Multichamber Plasma CVD & RIE Processing Systems

Multichamber Plasma CVD & RIE Processing Systems

Accurate linear wafer transporter with low particulate generation.
Automated options with programmable controls.
Safety interlocked with local and global interfaces.
Base pressures to 10-8 torr.
Optional clean room load lock entry port.
Option for inductively coupled plasma processing is available.
Complete and ready to operate.

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