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Showing results: 3106 - 3120 of 3178 items found.

  • Digital Module For Remote I/O

    NI

    Digital Modules for Remote I/O provide 24 V digital inputs or outputs and offer 1‐, 2‐, 3‐, and 4‐wire spring terminal connection options. You can use inputs as counters or standard digital inputs, and you can adjust filter time to improve measurement quality. Inputs can include a built‐in power supply for sensors. Output modules feature circuit and overload protection and can drive up to 500 mA per channel, up to 8 A per module.A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Digital Module for Remote I/O from a NI real‐time controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.

  • Microwave Wideband Externally Modulated Transmitters (without RF Amp)

    MT80 (30KHz~40GHz) - Hangzhou Huatai Optic Tech. Co., Ltd.

    MT80 series microwave optical transmitter, adopts external modulation technique, are able to transmit 40GHz microwave RF signal with long distance, wide bandwidth, and flat responsibility. They provide an outstanding linearity fiber optical communication for analogue and digital wideband microwave application. Due to avoidance of using expensive coaxial cable or wave guide, there will be no limitation in transmission distance, which improves the signal quality and reliability of the microwave communication. They can be widely applied in microwave communication system such as remote wireless; timing and reference signal distribution, telemetry, measurement and delay line etc as well as 10Gb/s and 40Gb/s high speed communication system. MT80 adopts low noise, narrow linewidth CW DFB laser as light source; LiNbO3 external modulator as signal modulation, no laser chirp, low dispersion distortion, high extinction ratio, Full-transparency operation mode. It can be applied in long distance and extra-long distance transmission after EDFA.

  • Microwave Wideband Externally Modulated Transmitters

    MT82 (30KHz~40GHz) - Hangzhou Huatai Optic Tech. Co., Ltd.

    MT82 series microwave optical transmitter, adopts external modulation technique, are able to transmit 40GHz microwave RF signal with long distance, wide bandwidth, and flat responsibility. They provide an outstanding linearity fiber optical communication for analogue and digital wideband microwave application. Due to avoidance of using expensive coaxial cable or wave guide, there will be no limitation in transmission distance, which improves the signal quality and reliability of the microwave communication. They can be widely applied in microwave communication system such as remote wireless; timing and reference signal distribution, telemetry, measurement and delay line etc as well as 10Gb/s and 40Gb/s high speed communication system. MT82 adopts low noise, narrow linewidth CW DFB laser as light source; LiNbO3 external modulator as signal modulation, no laser chirp, low dispersion distortion, high extinction ratio, Full-transparency operation mode. It can be applied in long distance and extra-long distance transmission after EDFA.

  • Sensor

    VL53L1 - Pure Engineering, llc

    The VL53L1 is a state-of-art Time-of-Flight (ToF) laser-ranging miniature sensor. Housed in a miniature and reflowable package, it integrates a SPAD (Single Photon Avalanche Diodes) array, physical infrared filters and optics to achieve the best ranging performance in various ambient lighting conditions, with range of cover glass options.Unlike conventional IR sensors, VL53L1 uses ST’s latest generation direct ToF technology which allows absolute distance measurement whatever the target color and reflectance. It provides accurate ranging up to 4m and can work at fast speed (60Hz), which makes it the fastest miniature ToF sensor on the market.With patented algorithms and ingenious module construction, VL53L1 is also able to detect different objects within the Field-of-View with depth information (histogram) at 60Hz. Scene browsing and multi-zone detection is now possible with VL53L1, thanks to software customizable detection array for quicker “touch-to-focus” or mini depth-map use cases.

  • 8-CH 14-bit 100 MS/s High-Speed PXI Express Digitizer

    PXIe-9848 - ADLINK Technology Inc.

    The ADLINK PXIe-9848/9848H is an 8-channel, 14-bit, 100 MS/s digitizer delivering both high-accuracy measurement results and high-dynamic performance. With a PXI Express bus interface and ample onboard acquisition memory up to 512 MB, the PXIe-9848/9848H can easily manage simultaneous 8-CH data streaming. High density and high speed digitizer features ideally position the PXIe-9848/9848H for applications such as LIDAR, radar signal acquisition, and PSU (Power Supply Unit) testing applications.The PXIe-9848 provides a flexible set of input ranges from ±0.2V to ±2V, software selectable 50Ω or 1MΩ input impedance, a wide variety of triggering options and tight synchronization capability, all maximizing convenience of use. In addition, ADLINK provides the PXIe-9848H, features a x15/x50 signal condition module providing both high input voltage range of ±100V and high dynamic performance, delivering the optimum solution to measurement range expansion in a PXI system.

  • 5KVA to 100KVA Industrial UPS (3Ø – 1Ø)

    NSP Series 5KVA to 100KVA - Aplab Limited

    - Designed for powering critical Industrial and IT systems- DSP controlled IGBT based PWM technology- Design topology enables N+1 parallel redundancy- Industrial grade high speed CAN bus communication- User Friendly Matrix LCD and LED mimic front control and digital monitoring- Fully rated make before break maintenance bypass operation- Optional break-less load transfer via static switch- Low harmonic distortion- High crest factor tolerance and dynamic stability- Lower TCO- Continuous full rated power at ambient as high as 45°C- N+1 Parallel operation of UPS without any common hardware- Advanced Communication Capability (RS485/Modbus/SNMP)- High branch fuse clearing capacity- On-line battery bank test without load disconnection- Compact, elegant, and light weight enclosure- Easy installation with wheels for maneuverability and front bottom terminals

  • 20KVA to 200KVA Industrial UPS (3Ø – 3Ø)

    NSP Series 20KVA to 200KVA - Aplab Limited

    - Designed for powering critical Industrial and IT systems- DSP controlled IGBT based PWM technology- Design topology enables N+1 parallel redundancy- Industrial grade high speed CAN bus communication- User Friendly Matrix LCD and LED mimic front control and digital monitoring- Fully rated make before break maintenance bypass operation- Optional break-less load transfer via static switch- Low harmonic distortion- High crest factor tolerance and dynamic stability- Lower TCO- Continuous full rated power at ambient as high as 45°C- N+1 Parallel operation of UPS without any common hardware- Advanced Communication Capability (RS485/Modbus/SNMP)- High branch fuse clearing capacity- On-line battery bank test without load disconnection- Compact, elegant, and light weight enclosure- Easy installation with wheels for maneuverability and front bottom terminals

  • PXI Based Multifunction Measurement and ICT Instrument

    PXI-501 - Konrad Technologies GmbH

    The PXI-501 is a multifunction measurement instrument for functional and in-circuit measurements.It combines two parametric measurement units with a digital voltmeter, a high voltage current source and a discharge unit. This powerful combination makes it the ideal instrument for classical analog in-circuit test and manufacturing defect analysis with additional functional test capabilities.With it’s fast sampling rate of up to 4MSps it speeds up measurements and is capable of measuring and generating AC signals up to 100kHz.To enhance the PXI-501 capabilities it can be combined with an ABex TM-501 or an ABex TM-404. The ABex TM-501 enhances the in and output range of the PXI-501. Furthermore, it provides a shunt current measurement upgrade. In combination with the ABex TM-404 it’s a complete in-circuit test solution with 86 channels in one ABex slot. For sure it can be upgraded to 2838 test points in one rack by simply adding additional matrix modules.With the above-mentioned terminal modules, the PXI-501 is able to act as a ABex system controller, so that no additional controller is required in the cassis.

  • PXIe-5841, 6 GHz, 1 GHz Bandwidth, RF PXI Vector Signal Transceiver

    785832-01 - NI

    6 GHz, 1 GHz Bandwidth, RF PXI Vector Signal Transceiver - The PXIe-5841 is a vector signal transceiver (VST) with 1 GHz of instantaneous bandwidth. It combines vector signal generator, vector signal analyzer and high-speed serial interface capabilities with FPGA-based real-time signal processing and control. The PXIe-5841 features the flexibility of a software defined radio architecture with RF instrument class performance. This VST delivers the fast measurement speed and small form factor of a production test box with the flexibility and high performance of R&D-grade box instruments. The PXIe-5841 is available with an optional high-performance local oscillator module for improved phase noise, measurement time, and EVM performance. You can use the VST to test a variety of cellular and wireless standards such as Wi-Fi 6 and 5G NR. In addition, you can expand the small, two slot 2U PXI Express form factor to support multiple input, multiple output (MIMO) configurations.

  • PXIe-5841, 6 GHz, 1 GHz Bandwidth, RF PXI Vector Signal Transceiver

    786982-01 - NI

    6 GHz, 1 GHz Bandwidth, RF PXI Vector Signal Transceiver - The PXIe-5841 is a vector signal transceiver (VST) with 1 GHz of instantaneous bandwidth. It combines vector signal generator, vector signal analyzer and high-speed serial interface capabilities with FPGA-based real-time signal processing and control. The PXIe-5841 features the flexibility of a software defined radio architecture with RF instrument class performance. This VST delivers the fast measurement speed and small form factor of a production test box with the flexibility and high performance of R&D-grade box instruments. The PXIe-5841 is available with an optional high-performance local oscillator module for improved phase noise, measurement time, and EVM performance. You can use the VST to test a variety of cellular and wireless standards such as Wi-Fi 6 and 5G NR. In addition, you can expand the small, two slot 2U PXI Express form factor to support multiple input, multiple output (MIMO) configurations.

  • Copy Tools

    DemiYG1020 - YEC Co. LTD

    Supports SATA 6Gbps. ATA storage is supported by using optional products sold separately.Ultra high speed data transfer at 37GB (*1) per minute.(*1 Theoretical value. Varies according to performance of connected devices.)Execution logs can be immediately saved to USB memory connected to the main unit.Deletion reports can be created based on saved logs. *2(*2 Host program sold separately is required to create deletion reports.)Rugged built-in evidence preservation functions including hash value generation (MD5, SHA1, and SHA256), DD image creation and E01 creation.Deletion function conforms to various standardsSupports NSA (National Security Agency) recommended, DoD (Department of Defense) conforming, U.S. military and NCSC systems.Enables deletion operation report creation by using optional terminal software (sold separately).Built-in deletion function and quick diagnosis functionDeletion report can be created using host software (sold separately).

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6313 - Advantech Co. Ltd.

    The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.

  • 3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

    MIC-6330 - Advantech Co. Ltd.

    Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.

  • 2U Rackmount Network Appliance Platform With Dual LGA3647 Socket Intel® Xeon® Scalable Processors, Intel® C621 (Purley) And Up To 66 LAN

    NA860 - Axiomtek Co., Ltd.

    The NA860 offers a perfect mixture of performance, flexibility, and durability with server-class dual LGA3647 socket Intel® Xeon® Scalable processors and Intel® C621 chipset (codename: Purley). It is robust and highly reliable for use in a wide range of network applications such as SDN, NGFW, IDS, IPS, UTM, etc. Designed with flexibility in mind, the 2U rackmount network computing system is capable of managing numerous connected computers through an integration of up to eight expandable NIC modules which support a maximum of 66 LAN ports. These NIC modules feature support for copper, fiber, bypass, 1G/10G/40G Ethernet speeds, and hardware acceleration. The NA860 comes with twelve high-capacity DDR4-2400 R-DIMM slots with up to 384GB non-buffer non-ECC/ECC memory. Moreover, there are two hot-swappable 2.5-inch SATA HDD trays, one mSATA slot and one optional 3.5-inch SATA HDD tray for sufficient storage. Two PCIe x8 expansion slots are available for add-in cards.

  • BGA SMT Adapters

    Giga-snaP™ - Ironwood Electronics

    Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.

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