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Metrology

field of measurement.

See Also: Measurement, Instrumentation, Coordinate Measuring Machines


Showing results: 271 - 277 of 277 items found.

  • HV Calibration

    B-1027 - ROSS ENGINEERING CORPORATION

    Ross Engineering Corporation’s High Voltage Calibration Lab provides high accuracy capability for conducting tough reliability tests on all our high voltage devices. In this facility we test and calibrate HV Relays, HV Dividers, HV Probes, Spark Gaps, our Fiber Optic Systems, and HV Digital Voltmeters up to 450kV. We provide our own in house test lab to ensure Ross products meet or exceed required safety standards as well as our own high standards of dependability, long life and quality. Our technicians use test equipment calibrated by or traceable to National Institute of Standards and Technology or other national metrology institute to provide the highest in testing accuracy.

  • Optical Coordinate Measuring System

    MaxSHOT 3D - Creaform Inc.

    Creaform’s MaxSHOT 3D lineup is a game changer for product development, manufacturing, quality control and inspection teams that need the highest measurement accuracy and repeatability as much for large‑scale projects than parts from 2 to 10 m. Imagine achieving accuracy better than 0.015mm/m! Thanks to its sophisticated user guidance technology and easy‑to‑use software, the MaxSHOT 3D is ideal for users of all levels—even non‑metrology experts—so that you gain peace of mind knowing your measurements are always right on the dot and you increase process efficiency. If you consistently work on large‑scale projects, the MaxSHOT 3D is your go-to solution to slash budget-busting measurement mistakes, improve product quality, increase process efficiency—and minimize overall operating costs.

  • Substrate Manufacturing

    KLA-Tencor Corp

    KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.

  • Microelectronics And Packaging AOI

    Machine Vision Products

    Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.

  • Packaging Manufacturing

    KLA-Tencor Corp

    KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.

  • Deep Ultraviolet Spectrophotometer System

    VUVAS-10X - McPherson, Inc.

    A new ultraviolet spectrophotometer system for optical metrology just arrived at NASA Goddard! The VUVAS-10X spectrophotometer works best in the 90 to 160 nanometer wavelength range, also known as deep or vacuum ultraviolet (VUV) region. It uses a windowless hydrogen plasma light source and differential pump section to reach many wavelengths beyond those of conventional deuterium lamps. The source also works with other gases, or gas mixtures, for atomic spectral line emission from about 30 nanometers (double ionized Helium gas) up to the Visible light range. The new spectrophotometer system, McPherson VUVAS-10X, uses a one-meter focal length high-resolution monochromator with the special light source, scintillated detector and Model 121 goniometric sample chamber. The system is ideal for optical transmission, absorbance and specular reflectance at incident angles up to 60 degrees. This McPherson spectrophotometer system will help develop, inspect and qualify optical materials and coatings used for very high altitude and extraterrestrial space flight missions.

  • Laser Tracker System

    Leica Absolute Tracker AT403 - Leica Geosystems AG

    New all-in-one large-volume laser tracker system that sets a new standard for portability, simplicity, robust construction and measurement efficiency. An all-in-one metrology solution more portable than any other on the market, the Leica Absolute Tracker AT403 from Hexagon Manufacturing Intelligence is a self-contained measurement workshop inside a compact and convenient single case. With outperforming measurement process speed, operational simplicity like no other laser tracker and an unmatched level of robust construction, the Leica Absolute Tracker AT403 is a calculated bundle of affordable innovation without equal on the portable measurement market. Improvements include faster and more economical stationary and continuous measurement processes, along with a streamlined station change procedure. Added WiFi access point functionality and hot-swappable batteries deliver unmatched measurement freedom. Designed for leading results in almost any imaginable measurement environment, it is rated for operation in temperatures ranging from -15 to 45 degrees Celsius and features built-in environmental monitoring, orient-to-gravity functionality and construction in line with the rigorous IP54 certification standard.

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