Package Inspection Products
Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
-
Product
Ultrasonic Flaw Detector
ECHO
-
The ECHO scanning acoustic microscope is a nondestructive ultrasonic flaw detector designed to simplify testing, increase yield and maximize productivity in the lab or on the production floor.
-
Product
ECHO VS System with Image Enhancement
Echo VS
-
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
-
Product
Ultrasonic Transducers
-
Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations.
-
Product
Software Options
-
Sonix offers powerful microscopy analysis software to enhance packaged semiconductor imaging, accelerate production and adapt systems based on the ECHO platform to customer-specific requirements.
