Showing results: 16 - 30 of 36 items found.
-
Composite Family -
Test Electronics
High Strength, high temperature, semiconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.
-
Marantz Electronic Ltd.
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
-
Pickering Interfaces Ltd.
Pickering Electronics Surface Mount Reed Relays contain the highest quality instrumentation grade reed switches making them suitable for the most demanding applications and are suitable for infra-red or vapor phase reflow soldering.
-
KIC Thermal
A reflow oven or wave solder machine is capable of literally billions of alternative setups. Each combination of zone temperatures and conveyor speed will produce a unique profile for a processed product. KIC's software makes an exhaustive analysis of all the setups and it recommends the very best oven/machine recipe within seconds.
-
Machine Vision Products
All MVP products have the unique ability to be deployed in all inspection scenarios from Paste to Post Reflow without changing hardware, allowing maximum utilization of your investment. With Versa, Selecta, Spectra and GEM Platforms, MVP provides the AOI solutions to meet your production requirements.
-
Reltech Limited
Preconditioning is performed prior to package level reliability testing to simulate the effects of board assembly on non-hermetic devices where moisture may have been absorbed during normal storage. The subsequent exposure to high temperature during infra reflow assembly can cause internal damage such as “pop corning” and delamination.
-
OvenRIDER® NL 2* -
E.C.D.
Regardless of the recipe and what your oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANTLY different. Achieve convection reflow oven Verification by separating zonal temperatures from convective heat flow efficiency while verifying conveyor speed for a true picture of oven Lead-Free performance consistency.
-
Toray Engineering Co., Ltd.
Quality management for semiconductor manufacturing processes and liquid crystal panel manufacturing processes, which require nano-order precision. Oxygen analyzers used in firing furnaces and N2 reflow ovens.Water quality meters used to monitor the water quality of plant discharge and the pure water used in semiconductor manufacturing processes.Our measuring and analysis equipment is used in a wide range of fields.
-
Interface Analysis -
Akrometrix, llc
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
-
KIC K2 -
Manncorp
The latest-generation mobile-friendly profiling technologyThe KIC K2 Thermal Profiler features a compact and robust design that allows it to fit through the tight, heated chambers of lead-free reflow ovens. A plug-and-play hardware and graphical user interface makes profiling both quick and easy. The profile data measured by the K2 can now be viewed on either a PC or on a mobile device using the Profile Viewer App.
-
IPC/JEDEC J-STD-020D.1 -
National Technical Systems
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding package damage ”cracks and delamination” from the solder reflow process. This document describes the standardized Moisture Sensitivity Levels (MSL) of floor life exposure for moisture/reflow-sensitive SMD packages along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures. Companion documents J-STD-020D.1 and JEP113 define the classification procedure and the labeling requirements, respectively.
-
Metalic Family -
Test Electronics
Process carrier pallets to carry the circuit boards through pick-n-place, IR reflow, gold wire bonding, epoxy dot encapsulating, and final fuctional test. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets. Process carrier pallets can be designed to carry your circuit boards through assembly, wash and final test.
-
SP-Cap™ -
Panasonic Industrial Devices Sales Company of America
Panasonic’s industry leading SP-Cap™ Polymer Aluminum Capacitors, are Surface-Mount (SMT) Capacitors that utilize a conductive polymer as their electrolyte material in a layered aluminum design. SP-Cap Capacitors are primarily used as input and output Capacitors for DC/DC converters due to ultra-low ESR values, high voltage options and the ability to withstand high reflow temperatures. These Capacitors are free from temperature drifts, offering capacitance values up to 560µF and voltage values ranging from 2V to 25V.
-
Conductor Analysis Technologies, Inc
The OM Thermal Stress System is a cost-effective performance based reliability test methodology which performs convection reflow assembly simulation and air-to-air thermal cycling. The methodology is utilized by both the IPC PCQR and the IPC 6012-QLM programs. OM systems are available for sale or lease, and test services are provided from both CAT and our service partners.
-
EverythingPCB
We are known worldwide for the M.O.L.E. Temperature Profiler. The Mole is used in the Electronic, Paint, Food, and the Industrial marketplace. The Mole is a stand alone, 6 channel, temperature profiler that it is used in many harsh processes that require the temperature measuring instrument to be inside the heating chamber or "ride along" with the parts or process being measured over time such as Solder Reflow Ovens and Wave SolderMachines.