Showing results: 1 - 15 of 19 items found.
-
TR7007 -
Test Research, Inc.
The TR7007 ultra-high-speed 3D Solder Paste Inspection adopts the Fringe Pattern Technology and dual light source, can solve the shadow and reflection problem simultaneously. It is equipped with a linear motor and linear scale that provides a highly accurate X-Y Table system.
-
3D SPI -
Jet Technology Co., Ltd.
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
-
S3088 SPI -
Viscom AG
*Precise control of all essential 3D features; calibration-free.*Extremely high throughput due to FastFlow Handling.*Integrated height tracking. *Viscom Quality Uplink: process optimization and first-pass yield increase.*Simple process analysis with the Viscom Uplink Analyzer.*Fast program generation. *Print optimization through interlinkage with printer (closed loop).
-
LaserVision SP3D Mini -
ASC International, Inc.
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
-
KY8030-3 -
Koh Young Technology
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
-
aSPIre 3 -
Koh Young Technology
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
-
PI Series -
Vi Technology
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
-
TR7007 SII -
Test Research, Inc.
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
-
VisionPro HSi -
ASC International, Inc.
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
-
LineMaster FUSion -
ASC International, Inc.
The LineMaster FUSion is ASC International''''s inline offering for high speed solder paste inspection. Focusing on a solution for those manufacturers seeking a lower cost alternative to more expensive inline systems, the LineMaster FUSion provides the needed speed and capabilities required to meet the increasing demands of the screen printing process.
-
TROI 7700 SERIES -
Pemtron Co., Ltd
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
-
3Si Series -
Saki Corporation
Saki's 3D SPI identifies critical defects and assists with process improvement.
-
YSi-SP -
Yamaha Motor IM
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
-
SIGMA Link -
Vi Technology
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
-
SE Series -
ASC International, Inc.
The CyberOptics SE Series offers the most accurate and repeatable, high speed 3D solder paste inspection in the market today. Utilizing the most advanced sensing technology, CyberOptics SPI products will provide manufacturers the reliability needed to compliment your overall screen print process improvement strategy.
