Showing results: 31 - 45 of 53 items found.
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Series S200, S300, S400, and S500 -
AlphaTest Corp.
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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681 -
Dwyer Instruments Inc.
The Series 681 Sanitary Pressure Transmitter is designed to meet 3A standards for applications in food, dairy, beverage and pharmaceutical processing, liquid level control, and sanitary pipelines. The unit is fully sealed to withstand high pressure washdown in Clean-in-Place (CIP) and Sterilize-in-Place (SIP) installations.
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Ascom Network Testing
Ascom IP-DECT combines Voice over IP with Digitally Enhanced Cordless Telephony (DECT) technology. Ascom IP-DECT a reliable wireless communication solution that offers enterprise-grade telephony, professional messaging, personal alarm, and positioning over secure dedicated frequency bands. It is developed based on open standards, such as SIP, which maximizes interoperability with leading vendors.
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CPCI-SIP-3 -
ALPHI Technology Corporation
The new CPCI-SIP-3Module provides a 3U high performance flexible I/Oscheme, that supports industry standard IndustryPacks. Choose from over a 100 different IndustryPacks from Alphi Tech and others. For applicationrequiring low cost, high density I/O or unique combinations, the CPCISIP-3 is the perfectsolution.
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CPCI-SIP-2 -
ALPHI Technology Corporation
The CPCI-SIP is a 3U format CompactPCI (CPCI) bus IP carrier. The CPCI-SIP-2 provides mechanical support and the electrical interfaces for two single width IP modules, or a double width IP module. Multiple CPCI-SIP-2 boards may be installed in a single system.
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CPCI-SIP-rp -
ALPHI Technology Corporation
The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution.The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
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27911 -
Parallax Inc.
The Gyroscope Module 3-Axis L3G4200D provides raw angular rate and temperature data measurements that are accessed from the selectable digital I2C or SPI interface. The small package design and SIP interface accompanied by the mounting hole make the sensor easy to integrate into your projects. Designed to be used with a variety of microcontrollers, the module has a large operating voltage window.
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TS-960e -
Marvin Test Solutions, Inc.
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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STMicroelectronics
Gate drivers, FETs and protection circuitry integrated into a single package to drive loads in industrial and home-appliance applications, with increased power density per cm². ST’s high-density power drivers are System in Package (SiP) solutions integrating in compact QFN packages the STDRIVE gate drivers and MOSFET-based power stages, responding to the industrial market trend towards higher levels of integration and lower development costs.
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1x9 BIDI Transceiver Modules -
Liverage Corp
The module supplies best solution of short-haul 20 km for fiber optical system and link distance. The module with the Differential PECL of 3.3 or 5 Voltage and provide the system designer with products to implement a range of ATM (Asynchronous Transfer Mode) and SONET for Telecommunication. The module was all supplied in the new industry standard 1x9 SIP package style with a Bi-directional BIDI SC ST or FC connector interface.
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Planet Technology Corp.
PLANET’s Home Automation product lines include home automation control gateway, IP intercoms and Z-Wave devices. Compliant with international standard protocols including Z-Wave Plus, Power over Ethernet, SIP 2.0 for Voice over IP and H.264 video codec for IP surveillance standards, PLANET’s home automation products create a safe and energy-efficient environment for modern homes and SMBs.
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Conductivity measurement -
Baumer Holdings AG
The ISL05x inductive conductivity sensor with internal temperature compensation enables precise and rapid measurements in many different applications in the pharmaceutical and food and beverage processing industry. Its reaction time is < 3 s and it is always excellent, even with very low conductivity and low levels of flow. It reliably prevents any traces being left of damaging CIP and SIP fluids, which in the worst case could get into the product.
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VQmon/EP -
Telchemy Incorporated
VQmon®/EP is the most widely deployed and trusted performance monitoring/analytics technology for desktop IP phones, residential gateways, mobile handsets and other VoIP/VoLTE endpoints. It monitors the quality of live calls in real time, providing listening and conversational quality QoE scores (MOS and R-factor) and detailed diagnostics as raw metrics, RTCP XR (RFC 3611) and SIP Voice Quality reports (RFC 6035)
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Atec, Inc.
Atec, Inc. has been designing and manufacturing instruments for energy exploration for over 50 years. We apply the same meticulous approach in providing failsafe equipment for downhole energy exploration as we do in our aerospace projects. Our corporate energy ancestry includes CATCO, SIP, Lymco Electronics, Kestran, Amtex Supply, Coastline Exploration, Coltex Drilling, and Atec Resources. Atec subsidiaries – Vital Link (Sealy, TX), Celtech (Carlsbad, NM), and Hager Machine & Tool (North Houston) – all bring extensive additional capabilities to our oil patch support operations.
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Tessolve Services Pvt. Ltd
Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.