Veeco Instruments Inc
Provides metrology and process equipment systems for industry leaders in the semiconductor, data storage, telecom/wireless and scientific/research markets.
- (516) 677-0200
- 1 Terminal Drive
Plainview, NY 11803
United States of America
-
Product
Low Temperature Gas Source
-
Get a low-cost means to introduce a gas without thermal pre-cracking using Veeco’s low-temperature gas source for molecular beam epitaxy (MBE) systems. The source features a large conductance tube for fast gas switching and a diffuser end plate for good growth uniformity. It is an ideal gas injector for CBr4 for carbon doping in GaAs and NH3 for GaN growth, as well as any other gases that do not require thermal pre-cracking. Enhance system capabilities further by combining the source on one mounting flange with an Atomic Hydrogen Source or 5cc Dopant Source.
-
Product
Deposition Systems
-
When a thin film requires the most stringent structural or compositional properties consistently across every layer, Veeco’s Ion Beam Deposition (IBD) technology is often the answer. Using a focused beam of ions to sputter material from a target, this physical vapor deposition technique builds dense, uniform films with standout adhesion and stability.
-
Product
ALD Advantages
-
Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
-
Product
MOCVD Systems
-
For growing high-quality compound semiconductor films, few techniques match the precision of Metal-Organic Chemical Vapor Deposition (MOCVD). They give engineers tight control over film composition and thickness, making them essential for optoelectronics and advanced power transistors.
-
Product
Sputtering Systems
-
Known for precision and cleanliness, Veeco Ion Beam Sputtering (IBS) systems are ideal when engineers need tight control over film thickness, composition, and optical performance. Using a focused ion beam, IBS dislodges atoms from a target, depositing them onto a surface in smooth, ultra-uniform layers.
-
Product
Dopant
-
In semiconductor manufacturing, electrical performance starts with atomic-level control. Dopant technologies make that possible by introducing carefully measured doping constituents that help devices conduct, switch and perform reliably. For precise control of fluxes for Molecular Beam Epitaxy (MBE) dopant constituents, or for gases that do not require thermal cracking, Veeco’s Dopant products are ideal.
-
Product
Atomic Layer Deposition Systems
-
Atomic Layer Deposition (ALD) is a powerful way to build ultra-thin, super-precise coatings, one atomic layer at a time. It’s especially useful and efficient when working with tiny, complex 3D structures, making it a go-to technique in advanced semiconductor manufacturing.
-
Product
Gridded DC Ion Sources
-
Ion-assisted processes like sputtering, etching, and surface treatment depend on a beam that’s stable, uniform, and tightly controlled. Gridded DC ion sources make that happen, giving engineers the precision they need to fine-tune ion energy and current density for reliable results.
-
Product
Laser Processing Systems
-
Veeco delivers revolutionary Low-Cost-of-Ownership, HVM production-proven thermal annealing solutions at the most advanced technology nodes. Making a Material Difference with Leading Laser Spike Annealing Technology
-
Product
Corrosive Series Valved Cracker
-
With the superior flux control of the Corrosive Series Valved Cracker, complex structures not possible with conventional thermally controlled sources can be achieved. Mixed Group V layers of varying compositions can be grown without the frequent recalibration procedures necessary when using standard sources. SIMS analysis of a continuously graded GaAs1-xSbx layer demonstrates the excellent flux control available when using two Group V valved crackers, with identical results achieved at two different growth rates.
-
Product
High Temperature
-
When low vapor pressure materials demand more heat to transform, Veeco’s high-temperature MBE sources step in. Built for thermal extremes, they power the kinds of reactions and structural changes that unlock next-level device performance.
-
Product
Wet Processing Systems
-
Surface preparation using sustainable practices is critical to ensuring the reliability of your advanced microelectronics destined for automotive applications, medical devices, 5G and cloud storage.
-
Product
5cc Dual Dopant Source
-
Attain precise and stable control of relatively low fluxes for dopant constituents in molecular beam epitaxy (MBE) through this compact dopant source. Its small thermal mass gives it excellent responsiveness, reproducibility, and stabilization for advanced doping profiles, plus consistent flux uniformity across an entire platen. Efficient cell heating minimizes thermal load.
-
Product
ALD Periodic Table
-
The ALD Periodic Table is a visual guide to the elemental building blocks of atomic layer deposition. Organized by both chemistry and purpose, it helps engineers quickly find materials that meet their priorities, whether that’s conductivity, durability, clarity or thermal stability.
-
Product
Downward-Looking SUMO Source For Gallium And Indium
-
Attain large capacity, excellent flux uniformity, negligible shutter flux transients, and minimal depletion effects with Veeco’s Downward-Looking SUMO® Source for MBE. It combines a dual filament source with an asymmetric SUMO crucible featuring a narrow offset orifice and tapered exit cone with hot-lip heating. Result: excellent material quality, low defect counts, and good thickness uniformity. NOTE: This source is not for use with aluminum.
