PCB Inspection
The check and evaulation of Printed Circuit Boards.
See Also: Visual Inspection, Bed of Nails, Flying Probes, AOI, Burn-In, Automated Optical Inspection
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Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type C, Ø1.50mm, 305gf
K100-C150305-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style C, Tip Diameter Ø1.50mm, Spring force 305gf, Steel with Gold Plating.
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Product
Signal Module, Receiver, QuadraPaddle, 192 Position, Right Angle Contacts For Custom PCB Mounting (510 150 130 And 510 109 315)
510150152
Receiver Module
This kit has everything you need to attach a VPC Receiver Module to a custom designed PCB. This includes the right angle header (P/N 510 109 315) and the Receiver Module (P/N 510 150 130).
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Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type A, Ø0.80mm, 155gf
K100-A080155-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style A, Tip Diameter Ø0.80mm, Spring force 155gf, Steel with Gold Plating.
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Product
Design, Manufacture & Test of Complex RF/Microwave Printed Circuit Boards (PCBs)
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Teledyne Labtech specialises in the design, manufacture and test of complex RF/Microwave printed circuit boards (PCBs). - Technology driven – we innovate- Turnkey - one stop for manufacture, assembly & test- Focused – technical design support for RF/microwave and large format PCBs
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Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type I, Ø1.26mm, 155gf
K100-I126155-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style I, Tip Diameter Ø1.26mm, Spring force 155gf, Steel with Gold Plating.
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Product
Reel to Reel Non-Contact OS Inspection System for TAB/COD/TCP/TBGA
TRV
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*Most suitable mechanism for non-contact inspection*Sprochet-less transfer decreases products damage.*Easy operation by Fixture alignment mechanism*Equipped with Tracing Test function
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Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type K, Ø1.50mm, 230gf
K100-K150230-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style K, Tip Diameter Ø1.50mm, Spring force 230gf, Steel with Gold Plating.
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Product
*Micro-fluoroscopic X-ray Inspection System
Cath-X
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The Cath-X is a bench top system employing Glenbrook’s micro-fluoroscopy technology providing highly detailed x-ray video of the critical components of the needle device. The transparent, safely shielded, view chamber permits the operator to locate the critical areas of the needle for inspection. The x-ray image can be further magnified using the electro-optical zoom feature of the Cath-X.
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Product
X5 Pipeline X-Ray Inspection
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Designed to be integrated into the production line and available with product pipes in 2.5 and 3 ", the X5 pipeline is perfect for a wide range of pumped products such as poultry, meat, slurries and sauces. The system is capable of offering good detection levels on a wide range of contaminants including all metal, bone, glass, dense plastics.
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Product
3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Product
DMX Analyzer PCB
DLA-PCB
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DLA-PCB - Dual Input DMX 512 LCD Analyzer / Tester PCB Design your own enclosure with an analyzer / tester display or add to your existing equipment or system. The DLA-PCB is a 16 x 2 DMX512 / DMX LCD back lit data analyzer display unit. The DLA-PCB displays any of the 512 channels and shows the numeric levels currently on those channels in either
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Product
04 With Pins For PCB | 3 Wafers | 12 Positions
04-3xx4-20/70-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
TO-CAN Package Inspection System
7925
System
Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30 um like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.
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Product
Analytical Gear Inspection Machine for Workpieces Up to Ø 6,000 mm
KNM X series
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machine structure with outstanding intrinsic accuracylarge bearing distances of guidesinherently stable granite machine base on active dampers to absorb vibrations ? no foundation requireddrive system close to center of gravitylinear motors in X-, Y-, Z- measuring axeshigh precision air- or hydrostatic bearing rotary tables (diameters from 500 to 1,800 mm) with direct drive and through holemotorized positioning of measuring column (V-axis) to the actual workpiece diameterlaser based system for safe operation
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Product
MPI PCB Probe Systems
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MPI Advanced Semiconductor Test
Every MPI manual probe systems can be configured with a variety of different holders for printed circuit boards (PCB’s) in order to provide in addition to on-wafer, versatile, convenient, and accurate Signal Integrity (SI) measurements with single-ended or differential RF probes. Measuring signals at the end of the channel for eye-patterns, deterministic jitter, distortion, TDR (Time Domain Reflectometry) impedance, cross-talk, coupling, and losses, or even S-parameters is easily accomplished.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Prototype PCBS Printed Circuit Boards
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Prototype printed circuit boards are manufactured for a variety of reasons; often it is important to manufacture these circuit boards to perform various tests before going through with a full PCB production run. When it comes to prototype PCB boards it’s important to get them made using high quality standards.
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Product
Optical BGA Inspection
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Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Product
X-Ray Inspection
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X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type Q, Ø0.80mm, 155gf
K100-Q080155-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style Q, Tip Diameter Ø0.80mm, Spring force 155gf, Steel with Gold Plating.
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Product
Digital Automated Interferometer and Microscope for Surface Inspection
DAISI-V3
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The ultimate production interferometer for measuring end-face geometry on single-fiber connectors, equipped with a revolutionary «no-exterior-moving-parts» mechanical design.
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Product
Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Product
Turnkey NDT Corrosion Inspection Services
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Robot-enabled ultrasonic inspection that produces thickness grid maps to identify areas where corrosion and other damage mechanisms have caused wall-thinning.
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Product
Connector, 104-Pin D-Type Male, PCB Mount, Right Angle, 4-40 UNC
40-963-104-RM
D-Sub PCB-Mount Connector
This 104-pin male D-type connector allows users to create their own connection solutions. Right angled PCB mounting - supplied with 4-40 UNC screwlocks. This connector is not suitable for direct connection to Pickering modules that use the 104-pin D-type connector.
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Product
Module, Receiver, RTCASS, Signal, 210 Position Right Angle PCB Mount
510113144
Receiver Module
Module, Receiver, RTCASS, Signal, 210 Position Right Angle PCB Mount.
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Product
Cleanliness Inspection System / Microscope
CIX90
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The OLYMPUS CIX90 technical cleanliness inspection system is a dedicated, turnkey solution for manufacturers who maintain high quality standards for the cleanliness of manufactured components. The OLYMPUS CIX90 system makes it easy to quickly acquire, process, and document technical cleanliness inspection data to comply with international standards. The system is intuitively designed to guide users through each step of the process so that even novice inspectors can acquire important cleanliness data quickly and easily.
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Product
X-ray Inspection System
JewelBox-90T/100T/110T™
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All JewelBoxes deliver precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and image distortion prevalent in other systems.
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Product
Property Inspection Solution
DJI / IMGING
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Advanced DJI drone solutions for the P&C Insurance industry. IMGING™ to conduct full roof and property inspections with incredible detail in as little as ten minutes from start to finish, and they’re getting high-resolution, actionable data they can use to make informed decisions. By combining Insurance-focused workflows and patents-pending autonomous flight control technology, IMGING is making roof inspections safer, quicker, and more consistent. It’s deceptively simple, amazingly powerful, and built specifically for Insurance.
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Product
Building Inspection System with Moisture Hygrometer & MSX® IR Camera
FLIR MR277
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The MR277 is the first FLIR building inspection system to combine the advantages of Infrared Guided Measurement (IGM) and our patented Multi-Spectral Dynamic Imaging (MSX) with advanced environmental sensors to help you quickly locate, clearly identify, and easily document problems. IGM technology and a laser pointer isolate the area where you can use the integrated pinless moisture sensor for non-invasive readings or external pin probe for invasive measurements. With automatically calculated environmental readings and a field-replaceable humidity/temperature sensor, the MR277 lets you finish the job and minimize downtime. Connect to external devices with METERLiNK® and use FLIR Tools® to enhance troubleshooting and reports.
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Product
3D Solder Paste Inspection (SPI)
TR7007 SII
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Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
