Failure
See Also: Destructive
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Failure Analysis
Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Benchmark, Competitive and Failure Analysis
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Failure and Technology Analysis
Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Diagnostic Test System™
The original Teseda system for bench-top stimulus, test pattern debug, validation, device failure mode stimulation in-situ with other Failure Analysis lab equipment such as an EMMI, etc.
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Circuit Breaker Endurance Test System
Endurance testing involves operating – closing and opening – the circuit breaker repeatedly for a set number of cycles. This test is necessary to stabilize the circuit breaker mechanism and to identify “Early Infant Mortality” failures in the switchgear assembly.
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Leak Tester
AD-1690
Are you sure your pipettes are all accurate? Most pipette failures happen due to soiled or damaged parts compromising the airtightness of the pipettes. With the AD-1690 leak tester, you can instantly spot the pipettes that need to be fixed.
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Combined Map Display Unit & Interface Unit Tester (COMED)
MS 1117
This system is used to test COMED (Combined Map Electronic Display) IFU cards. This ATE checks the LRU Status and card status and identify faulty component in the individual UUT. On fault, this suggests the possible component failure as diagnostic report, for repairing the cards.
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Solar PV Testing Services
Atlas Material Testing Solutions
Can your product stand up to the harshest environmental conditions? Atlas Testing Services can provide manufacturers with the data they need to demonstrate long-term durability and to support warranty and performance claims while reducing the costs associated with aftermarket product failure.
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Connector Testing
If your product uses a connector or terminal, it can be susceptible to a unique set of failures that warrant specific connector testing conditions to determine the robustness of your design.
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SilverCreek SNMP Tests
Set up in less than five minutes - Windows or LinuxCustomize tests via Wizards, Script Generators, and moreAutomate operation with unambiguous test resultsIntegrate with other test harnesses and test toolsIncludes conformance, compliance, vulnerability, robustness, stress, and performance testingInvestigate failures and quickly resolve them with powerful diagnostic and analysis tools
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Smoke Detection Sensor – 120VAC Wire-In with Battery Backup
ENVIROMUX-SDS-120V
For warning of smoke and invisible fire particles. Ionization smoke detector. Applications from 40°F to 100°F (4°C to 38°C). Front loading battery door. 9V battery backup (included) in case of power failure. One button design for easy testing and HUSH mode activation control. LED indicates four modes of operation: standby condition, alarm condition, alarm memory and hush mode. Hush mode: silences false alarms for 8 minutes, or low battery warning for 13 hours. Voltage supply: 120VAC. Pre-stripped wiring harness with tinned strands. Audio alarm: 85dB at 10ft. Dimensions: 5" diameter x 1.75" depth. Dust cover prevents false alarms. Tamper resist feature. Links with up to 24 devices. Max distance between first and last device: 1000ft (305m). Alarm memory indicates initiating alarm in interconnected systems. Use compatible relay (ENVIROMUX-RLY-SDS120V) for connection to the ENVIROMUX system or other auxiliary warning devices such as external sirens or stairwell lighting. ENVIROMUX-RLY-SDS120V includes normally open and normally closed contacts. Contact ratings: 10A at 120VAC, 5A at 30VDC. Regulatory approvals: UL.
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DGN Advanced Reporting Feature, GTE 10.00p
K8223B
The Basic Diagnostics levels is the main troubleshooting tool used by all users to check the hardware configuration, and verify and isolate hardware failures. Some Diagnostic tests require that a Pin Verification Fixture be installed on the system.
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Combined Environmental Reliability Test System
VTC SERIES
HALT/HASS testing challenges the design, components, sub-assemblies and final assemblies of today's manufactured products. Stresses are applied through a number of conditions to set operational limits and ultimately precipitate failure in the HALT/HASS test environment. Rapid thermal change rate is one of the classic conditions that facilitate product stress.VTC Series chambers are equipped with an LN2 cooling system, with modulating valve and directed air flow to the product, provides the rapid thermal change rates required to achieve maximum product stress. Additionally, these rates are accomplished with smaller space requirements, lower audible noise, no water requirement, and lower maintenance costs than a typical refrigeration system.
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Fatigue Crack Growth Testing Module
Resistance to fatigue, ageing and crack growth are major issues for rubber like materials. Current commercial methods for crack growth testing have been restricted to time to failure test.
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Materials And Chemical Analysis
Anderson Materials Evaluation, Inc.
Materials characterization, failure analysis, quality control, and materials and process development services are offered. Our analytical techniques allow us to assess elemental and chemical material composition, thermal properties, coating thickness, electrochemical properties, surface chemistry, surface wetting, corrosion rates and pitting potentials, contamination and degradation problems, metallography, fractography, phase transitions, static coefficient of friction, adhesive bonding strength and causes of adhesive bonding failures, surface tension and surface energy, tensile and compressive strength, bend deflection, lapshear strength, elasticity properties, UV and visible light absorption and reflection, density and porosity, and many other material properties integral to improving your products.
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Robust Din-rail Fanless Embedded System With RISC-based (iMX-287) Processor 4 COM, 2 CAN Bus And DIO
rBOX610
The rBOX610 din-rail fanless embedded system utilizes the low power RISC-based module (iMX-287) processor and is designed to withstand temperatures ranging from -40°C to +70°C for using in extreme operating environment and industrial automation applications. The rBOX610 box PC features 4 RS-232/422/485 serial ports, dual LANs, 4 digital input channels,4 digital output channels, 2 CAN bus and 1 eMMC onboard 4 GB & 1 x SDHC socket for storage expansion (easy to access) in a compact, IP40 protected, industrial-strength robust case. Two power paths input minimize the risk of data loss in the event of a single power failure. Its vertical din-rail form factor makes it easy to install the system in a small cabinet. Due to the RISC-based architecture, rBOX610 will not generate a lot of heat while being operated. The ready-to-run rBOX610 is specially designed for remote control/monitoring management applications like unmanned control room, industrial machine, automatic parking lot, traffic cabinet and more.
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Regenerative Battery Pack Test System
17020E
Charge/discharge modes (CC, CV, CP)Power Range: 10kW / 20kW per channelVoltage Range: 60V/ 100VCurrent Range: 100A/200A/300A/400A/ 500A/600A/700A/800A per channelRegenerative battery energy discharge, efficiency 85%Channels paralleled for higher currentsDriving cycle simulationFast current conversion without current interruptHigh precision measurementSmooth current without over shootTest data analysis functionData recovery protection (after power failure)Independent protection of multi-channel
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Digital Microscope
VHX-6000 Series
Next-generation optical microscope with a large depth-of-field and advanced measurement capabilities for inspection and failure analysis.
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ISDD Tool Suite
eXpress provides an environment for the design, input, integration, assessment and optimisation of system diagnostics as well as Prognostic Health Management (PHM), system testability studies, failure modes and effects analysis and analysis of system dependability.
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Drug Stability Test Chamber
Sanwood Environmental Chambers Co ., Ltd.
If you want find complete details about Integrated drug stability test chamber, Drug stability test chamber, Chemical drug stability test chamber, New designed integrated drug chamber, Good quality integrated drug test chamber - China Sanwood Environmental Chambers Co., Ltd. The scientific method to create a drug for a long time to failure evaluation of stable temperature, humidity and light environment for pharmaceutical enterprises to accelerate drug test, long-term test, high humidity and strong light test, is the best choice for pharmaceutical companies and drug stability test program.
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Automated Bondtester
4600
The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.
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Debugger
Most cores for the embedded market provide access to on-chip debug features via a debug port. TRACE32 tools connect to this to control the core, access the data being processed by the core and provide developers with debugging over the embedded device: start, stop, step control; reading and writing memory and registers; setting breakpoints; tracking values of variables and so on. This means developers can diagnose software failures and memory corruption issues and correct the system to make it perform as expected.
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Environmental Stress Screening (ESS) Chamber
ESS
Developed to help electronics manufacturers detect product defects and production flaws, Environmental Stress Screening (ESS) forces infancy product failures that would otherwise occur after final assembly and product delivery. ESS’s goal is to improve profitability by eliminating defective products. ESS Systems can meet individual performance needs, product loading, and throughput requirements. Thermotron has the experience to provide the best solution for ESS testing at your company.
