QFN

Depth-controlled Wiping Contact. Accurate, Tightly-controlled Package Fit. Optional Grounded Case Contacts. ClamShell Socket Design ...more

The 3120 is the pick&place logic test handler. Capable of handling various type of package. Such as QFP, QFN, TSOP, BGA, £gBGA and CSP etc. The machine thermally conditions the device under test ransed from ambient to 125℃ with a conduction type thermal control.and it supports single, dual and Quad parallelism ...more

The MCT Tapestry SC is a second-generation strip test handler that provides increased performance and greater flexibility at lower cost.  ...more

At KYEC's Final Test we perform 100% electrical testing as per customers parameters / test program with dedicated changeover kits for a wide range of IC packages. Capability at Final Test includes small packages to high pin count and covers the following form factors: PDIP, PLCC, full SOIC range ? SOP, TSOP, TSSOP, MSOP, QFP, LQFP, TQFP, QFN , ...more

The QFN/MLF 3-in-1 Adapter System ensures quick and easy configuring and interfacing to an in-circuit emulator, device programmer, logic analyzer or oscilloscope. The first of its kind, this 3-in-1 system provides the solution for test and design engineers needing QFN (Quad Flat Non-leaded) or MLF (Micro Lead Frame) signal access. This system ...more

The QFN/MLF 3-in-1 Adapter System ensures quick and easy configuring and interfacing to an in-circuit emulator, device programmer, logic analyzer or oscilloscope. The first of its kind, this 3-in-1 system provides the solution for test and design engineers needing QFN (Quad Flat Non-leaded) or MLF (Micro Lead Frame) signal access. This system ...more

The QFN/MLF 3-in-1 Adapter System ensures quick and easy configuring and interfacing to an in-circuit emulator, device programmer, logic analyzer or oscilloscope. The first of its kind, this 3-in-1 system provides the solution for test and design engineers needing QFN (Quad Flat Non-leaded) or MLF (Micro Lead Frame) signal access. This system ...more

Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options ...more

Aetrium Model 8832 IC Test Handlers are well suited for high production volumes of small surface mount devices using bulk vibratory bowl feed input. Device kits are available for SOT23, SOT89, SOT 223, SC59, SC70, SC75, MLF, QFN, D-PAK, TO, Chip Scale and other packages. ...more

Aetrium?s Model V8 IC Test Handlers are ideally suited for quad- or dual-site high-volume production handling of small devices using tube or magazine input and output media. The small footprint handler is capable of handling a wide variety of packages including SOIC, SSOP, TSOP, TSSOP, MSOP, QSOP and many other new leadless QFN packages. ...more

Automolding System. 100 tons toggle press (options for 60/80/140 tons). Multi-leadframe capability (2-8). Vacuum molding capability. 3P / 1P molding capability .Wedge mold for BGA. Cleaning roller for QFN molding. Pretape before molding / Detape after molding. Inline capability . Front access. Advanced molding technology. ...more

High throughput with sorting capability, Tapeless and Tape Models. Clamp plates for sub 3 x 3mm cutting. QFN deburring capability . BGA & QFN vision check. Output options : tube, tape & reel, JEDEC tray, canister . Tape sorter model TS3. ...more

Aetrium?s Model 55V6 IC Test Handlers are ideally suited for high volume production handling of small devices using tube input and tube output media. The small footprint handler is capable of handling a wide variety of packages including SOIC, SSOP, TSOP, TSSOP, MSOP, QSOP, Chip Scale and many other new leadless QFN packages. ...more

Aetrium Model 5800 IC small footprint Test Handlers are well suited for production volumes of small surface mount devices using bulk vibratory bowl feed. Device kits are available for SOT23, SOT89, SOT223, SC59, SC70, SC75, MLF, QFN, Chip Scale and other packages. ...more

Gryphics High Performance Test sockets and Test Contactors; are designed for peripherally padded packages with integrated paddles that require, seamless electrical and mechanical transition from the laboratory to the test floor.  ...more

Pin Counter : 10QFN ~ 89QFN Frequency : 2.5GHz~ ...more

Pin Counter : 10QFN ~ 89QFN Frequency : 2.5GHz~ ...more

The Delta EDGE is a x1 to x16 site, ambient to +155° pick-and-place handler for tray-based packages. Its standard package size range is 3mm x 3mm up to 40mm x 40mm and includes BGA, QFP and QFN. The large soak area enables the EDGE to maintain peak processing speed (up to 6,000 UPH) at elevated temperatures. ...more

The UA5M15MP is a two-stage pHEMT amplifier MMIC in a Pb-free leadless plastic QFN package. The IC features a positive gain slope that offsets package loss, resulting in a SMT part with excellent gain flatness across a broad bandwidth. ...more

The Orion can handle CSP, BGA, QFN, and other devices on laminated/molded panels or strips, as well as devices in lead frames, including TSOP, TSSOP, SOIC, MSOP, and SOT. The Orion functions as a standalone system or can be linked for in-line integration with other back-end processes. ...more

RF Sockets made with Redundant Contact technology are designed to accommodate a variety of applications and package types. Ardent contactors are designed for high-performance over extended cycles for QFN/MLF/QFP and other package types. Our unique contact-element system allows for a wide variety of tip geometries for ball/pin or pad contact re ...more