioners for probing integrated circuits, pads, or lines. Each T-4 tip uses the same 10, 22, 35, 60, or 125 micron diameter tungsten wire as our Model 12C Picoprobe, but is mounted to a 0.020 inch diameter, 2 inch long tinned copper shaft.
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Micropositioner
MP-40
Engineered for highly demanding probing needs, the Korima Model MP-40 Micropositioner is precision-built for micropositioning to meet ever smaller industry standards. Featuring linear motion on all three axes, the MP-40 provides precise control for sub-micron probing.
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Compact TLP/VF-TLP/HMM Probearm Set for Temperature Measurements
PHD-4001A
High Power Pulse Instruments GmbH
*Electrically isolated probearm kit for VF-TLP, TLP, HMM, HBM force and sense probingbased on the GGB Picoprobe Model 10 replacement probe tips*Buried coaxial cable channel for thermo-chuck in isolated chamber temperature measurements*Compatible with GGB Picoprobe Model 10 replacement probetips*Compatible with all standard micropositioner interfaces*High precision rotation of the probearm by backlash-free 80:1 gear*Rugged stainless steel design*SMA connectors
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Micropositioner
MP-80
Engineered for highly demanding probing needs, the Korima Model MP-80 Micropositioner is precision-built for micropositioning to meet ever smaller industry standards. Featuring linear motion on all three axes, the MP-80 provides precise control for sub-micron probing.
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Micropositioner
S-725
Primarily used for probing targets that are approximately 0.5 mil (12.7 microns) and larger, with 80 TPI resolution.
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Probing Machines
Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Robotic Probing of Circuit Cards
System provides reliable automatic access to test points on a printed circuit under test providing rapid and accurate diagnostic measurements. Accomplished by an automated test probe with video image capability, under control of application software running on a VXI Test System utilizing LabVIEW. A VXI Prober Interface Module (VPIM), developed to Plug and Play standards, provides interface between prober and VXI Test System.
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Stack Probing Sensor
L722
The Model L722 Stack Probing Sensor coupled with the L612 Digital Recording Moisture Meter makes it easy to reach deep into stickered units of lumber and take accurate moisture readings without the danger of broken pins. Wagner''s electromagnetic wave technology makes it possible to take multiple readings throughout an entire stack in just minutes.
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Probing Solutions
High Power Pulse Instruments GmbH
Probing Solutions and Probe Arms by HPPI GmbH
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Auxiliary Equipment For Probing Machines
We have a lineup of products that support the probing process.
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Micropositioner
MM-6
The MM-6 micropositioner is light weight, accurate, compact device designed to eliminate many research and design problems, especially in the case of space limitations. Hardened steel precision pre-loaded ball bearing slides and high resolution thumbscrew movement assure smooth motion, precision, and excellent load bearing capacity.
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Probing Adaptors
Accessories primarily enable the connection between an industry standard logic analyzer footprint (D-Max, Mictor, P6860, etc) and an instrument probe. For example, a connection between a D-Max footprint and the digital channels of an MSO (Mixes Signal Oscilloscope). They can also enable the interconnect of a probe to a different industry standard footprint. Adding flying leads to a probe designed for a mictor footprint and a probe tester are also some of the accessories that are available.
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Topside Probing for Functional Test Fixtures
Circuit Check matches top side test targets to your specification and needs. The Signature Series pneumatic drive fixture is the industry standard for precision, accuracy and repeatability.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Probing, Monitoring & Setting
Marposs offers solutions and equipment that make your machine tool an instrument of unprecedented precision, productivity and reliability. Touch probes and laser-based tool setters hold the cutting process accuracy in check. Our balancing actuators and many dedicated sensors guarantee that your machine tool's functional processes never deviate from their specified set points.
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Topside Probing In-Circuit Test Fixtures
Circuit Check matches top side test targets to your specification and needs. The Signature Series pneumatic drive fixture is the industry standard for precision, accuracy and repeatability.Today’s fifth generation Pneumatic drive supports as many as 8,000 test probes with centerline spacing to 25mil, and contacting test pads as small as 0.014″.
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Vacuum Probing Systems
Built using our PS4L patented technology, SemiProbe manufactures a family of Vacuum Probing Systems, which test wafers or substrates in a vacuum environment. Additionally, individual die and broken/partial wafers can be tested with the Vacuum Probing System. All key modules are interchangeable and upgradeable.
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CMM Contact Measurement (Probing)
A method of collecting single points relative to each other in small or large volumes. This information can then be used for evaluation, inspection, layout or basic geometric reverse engineering. For capturing localized or small volume information, digitizing or articulating arms are ideal. For larger volumetric projects, optical solutions like laser trackers and photogrammetry CMMs perform best.
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Probing & Analysis Adapters
No matter how well designed a circuit is, there is almost always a need to hook up test instruments to it to verify function, look for bugs, or baseline performance. As IC packages become smaller and pin counts grow this becomes harder and harder. probing adapters are required to alleviate this de-bug problem. Many different types of adapters fall into the test and debug category. The common feature is that they bring the signals of an IC out to a format that is easy to interface with test and analysis equipment.
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Magnetic Probing Systems
MPS-C-300 and MPS-C-350
MicroXact’s truly unique patent-pending design enables wafer-level testing of spintronic devices, nanoscale electronics and many other materials and devices where magnetic fields are required for accurate test and measurement.
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Portable Manual Probing Station
Model W4.0 x L6.5
This portable manual probing station is designed for a versatile, comfortable, and accurate operation on up to 4.0” wafers or 4.0” X 6.5” printed circuit board assemblies. This turn-key, manually operated probing station, model W4.0 x L6.5, is part of the D-COAX commitment to the test and measurement and PCB fabrication industries.
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Probing Solutions
ES62X-CMPS
The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
