Showing results: 421 - 435 of 691 items found.
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HPX1S -
Manncorp
Produce high-quality semiconductor chips in your manufacturing facility with our HPX1S Die Attach Machine. This die bonding machine is great for high-accuracy, low-volume, die attach manufacturing needs. Customization options are also available for unique applications. It is equipped with 3 sets of CCD cameras and a bottom camera to help with component alignment. Easily and accurately handle die sizes from 1.4 x 1.4 mm to 7 x 7 mm.
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NileCAM30_USB -
e-con Systems Inc.
NileCAM30_USB is the four board solution containing the camera module, serializer, deserializer and USB base board. This camera is based on AR0330 CMOS image sensor from ON Semiconductor®, with USB 3.1 Gen 1 interface. The NileCAM30_USB comes with 15 meters coaxial cable with FAKRA connector at both ends of serializer/deserializer board. The NileCAM30_USB has an S-mount (M12) lens holder which allows customers to choose and use the lens according to their application requirement.
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E-CAM50_CUNX -
e-con Systems Inc.
e-CAM50_CUNX is a 5.0 MP MIPI CSI-2 fixed focus color camera for NVIDIA® Jetson Xavier™ NX/NVIDIA® Jetson Nano™ developer Kit. This camera is based on 1/2.5" AR0521 CMOS Image sensor from ON Semiconductor® with built-in Image Signal Processor (ISP). This powerful ISP helps to brings out the best image quality from the sensor and making it ideal for next generation of AI devices.
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ARV -
Agnisys, Inc.
Register verification is a significant part of the design verification problem. It is one of the first aspects of the design that must be tested because the rest of the semiconductor functionality depends on the accuracy of the register implementation. That is because registers contain the configuration setting of the hardware and is the basis of the hardware / software interface. ARV helps to auto generate UVM test-bench bus agents, monitors, drivers, adaptors, predictors, sequencers and sequences helps user to complete the verification right at first time.
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MicroINSPECT 300FA -
Microtronic, Inc.
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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PDF Solutions
PDF Solutions Professional Services offerings cover every major project phase. Available for a specific phase of your project needing a custom solution, or an end-to-end implementation, PDF Solutions Professional Services produces results fast.Realize quicker ROI from your semiconductor test data investmentOffering a broad range of planning, education, design engineering, implementation and support, our team of highly trained semiconductor data integration engineers and analytics consultants can help you build your solution with confidence. These experts can assist your team with:Business Practices AssessmentsBest Practices ImplementationYield AnalysisProduct Characterization SetupSystem DeploymentSite PlanningFlow AnalysisCustom Parser Development
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AXI XS Series -
Nordson Corporation
The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applications range from component level inspection to mid-sized SMT boards.
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Hitachi, Ltd.
We supply a wide range of components and materials to the electronics industry, such as: integrated circuits for personal computers, semiconductor materials for system LSI, optical communication materials for telecommunications, components for display devices seen in smartphones and projectors, and materials used in solar cells and lithium batteries.
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AB Controls, Inc.
Our multidisciplinary approach allows us to create functional testers and automated test equipment for a variety of industries. AB Controls provides customized automated test equipment solutions for a wide range of products and instruments including: electronics, laser, electromechanical, optical, semiconductor and chemical.
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7500 -
Tokyo Electronics Trading Co., Ltd.
ESD test based on Human Body Model (HBM) and Machine Model (MM) is the most important reliability test among the Electro-static Discharge (ESD) test of the semiconductor device. Latch-up test, on the other hand, should not be omitted from the reliability test of the CMOS devices.
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7000 -
Tokyo Electronics Trading Co., Ltd.
ESD test based on Human Body Model (HBM) and Machine Model (MM) is the most important reliability test among the Electro-static Discharge (ESD) test of the semiconductor device. Latch-up test, on the other hand, should not be omitted from the reliability test of the CMOS devices.
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Bruker Corporation
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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ORTEC
Semiconductor based photon radiation detectors have been evolving for over half a century, with ORTEC pioneering commercial availability for a majority of that time. Initial offerings were based around lithium-drifted germanium Ge(Li) and lithium-drifted silicon Si(Li). Ge(Li) was later replaced with more advanced, high purity germanium (HPGe) detectors. ORTEC provides a comprehensive suite of HPGe radiation detector solutions covering an extensive range of energies and for a variety of applications.
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CA9812 -
UC Instruments, Corp.
The CA9812 O Band tunable laser integrates a widely tunable laser with a semiconductor optical amplifier (SOA). The tunable laser is electronically tuned and can address any wavelength from 1265.00 nm to 1365.00nm. The integrated SOA facilitates flexible control of the output power and acts as a shutter when reverse biased, enabling dark tuning between channels. The device is packaged into a standard module box package, with an ternal optical isolator and a polarization maintaining fiber output.
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SLIA-300 -
HORIBA, Ltd.
The ultra-pure water that is used in the semiconductor production processes can be further purified by using an ion-exchange resin. Capturing the silica that is dissolved from this ion-exchange resin as quickly as possible can control the ultra-pure water quality, which is important during the production processes.HORIBA Advanced Techno has developed and employed a new "long light path length measurement cell" to enable highly sensitive measurement of ultra-low density silica and also realized a compact desktop model to improve the usability.
