Showing results: 16 - 27 of 27 items found.
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FTPadv -
SENTECH Instruments GmbH.
The SE 500adv combines ellipsometry and reflectometry to eliminate the ambiguity of measuring layer thickness of transparent films. It extends the measureable thickness to 25 µm. Therefore the SE 500adv extends the capability of the standard laser ellipsometer SE 400adv especially for analyzing thicker films of dielectrics, organic materials, photoresists, silicon, and polysilicon.
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Fibotec Fiberoptics GmbH
Fibolocator is an innovative device for measuring and characterizing fractures and other defects in optical fibers that cause backscatter. Time-resolved correlation reflectometry is the principle on which the device is built. OTDR cw laser diodes are used. The test signal requirements and the complexity of the system are low, resulting in very low cost OEM subsystems.
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FilmTek 2000 PAR-SE -
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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FilmTek 3000 PAR-SE -
Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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FilmTek 6000 PAR-SE -
Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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Material Sensing & Instrumentation
MSI Time-Domain-Reflectometry (TDR) Concrete Cure Monitoring provides a new approach to cure monitoring in concrete and cementitious materials [1-7]. Using an ultrafast pulse and inexpensive capacitance sensor, our TDR system follows rotation of individual chemical states of water participating in the hydration reaction. The system monitors formation of bound-water hydration products, as well as unreacted free-water to form the hydrated state.
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MPI Advanced Semiconductor Test
Every MPI manual probe systems can be configured with a variety of different holders for printed circuit boards (PCB’s) in order to provide in addition to on-wafer, versatile, convenient, and accurate Signal Integrity (SI) measurements with single-ended or differential RF probes. Measuring signals at the end of the channel for eye-patterns, deterministic jitter, distortion, TDR (Time Domain Reflectometry) impedance, cross-talk, coupling, and losses, or even S-parameters is easily accomplished.
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2291 -
Georg Fischer Signet
The 2291 Guided Wave Radar level transmitter is designed for continuous level measuring of conductive or non-conductive liquids, pulps and solids. The 2291 level gauge operates based on the well-known TDR (Time Domain Reflectometry) principle. Micropulses are sent along a probe guide at the speed of light. As soon as the impulse reaches the surface of the medium, it is reflected back to the electronic module. Level distance is directly proportional to the flight time of the impulse.
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CARY-OT4000 -
UC Instruments, Corp.
The CA OPTRONICS CARY-OT4000 series portable optical time domain reflectometry (OTDR) is the latest FTTx optical fiber cable-based test instrument. It has light weight, elegant appearance, small size, easiness of installation and maintenance, high-capacity built-in battery. It provides multiple built-in test wavelengths and optical testing functions like visual fault locator (VFL). As a new product specially designed for FFTx network testing, it provides site technicians with the highest performance and upgrade services.
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Material Sensing & Instrumentation
MSI Time-Domain-Reflectometry (TDR) Composite Cure Monitoring [1-4] provides a new approach to cure monitoring of advanced polymer composites. Using a high-speed pulse and inexpensive microwave sensor, our TDR system follows rotation of a polar resin molecule, providing real-time information on viscosity and percent cure. Operating in the microwave frequency range, TDR Cure Monitoring provides an alternative between high-frequency fiber-optic methods and low-frequency dielectric methods, combining optical-style precision and miniaturization with electrode-based simplicity and robustness.
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Material Sensing & Instrumentation
MSI Time-Domain-Reflectometry (TDR) Structural-Health Monitoring probes the structural health of a composite part by propagating a fast electrical pulse along a distributed linear sensor which has been fabricated directly in the laminate. The sensor is formed from the native graphite fibers already used in composite manufacture, and constitutes zero defect. Fibers are patterned into a microwave waveguide geometry, or transmission line, and interrogated by a rapid pulse as shown below. Structural faults along the line cause distortions in waveguide geometry, producing reflected pulses similar to radar. Cracking, delamination, disbonds, moisture penetration, marcelling, and strain are all detected by propagation delay, for sensor lengths up to several meters.
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HORIBA, Ltd.
OES Spectrometers (Optical Emission Spectrometers for OEMs) optimized for SEMICON applications including plasma monitoring/end-point detection and reflectometry (with the addition of a flash lamp). The OES-Star features unmatched throughput and SNR, spectral coverage and < 1 nm resolution). Our new OES Family, OES-Star, VS70-MC and InVizU all include our latest “Multi-Communications interface” electronics (MC= EtherCAT, Ethernet, USB-2). The Invizu integrates both a linear CMOS sensor for UV-VIS and a TE-Cooled INGAAS sensor, which extends the spectral coverage to 1700 nm.
