Showing results: 181 - 195 of 693 items found.
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5800 -
Ametek Process Instruments
The 5800 is ideal for high-purity gas production, semiconductor gases, and the production, storage and transmission of olefins. It is suitable for use in industries including hydrocarbon processing, industrial gas and semiconductors.
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Tokyo Seimitsu Co., Ltd.
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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KoCoS Messtechnik AG
Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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FT 1030 -
PhysTech GmbH
The Deep-Level Transient Spectroscopy has grown up to a most powerful tool for semiconductor characterization with unbeaten sensitivity in trap concentration detection and high efficiancy in impurity parameter determination.
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IntelliJet® -
Nordson Corporation
The IntelliJet® Jetting System with patented ReadiSet® Jet Cartridge delivers cutting-edge reliability and micro dot dispensing for manufacturing advanced semiconductor and mobile electronics packages
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Echo -
Onto Innovation
The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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DENKEN Co., Ltd.
External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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Electrogrip Company
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Test Tooling Solutions Group
Hand socket lid is normally used to run evaluation tests on semiconductor devices prior to High Volume Manufacturing mode. It can also be used as a trouble shooting tool at bench test.
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MOS Capacitance-Time Measurement and Analysis -
Materials Development Corporation
The Capacitance-Time transient resulting from an MOS device pulsed into deep depletion reveals important information about bulk properties of the semiconductor and about damage or contaminants introduced during processing.
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Alpes Lasers sa
are operating in the range from 1 to 5 THz. Coherent polarized THz radiation is generated as a result of direct stimulated optical transitions of electrons within the conduction band of a semiconductor heterostructure.
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Nidec-Read Corporation
MEMS Spring Probe is developed by NIDEC-READ original ultra-fine 3D processing technology and enables our customer to supply advanced and innovative test solutions at PCB & semiconductor testing market.
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IT-470F-H -
HORIBA, Ltd.
The IT-470F-H is a built-in type, non-contact infrared thermometer with industry-leading* accuracy. It contributes to improve process stabilization, for which requires high accuracy temperature measurement, such as semiconductor and FPD production.
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Tokyo Seimitsu Co., Ltd.
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Materials Analysis Technology Inc.
This technology is used to identify the electrical characteristics, such as resistance, capacitance and inductance, of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
