Showing results: 16 - 28 of 28 items found.
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TLP-4010C -
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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TLP-8010C -
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Combines TLP-8010A and TLP-4010C into one system*Can be operated together with TLP-8012A5 and TLP-3011C pulse width extenders*Ultra fast 50 Ω high voltage pulse output with typical rise time 100 ps (0-40 A) and 300 ps (> 40 A)*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω configuration*High pulse output current up to ±80 A (short circuit) with minimum 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns (0-40 A), 1 built-in pulse width: 100 ns (> 40 A)*The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0-40 A)*Optional external pulse width extensions from 5 ns to 500 ns (> 40…80 A) using the external pulse width extender TLP-8012A5*Built-in pulse reflection suppression*Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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TLP-12012A6 -
High Power Pulse Instruments GmbH
- Pulse width extender for the high current TLP/HMM test system TLP-12010A and TLP-12010C- 6 manual selectable pulse width: 5, 10, 50, 100, 200 and 500 ns- High pulse output current up to ±120 A- High performance and high quality components
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TLP-8012A5 -
High Power Pulse Instruments GmbH
*Pulse width extender for the high current TLP/HMM test system TLP-8010A and TLP-8010C*6 manual selectable pulse width: 5, 10, 50, 100, 200 and 500 ns*High pulse output current up to ±80 A*High performance and high quality components
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PHD-4001A -
High Power Pulse Instruments GmbH
*Electrically isolated probearm kit for VF-TLP, TLP, HMM, HBM force and sense probingbased on the GGB Picoprobe Model 10 replacement probe tips*Buried coaxial cable channel for thermo-chuck in isolated chamber temperature measurements*Compatible with GGB Picoprobe Model 10 replacement probetips*Compatible with all standard micropositioner interfaces*High precision rotation of the probearm by backlash-free 80:1 gear*Rugged stainless steel design*SMA connectors
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Rohde & Schwarz GmbH & Co. KG
The R&S®RTO2000,; R&S®RTO6 and R&S®RTP; oscilloscopes support triggering and decoding of PCI Express Gen 1.1 and 2.0 signals. In addition, the R&S®RTP supports Gen 3.0 signals. Users can set up decoding in seconds via the intuitive menu dialogs. For detailed analysis, results can be viewed as color-coded telegrams and/or in a table. Errors and other protocol-specific fields, such as TLP and OS are identified efficiently using the oscilloscopes' protocol trigger.
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ES62X-CMPS -
ESDEMC Technology LLC
The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
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PurePulse -
Grund Technical Solutions, Inc.
PurePulse is a flexible and efficient ESD tester for HBM, TLP, MM and HMM. Its 2-pin style setup reduces tester parasitics, it captures waveform data and can be automated to test thousands of pins without the need for a test fixture. Our PurePulse system was designed from the ground up to be customized to meet your testing needs, take a look at the features below and schedule a demo with us to learn more.
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ESDdoctor -
Sofics
ESDdoctor consulting service can identify, diagnose, and solve any ESD/EOS problem quickly and definitively, at a surprisingly low entry cost. You can choose testing and diagnosis only, or add ESD design services to the consulting package. ESD, Latch-up testing: HBM (ANSI/ESDA and JEDEC) on packaged dies. MM (ANSI/ESDA and JEDEC) on packaged dies. Latch-up JEDEC on packaged dies TLP on packaged and bare dies.VF-TLP on bare dies.
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Evans Analytical Group®
EAG is an industry leader in ESD testing (Electrostatic Discharge) and Latch up testing. Our highly experienced engineering team use their industry leading knowledge and years or real world experience of the latest semiconductor technologies, circuit design, and device physics to optimize our customer's ESD and latch-up results. Human Body Model (HBM) and Machine Model (MM), Charged Device Model (CDM), Latch-up, Transmission Line Pulse (TLP).
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ESDEMC Technology LLC
Pulsed IV-Curve Test and Analysis System is our new development for 2015. It is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, vf-TLP, HMM, HBM, EFT, and LV-Surge. It will monitor the transient voltage and current waveform during the pulse in ps or ns segment, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc) of the device under test (DUT), such as protection devices, semiconductors, circuit modules, touch panel sensor, etc.
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HBM-TS10-A -
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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HBM-S1-B -
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) 2-pin tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*Optionally available upgrade for all HPPI TLP-3010C, 4010C, 8010A, and 8010C hardware systems and software (upgrade on request)*Suppression of trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT voltage and DUT current sensor for real time voltage and current monitoring*Integrated DC test DUT switchIntegrated hardware 50 Ω trigger output for high speed digital oscilloscopesIntegrated overvoltage protection of voltage sense and DC test interfaces for oscilloscope and SMU protection during high voltage HBM testing*Fast and efficient HBM measurements including transient waveform data management using the HPPI TLP software*Compact size 145 mm x 82.5 mm x 44 mm
